JPS6214737U - - Google Patents
Info
- Publication number
- JPS6214737U JPS6214737U JP10565585U JP10565585U JPS6214737U JP S6214737 U JPS6214737 U JP S6214737U JP 10565585 U JP10565585 U JP 10565585U JP 10565585 U JP10565585 U JP 10565585U JP S6214737 U JPS6214737 U JP S6214737U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- envelope
- sealing resin
- molded
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10565585U JPS6214737U (OSRAM) | 1985-07-12 | 1985-07-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10565585U JPS6214737U (OSRAM) | 1985-07-12 | 1985-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214737U true JPS6214737U (OSRAM) | 1987-01-29 |
Family
ID=30980292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10565585U Pending JPS6214737U (OSRAM) | 1985-07-12 | 1985-07-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214737U (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11031313B2 (en) | 2019-06-27 | 2021-06-08 | Mitsubishi Electric Corporation | Semiconductor device |
-
1985
- 1985-07-12 JP JP10565585U patent/JPS6214737U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11031313B2 (en) | 2019-06-27 | 2021-06-08 | Mitsubishi Electric Corporation | Semiconductor device |
| DE102020116361B4 (de) | 2019-06-27 | 2022-12-01 | Mitsubishi Electric Corporation | Halbleitervorrichtung |