JPS6215079A - Manufacture of cutting grindstone - Google Patents
Manufacture of cutting grindstoneInfo
- Publication number
- JPS6215079A JPS6215079A JP15542985A JP15542985A JPS6215079A JP S6215079 A JPS6215079 A JP S6215079A JP 15542985 A JP15542985 A JP 15542985A JP 15542985 A JP15542985 A JP 15542985A JP S6215079 A JPS6215079 A JP S6215079A
- Authority
- JP
- Japan
- Prior art keywords
- grindstone
- plating
- abrasive grains
- base member
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はフェライト、セラミックス等の硬脆材料を切断
するに用いる、メッキ法による切断砥石の製造方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a cutting wheel by plating, which is used to cut hard and brittle materials such as ferrite and ceramics.
従来の技術
従来の金属製台金の表面に砥粒と金属とをメッキ法で共
析させた切断砥石は公知のものであるが、砥石の薄刃化
と云う点では、メツ中応力の影響で砥石が歪み易く、特
開昭59−110561号公報に示されているように、
第3図の様な構造の砥石の製造方法を提案した。Conventional technology A cutting wheel in which abrasive grains and metal are eutectoided by plating on the surface of a conventional metal base is known, but in terms of thinning the blade of the wheel, due to the influence of stress during grinding, The grindstone is easily distorted, and as shown in Japanese Patent Application Laid-open No. 110561/1983,
We proposed a method for manufacturing a grindstone with the structure shown in Figure 3.
この砥石の製造方法は、アルミナ等のセラミックス台材
1の表面を清浄、活性化等の前処理をし、無電解ニッケ
ルまたは銅等の下地メッキ2をした後、砥粒3とメッキ
金属4で共析させて砥石層5としたもので、砥石の歪は
小さく回転振れも少なくしたものである。The method for manufacturing this grindstone is to pre-treat the surface of a ceramic base material 1 made of alumina or the like by cleaning and activating it, and then plate it with a base plating 2 such as electroless nickel or copper, and then coat it with abrasive grains 3 and plated metal 4. The grinding wheel layer 5 is formed by eutectoiding, and the distortion of the grinding wheel is small and rotational runout is also reduced.
発明が解決しようとする問題点
しかしこの様にした砥石構造の製造方法は、砥石の歪が
小さく、回転振れも少なく薄刃化が可能となったが、砥
石摩耗による劣化あるいは摩擦熱等の影響で、台材1か
ら下地メッキ2の1部分が脱落(剥離)し易いと云う問
題があった。つまり、台材1と下地メッキ2の密着強度
が弱く、脱落した砥石層6が切断溝に入りこんで、更に
砥石に悪影響を及ぼし砥石寿命を短くしたり、加工物へ
のダメージが大きくなり、これが加工精度を悪くすると
云った問題を有していた。Problems to be Solved by the Invention However, although this manufacturing method for the grindstone structure allows for thinner blades with less distortion and less rotational runout, the grindstone deteriorates due to wear or is affected by frictional heat. There was a problem in that a portion of the base plating 2 easily fell off (peeled off) from the base material 1. In other words, the adhesion strength between the base material 1 and the base plating 2 is weak, and the dropped grinding wheel layer 6 enters the cutting groove, which has a negative effect on the grinding wheel, shortens the life of the grinding wheel, and causes greater damage to the workpiece. This had the problem of deteriorating machining accuracy.
そこで本発明は台材1と砥石層5の密着強度を向上させ
、且つ加工ダメージを少なく加工出来るメッキ法による
切断砥石の製造方法を提供するものである。Therefore, the present invention provides a method for manufacturing a cutting whetstone using a plating method, which improves the adhesion strength between the base material 1 and the whetstone layer 5, and allows processing with less processing damage.
問題点を解決するだめの手段
そして上記問題点を解決する本発明の切断砥石の製造方
法は、セラミックス円板を合材とし、ダイヤモンド立方
晶窒化硼、シリコンカーバイドの砥粒をメッキ金属で共
析させた砥石において、第1表に従来法と対比して示す
ように、前処理のエツチングと触媒性付与は単一工程で
行う。即ちフッ化第1錫水溶液中に合材を浸漬すること
によシ、ポーラスなエツチング痕を生じさせ、更に第1
錫の吸着も同時にさせる。A means to solve the problems and a method of manufacturing a cutting wheel of the present invention that solves the above problems is to use a ceramic disc as a composite material, and eutectoid abrasive grains of diamond cubic boron nitride and silicon carbide with plated metal. As shown in Table 1 in comparison with the conventional method, pretreatment etching and imparting catalytic properties are carried out in a single step. That is, by immersing the composite material in an aqueous solution of stannous fluoride, porous etching marks are created, and
It also adsorbs tin at the same time.
また、砥粒とメッキ金属の共析後砥石を加熱してベーキ
ング処理を付加したものである。Furthermore, after the abrasive grains and the plated metal are eutectoid, the grindstone is heated and a baking process is added.
(注)ベーキング処理以前の各工程の前後には水洗い、
酸洗い等を実施する。(Note) Wash with water before and after each process before baking.
