JPS6214702Y2 - - Google Patents
Info
- Publication number
- JPS6214702Y2 JPS6214702Y2 JP13441681U JP13441681U JPS6214702Y2 JP S6214702 Y2 JPS6214702 Y2 JP S6214702Y2 JP 13441681 U JP13441681 U JP 13441681U JP 13441681 U JP13441681 U JP 13441681U JP S6214702 Y2 JPS6214702 Y2 JP S6214702Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- heat
- plate
- semiconductor element
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 239000004065 semiconductor Substances 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13441681U JPS5839056U (ja) | 1981-09-09 | 1981-09-09 | 半導体素子用放熱器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13441681U JPS5839056U (ja) | 1981-09-09 | 1981-09-09 | 半導体素子用放熱器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5839056U JPS5839056U (ja) | 1983-03-14 |
| JPS6214702Y2 true JPS6214702Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-04-15 |
Family
ID=29927845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13441681U Granted JPS5839056U (ja) | 1981-09-09 | 1981-09-09 | 半導体素子用放熱器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5839056U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1981
- 1981-09-09 JP JP13441681U patent/JPS5839056U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5839056U (ja) | 1983-03-14 |