JPS62151335A - Laminated board and manufacture thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a laminate for electrically insulating boards, printed wiring boards, etc., and a method for manufacturing the same.

[Prior art 1] Laminated boards are widely used as electrical insulating boards, printed wiring boards, etc. based on their excellent electrical insulating performance. This laminate is manufactured by stacking multiple sheets of prepreg made by impregnating a base material such as paper with varnish (a thermosetting resin) and drying it, and then laminating the sheets by heating and pressurizing them. . Here, the electrical insulation performance of the laminate is greatly influenced by the resin impregnated into the base material, and is also greatly influenced by the base wood. Therefore, in addition to conventionally using paper as a base material, for laminates that particularly require high electrical insulation performance, plus cloth made of glass M&fiber woven fabric or non-woven fabric has been used as a base material. ing.

However, with the recent trend toward high-density packaging of electronic components, even higher electrical insulation performance has been required, and mica, or mica, has been developed as a base material that can satisfy such high electrical insulation performance. It is attracting attention for its use. However, since mica cannot be impregnated with a resin liquid by itself, it is conceivable to create and use a base material using mica as a filler. That is, mica is also provided in the form of scale-like minute flakes, and when mica is used as a base material, mica scales can be dispersed in paper pulp slurry and then made into paper. It is conceivable that by filling paper with mica, mica's high electrical insulating properties can improve the electrical insulating properties of the paper base material.

[Problems to be Solved by the Invention] However, although it is possible to improve the electrical insulation properties of the paper base material by filling paper with mica scales in this way, it is only possible to improve the electrical insulation properties of the paper base material. However, the improvement is still limited, and the electrical insulation performance of mica itself cannot be fully demonstrated.

Means for Solving Problem E] The present invention has been made for the purpose of solving the above problem, and the laminate according to the present invention is composed of a plurality of sheets formed by assembling mica scales. The mica paper is characterized in that it is laminated and bonded by curing a thermosetting resin impregnated into the mica paper, and the method for producing a laminate according to the present invention is characterized in that the mica paper is laminated and bonded by curing a thermosetting resin impregnated with the mica paper. A mica paper base material prepreg is created by impregnating the formed mica paper with a thermosetting resin liquid and drying, and a plurality of mica paper base material prepregs are stacked and molded under heat and pressure. It is.

In the present invention, by using mica paper made of mica scales as the base material of the laminate,
Making it possible to form a laminate with a 100% mica base material,
This allows the excellent electrical insulation performance of mica to be fully demonstrated.

The present invention will be explained in detail below.

As mica (mica), either natural mica or synthetic mica can be used, and the types and chemical compositions of mica are shown in Table 1, although they are not particularly limited. These materials can be used alone or in combination.

(Left below) Table 1, ' Muscovite K^1□ (^ISi, O,.) (O
H) 2 (muscovite) heaven paragonite NaA l 2 (^l5is
O+ 0)(OH)2(soda mica) 70 gopite KHg s (＾l5iJ+o)(
OHh (phlogopite) natural biotite K (Mg, Fe)z (^1sis
01゜) (OH)2 (biotite) Lepidolite KLiz^1 (Si, 0+.) (0
11) 2 Syria - 7 Ruoro 7 Oro KMgs(^1sisO,.)F
2-gopite (fluorine alloy phlogopite) Fluoro-tetra KMgzs (Si <O□.)F
2 Silicic Mystery (Silicon Mica West of Fufu Prefecture) Taenioite KM Li Si, 0. oF2 This Mai-Riki is used after being crushed into scales.
The particles are preferably adjusted to 50 mesh or less, preferably 100 mesh or less.

If the particle size exceeds 50 mesh, the surface of the mica vapor produced by aggregating mica scales may become rough.

Although mica paper 1 can be created by assembling mica scales without using an adhesive, it is also possible to create mica paper 1 by assembling mica scales by making an aqueous slurry of mica scales. can. ! Figure @3 shows an example of a paper-making device for producing mica paper 1. A vat 6 is supplied with a slurry 7 in which mica scales are dispersed in water, and this slurry 7 is passed through a circular screen 8. The mica scales are filtered through the surface of the round screen 8 and are then made into paper.
is transferred onto the surface of the endless strip of felt 10. In this way, as shown in FIG. 4, the paper-formed layer 9 is transferred and adhered to the surface of the felt 10, and the felt 10 is fed as it runs, and then the paper-formed layer 9 is peeled off from the felt 10 and pressed with a roll or the like. The mica paper 1 in which the paper-formed layer 9 of mica scales has been dried can be obtained by dehydration, further drying with a drier or the like, and then winding up.