Perform pickling, etc.
作 用
本発明は上記したフッ化第1錫によるエツチングと、触
媒性付与が単一工程で出来、合材表面がポーラスになる
と共に表面積も増加する。この事により触媒金属も吸着
されやすくなり、後工程のメッキ金属のつき廻りも良く
なるので密着性も向上する。また加熱によるベーキング
処理によシ結晶間中の水分の脱離、結晶化度の増大等に
よシ密着強度が向上する。Function: In the present invention, etching with the above-described stannous fluoride and imparting catalytic properties can be performed in a single step, and the surface of the composite material becomes porous and the surface area increases. This makes it easier for the catalytic metal to be adsorbed, which improves the coverage of the plating metal in the subsequent process, improving adhesion. In addition, the adhesion strength is improved by removing water between the crystals and increasing the degree of crystallinity by baking treatment by heating.
この結果切断加工時に砥石層の脱落も起きなくなり、砥
石寿命の向上と、加工物のクラック、チッピング等も減
少し加工精度も向上する。また後工程の研削加工等の短
縮、或いは削除が出来加工コストの低減になる。As a result, the grinding wheel layer does not fall off during cutting, which improves the life of the grinding wheel, reduces cracks and chipping of the workpiece, and improves processing accuracy. In addition, post-processing such as grinding can be shortened or eliminated, resulting in a reduction in processing costs.
実施例
以下本発明の一実施例を上記した第1表に基づいて説明
する。砥石の形状は第3図に示した従来例と同様のもの
とした。EXAMPLE An example of the present invention will be described below based on Table 1 above. The shape of the grindstone was the same as that of the conventional example shown in FIG.
先ず台材1はアルミナを主体とした材料を一般的なセラ
ミックス焼結法で作った。合材の厚さは0.06〜0.
2711の範囲のものである。First, the base material 1 was made from a material mainly composed of alumina using a general ceramic sintering method. The thickness of the composite material is 0.06~0.
2711 range.
つぎに、この台材1の内径側にメッキ用レジストインク
を塗布、焼付は後台材1の表面を溶剤脱脂した後、下記
に示す触媒性付与処理、活性化処理下地メッキ、共析メ
ッキ、ベーキング処理等を行った。またベーキング以前
の各工程の前には水洗い、酸洗い等を実施した。Next, resist ink for plating is applied to the inner diameter side of this base material 1, and baking is performed.After degreasing the surface of the base material 1 with a solvent, the following catalytic imparting treatment, activation treatment base plating, eutectoid plating, and baking are performed. Processing etc. were carried out. In addition, water washing, pickling, etc. were performed before each step before baking.
(1)触媒性付与(エツチング兼用) (2) 第1次活性化処理 (3)第2次活性化処理 (4) 下地メッキ 硫酸ニッケル、次亜リン酸ナトリウム。(1) Adding catalytic properties (also used for etching) (2) Primary activation process (3) Secondary activation process (4) Base plating Nickel sulfate, sodium hypophosphite.
クエン酸ナトリウムからなる無電解ニッケル液に90
’Cで5分浸漬
(6)共析メッキ
スルフアミノ酸ニッケル、塩化ニッケル。90% in an electroless nickel solution consisting of sodium citrate.
(6) Eutectoid plating of nickel sulfur amino acids and nickel chloride.
ホウ酸、ダイヤモンド砥粒等からなる電気ニッケルメッ
キ液で、温度40〜5゜°C1電流密度1〜3A/dr
r?、中に30〜60分間浸漬
(6) ベーキング処理
共析メッキ後の砥石を二枚のスペーサではさみ乾燥器中
に入れ、加熱処理した
以上のように本実施例による砥石は、下地メッキの前処
理として、フッ化第1錫によるエツチングと触媒性付与
が単一工程となり、密着強度は第1図に示すように従来
法より約1.7倍向上する、またベーキング処理をする
ことにより更に向上し、従来法の3倍で切断時にメッキ
の剥離は発生しなく、加工ダメージを少なくすることが
出来る。Electrolytic nickel plating solution consisting of boric acid, diamond abrasive grains, etc. at a temperature of 40 to 5°C and a current density of 1 to 3 A/dr.
r? , for 30 to 60 minutes (6) Baking treatment The grindstone after eutectoid plating is sandwiched between two spacers, placed in a dryer, and heated.As described above, the grindstone according to this example is As a treatment, etching with stannous fluoride and imparting catalytic properties are performed in a single process, and as shown in Figure 1, the adhesion strength is improved by about 1.7 times compared to the conventional method, and it is further improved by baking treatment. However, it is three times as effective as the conventional method, and the plating does not peel off during cutting, making it possible to reduce machining damage.
またベーキング処理と密着強度の関係は第2図に示すよ
うに、密着強度は温度の上昇と共に強くなるが約260
°C〜300°Cで最高点を示しそれ以上では余り変ら
ない又ベーキング時間60分保持すれば最高の密着強度
を示す。従って実施例では300’060分とした。Furthermore, as shown in Figure 2, the relationship between baking treatment and adhesion strength is approximately 260%, although the adhesion strength increases as the temperature rises.
