JPS62147355U - - Google Patents

Info

Publication number
JPS62147355U
JPS62147355U JP3522086U JP3522086U JPS62147355U JP S62147355 U JPS62147355 U JP S62147355U JP 3522086 U JP3522086 U JP 3522086U JP 3522086 U JP3522086 U JP 3522086U JP S62147355 U JPS62147355 U JP S62147355U
Authority
JP
Japan
Prior art keywords
recess
semiconductor chip
wiring board
wiring
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3522086U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3522086U priority Critical patent/JPS62147355U/ja
Publication of JPS62147355U publication Critical patent/JPS62147355U/ja
Pending legal-status Critical Current

Links

JP3522086U 1986-03-11 1986-03-11 Pending JPS62147355U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3522086U JPS62147355U (fr) 1986-03-11 1986-03-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3522086U JPS62147355U (fr) 1986-03-11 1986-03-11

Publications (1)

Publication Number Publication Date
JPS62147355U true JPS62147355U (fr) 1987-09-17

Family

ID=30844510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3522086U Pending JPS62147355U (fr) 1986-03-11 1986-03-11

Country Status (1)

Country Link
JP (1) JPS62147355U (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008112749A (ja) * 2006-10-27 2008-05-15 Kyocera Corp 半導体装置および半導体装置を備えた流体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008112749A (ja) * 2006-10-27 2008-05-15 Kyocera Corp 半導体装置および半導体装置を備えた流体装置

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