Although FIG. 3 shows a circular net type papermaking apparatus, a circular net type paper making apparatus can also be used by replacing the bat 6 with a special homer and replacing the circular net 8 with a circular net.

Using the mica paper 1 obtained as described above as a base material, electrical insulating boards and printed wiring boards can be manufactured. Laminates can be manufactured. Mica paper 1 is used for manufacturing laminates.
First, a blib leg 2 made of mica paper base material is created. The prepreg 2 can be obtained by impregnating the mica bar 1 with a thermosetting resin liquid and drying it. Examples of the thermosetting resin liquid include epoxy resin, phenol resin, area resin, melamine resin, unsaturated polyester resin, and polyimide. A face of any thermosetting resin such as resin, bismaleimide/triazine resin, phenol/aralkyl resin, etc. can be used alone or in combination of two or more types. In order to impregnate the mica paper 1 with the thermosetting resin liquid, for example, the mica paper 1
A thermosetting resin liquid is applied to the surface of the mica paper 1 by brushing, spraying, screen printing, 7-row coating, or roll coating. This can be done by allowing the applied thermosetting resin liquid to permeate into the mica paper 1. In this way, the mica paper 1 impregnated with the thermosetting resin 8 {fat liquid is introduced into a drying chamber such as an oven, and the thermosetting resin impregnated in the mica vapor 1 is dried and semi-cured, and the mica vapor 1 is The prepreg 2 used as the base material can be obtained.

Next, as shown in Fig. 1 (.), the mica paper base material prepregs 2 thus formed are stacked in the desired number of sheets, and then set between hot platens and heated and pressed to perform lamination molding. The resin in the prepreg 2 is melted and hardened to obtain a laminate A in which a plurality of sheets of mica vapor 1 are laminated and bonded and integrated as shown in FIG. 1(b). This laminate A itself can be used as an electrically insulating board B. In addition, as shown in fJS2 figure (a), the mica paper base pre-reg 2 formed as described above is stacked in the desired number of sheets, and gold JIAM 3 such as copper foil or aluminum foil is stacked on the outermost layer surface of the pre-reg 2. By performing lamination molding by placing it between hot platens and applying heat and pressure, the resin in the prepreg 2 melts and hardens, and multiple sheets of mica paper 1 are stacked M! J'#: A printed wiring board B in which a member W3 is laminated and adhered to the surface of a laminated plate A as an integrated insulating substrate 11 can be obtained as shown in FIG. 2(b).

Since these boards A are formed using the mica barber 1 as a base material, they can have high electrical insulation properties. Moreover, the force has a scale plate-like form, and in the micababer 1, this force is assembled in a layered state.For this reason, the micababer 1 becomes in-plane isotropic, causing warpage and twisting after molding. It is possible to reduce warping and twisting in the laminate A and improve the dimensional stability. In addition, mica has low hardness, which makes post-processing of the laminate A easier. For example, when drilling through-holes, the heat generation can be kept to a small level, reducing the occurrence of smear, and making it possible to This can improve M reliability.

[Example] The present invention will be specifically explained using examples for dogs.

Mica scales (mastubite, particle size 20
A mica slurry is prepared by dispersing 2 kg of particles having a particle diameter of 10 to 150μ or less, and this slurry has a concentration of approximately 0.0%.
Dilute it to 2%, make a paper, and dry it using a dryer at 100°C to obtain a paper weight of 1206g/+
I created s2 mica paper. This mica paper was impregnated with the blended glue shown in Table 2 so that the resin content was 55%, and this was heated and dried at 120°C for 5 minutes to form a mica paper base prepreg with a thickness of 0 and 2111111. I got it.

After stacking 6 sheets of this mica paper base prepreg and pressing with touch pressure at 150℃ for 20 degrees, it weighs an additional 10 kg.
f/am2. It was pressed for 60 minutes at 150°C to obtain a laminate as an electrical insulating board.

Six sheets of the mica paper base prepreg obtained in Example 1 were stacked, and the outer surface of the outermost layer of the prepreg was coated with a # of 35μ thick plow. Layer the foil and press it with touch pressure.
After pressing at 50℃ for 20 minutes, further 10KBf/a
m2. Pressed at 150° C. for 60 minutes to obtain a double-sided copper-clad printed wiring board in which the laminate served as an insulating substrate.