It reaches its highest point between .degree. C. and 300.degree. C., and does not change much above that temperature, and exhibits the highest adhesion strength when the baking time is maintained for 60 minutes. Therefore, in the example, the time was set to 300'060 minutes.
また実施例以外の砥粒として立方晶窒化硼素、シリコン
カーバイド等、ベーキングも除いた製造方法も可能であ
る。Further, it is also possible to use cubic boron nitride, silicon carbide, or the like as abrasive grains other than those in the embodiments, and to use a manufacturing method that does not include baking.
発明の効果
以上のように本発明は、セラミック円板を合材として、
下地メッキ後砥粒をメッキ金属で共析させた砥石におい
ぞ、メッキの前処理法としてフッ化第1錫水溶液でエツ
チングと触媒付与を行らた後、活性化を行い、更に共析
メッキ後ベーキング処理をすることにより反りが少なく
、薄刃な砥石の製造が可能で、且つ砥石層と台材の密着
性もよく砥石寿命の向上が図れる。Effects of the invention As described above, the present invention uses a ceramic disc as a composite material,
After the base plating, the abrasive grains are eutectoided with the plating metal. As a pretreatment method for plating, etching and catalysis are performed using an aqueous solution of stannous fluoride, followed by activation, and then after the eutectoid plating. By performing baking treatment, it is possible to manufacture a whetstone with less warpage and a thin blade, and the adhesion between the whetstone layer and the base material is also good, and the life of the whetstone can be improved.
また加工物へのクラック、チッピングの減少による後工
程の短縮、削除等加エコストの低減が図れる。−In addition, by reducing cracks and chipping on the workpiece, it is possible to shorten post-processing and reduce processing costs such as deletion. −
第1図は本発明の実施例における砥石層と合材の密着強
さを従来例との比較図、第2図はベーキング処理温度と
密着強度の相関図、第3図は本発明の実施例及び従来例
の砥石の構造図でaは平面図、bは断面図である。
1・・・・・・台材(台金)、2・・・・・・下地メッ
キ、3・・・・・・砥粒、4・・・・・・メッキ金属、
5・・・・・・砥石層。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図
第2図Fig. 1 is a comparison diagram of the adhesion strength between the grinding wheel layer and the composite material in the embodiment of the present invention with a conventional example, Fig. 2 is a correlation diagram between baking treatment temperature and adhesion strength, and Fig. 3 is an example of the embodiment of the present invention. 1 and 2 are structural diagrams of a conventional grindstone, in which a is a plan view and b is a cross-sectional view. 1...Base material (base metal), 2...Base plating, 3...Abrasive grains, 4...Plated metal,
5... Grindstone layer. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2
Claims (1)
ヤモンド、立方晶窒化硼素、シリコンカーバイドの砥粒
を分散させたメッキ液中で前記砥粒とニッケル、又は銅
の金属とを同時に共析させた切断砥石の製造方法におい
て、前記清浄、活性化をフッ化第1錫水溶液を用いてエ
ッチングと、触媒性付与を一工程で行った後、硝酸銀水
溶液で第一次活性化を行うと共に、塩化パラジウム−塩
酸水溶液で第二次活性化を行い、更に前記砥粒とメッキ
金属を共析させた後に、砥石を加熱してベーキング処理
を行うことにより構成した切断砥石の製造方法。The surface of the ceramic base material is cleaned and activated, and the abrasive grains and nickel or copper metal are simultaneously eutectoided in a plating solution in which abrasive grains of diamond, cubic boron nitride, and silicon carbide are dispersed. In the method for manufacturing a cutting wheel, the cleaning and activation are performed in one step by etching using an aqueous solution of stannous fluoride and imparting catalytic properties, and then primary activation is performed using an aqueous solution of silver nitrate, and A method for producing a cutting whetstone, which comprises performing secondary activation with a palladium-hydrochloric acid aqueous solution, eutectoidizing the abrasive grains and plated metal, and then heating and baking the whetstone.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15542985A JPS6215079A (en) | 1985-07-15 | 1985-07-15 | Manufacture of cutting grindstone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15542985A JPS6215079A (en) | 1985-07-15 | 1985-07-15 | Manufacture of cutting grindstone |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6215079A true JPS6215079A (en) | 1987-01-23 |
Family
ID=15605818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15542985A Pending JPS6215079A (en) | 1985-07-15 | 1985-07-15 | Manufacture of cutting grindstone |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6215079A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007105386A1 (en) * | 2006-03-10 | 2007-09-20 | Osaka University | Fused ring compound and method for producing same, polymer, organic thin film containing those, and organic thin film device and organic thin film transistor comprising such organic thin film |
-
1985
- 1985-07-15 JP JP15542985A patent/JPS6215079A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007105386A1 (en) * | 2006-03-10 | 2007-09-20 | Osaka University | Fused ring compound and method for producing same, polymer, organic thin film containing those, and organic thin film device and organic thin film transistor comprising such organic thin film |
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