JPS62149850U - - Google Patents
Info
- Publication number
- JPS62149850U JPS62149850U JP1986036775U JP3677586U JPS62149850U JP S62149850 U JPS62149850 U JP S62149850U JP 1986036775 U JP1986036775 U JP 1986036775U JP 3677586 U JP3677586 U JP 3677586U JP S62149850 U JPS62149850 U JP S62149850U
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- sensor
- temperature sensor
- cooling
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Thyristors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986036775U JPS62149850U (zh) | 1986-03-13 | 1986-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986036775U JPS62149850U (zh) | 1986-03-13 | 1986-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62149850U true JPS62149850U (zh) | 1987-09-22 |
Family
ID=30847495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986036775U Pending JPS62149850U (zh) | 1986-03-13 | 1986-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62149850U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018505545A (ja) * | 2014-11-27 | 2018-02-22 | ラッペーンランナン・テクニッリネン・ユリオピストＬａｐｐｅｅｎｒａｎｎａｎ Ｔｅｋｎｉｌｌｉｎｅｎ Ｙｌｉｏｐｉｓｔｏ | 熱制御された電子デバイス |
-
1986
- 1986-03-13 JP JP1986036775U patent/JPS62149850U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018505545A (ja) * | 2014-11-27 | 2018-02-22 | ラッペーンランナン・テクニッリネン・ユリオピストＬａｐｐｅｅｎｒａｎｎａｎ Ｔｅｋｎｉｌｌｉｎｅｎ Ｙｌｉｏｐｉｓｔｏ | 熱制御された電子デバイス |