” 1. Using kraft paper with a weight of 164 g/m2 as the base material,
This was impregnated with a resin face in the same manner as in Example 1 and dried to create a paper base prepreg with a thickness of 0.25 mm.

Layer 6 sheets of this paper base prepreg and touch pressure at 150°.
After pressing for C115 minutes, further 40Kgf/cII
12. Pressed at 150°C for 60 minutes to obtain a laminate as an electrical insulating board.

A slurry was prepared by dissolving 0.3 kg of soda in 1 ooo1 of K1 shimizu, adding 10 kg of kraft pulp, and further adding 15 kg of mica scales similar to Example 1. Diluted and made into paper,
By drying this using a dryer at 100° C., mica-containing paper having a weight of 195 g/+2 was prepared. In this mica-containing paper, the actual mica-containing paper ratio was 64%.

This mica-containing paper was impregnated with resin face in the same manner as in Example 1 and dried to a thickness of 0°2711If.
A mica-containing paper base prepreg of fl was created.

Six sheets of this mica-containing paper base prepreg were stacked and pressed at 150°C for 115 minutes using touch pressure, and then further heated at 40K.
gf/cva'' at 150°C for 60 minutes to obtain a laminate as an electrical insulating board.

8! obtained in the above Example 1, Conventional Example, and Comparative Example! Table 3 shows the results of measuring various properties of the laminate based on JIS C6481.

(Left below) (Gel time: 150°C, 9 minutes) The results in Table 3 show that in Example 1, which used mica paper as the base material, as seen in the volume resistivity and surface resistivity items, It is confirmed that the electrical insulation property is significantly improved compared to the conventional example using paper as the base material, and it is also confirmed that it is significantly improved when compared to the comparative example using the mica-containing paper base material. Furthermore, as can be seen in the dielectric constant and tan δ items related to high frequency characteristics, it is confirmed that the characteristics of Example 1 are improved over those of the comparative example and the conventional example. Furthermore, it is confirmed that Example 1 is superior to Comparative Examples and Conventional Examples in terms of water absorption. Furthermore, Example 2
Also, the characteristic values of Example 1 were almost the same as those of Example 1.

[Effects of the Invention] As described above, the laminate of the present invention has a plurality of mica papers formed by assembling mica scales, which are laminated and bonded by curing of a thermosetting resin impregnated into the mica paper. Therefore, by using mica paper made of mica scales as the base material of a laminate, it is possible to form a laminate with a 100% mica base material, fully demonstrating the excellent electrical insulation performance of mica. This makes it possible to obtain a laminate with a high temperature. In addition, the method for producing a laminate in the present invention involves impregnating mica paper formed by aggregation of mica scales with a thermosetting resin liquid and drying it to create a mica paper base material prepreg. Since this product is made by stacking multiple sheets of prepreg material and molding them under heat and pressure, the conventional method of manufacturing laminates, which involves creating prepreg from the base material and laminating and molding the prepregs, was used. It can be used as is to create a laminate, and a laminate that fully demonstrates the excellent electrical insulation performance of mica can be easily manufactured using conventional equipment as is.

[Brief explanation of drawings]

Fig. 1(,)(b) is a cross-sectional view showing the manufacture of a laminate as an electrical insulating board, and Fig. 2(a)(1)) is a sectional view of the laminate as a printed wiring board! i! ! FIG. 3 is a partial schematic diagram showing an example of an apparatus for manufacturing mica paper, and FIG. 4 is a sectional view of a state in which a paper layer is formed on felt. 1 is mica paper, 2 is prepreg, and 3 is metal foil. that's all

Claims (4)

[Claims] (1) A laminate, characterized in that a plurality of mica papers formed by assembling mica scales are laminated and bonded by curing of a thermosetting resin impregnated into the mica papers. (2) The laminate according to claim 1, wherein a metal foil is laminated on the surface of the outermost layer of the laminated mica paper. (3) Create a mica paper base prepreg by impregnating mica paper, which is formed by aggregation of mica scales, with a thermosetting resin liquid and drying it, then stack multiple sheets of this mica paper base prepreg and heat them. A method for manufacturing a laminate, characterized by pressure molding. (4) The method for manufacturing a laminate according to claim 3, wherein a metal foil is layered on the surface of the outermost layer of a plurality of mica paper base prepregs and molded under heat and pressure.