JPS6214571Y2 - - Google Patents
Info
- Publication number
- JPS6214571Y2 JPS6214571Y2 JP18297880U JP18297880U JPS6214571Y2 JP S6214571 Y2 JPS6214571 Y2 JP S6214571Y2 JP 18297880 U JP18297880 U JP 18297880U JP 18297880 U JP18297880 U JP 18297880U JP S6214571 Y2 JPS6214571 Y2 JP S6214571Y2
- Authority
- JP
- Japan
- Prior art keywords
- rhodium
- contact
- metal
- layer
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910052703 rhodium Inorganic materials 0.000 claims description 12
- 239000010948 rhodium Substances 0.000 claims description 12
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 12
- 235000014676 Phragmites communis Nutrition 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 229910000510 noble metal Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 7
- 239000002470 thermal conductor Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
Landscapes
- Contacts (AREA)
Description
【考案の詳細な説明】
本考案はロジウム等の高融点貴金属をめつき形
成してなる電気接点に関するものである。[Detailed Description of the Invention] The present invention relates to an electrical contact formed by plating a high melting point noble metal such as rhodium.
この種接点を用いるものとして第１図に示すリ
ードスイツチがある。リードスイツチは52アロイ
等の磁性材料からなる金属片である一対リード片
１，２がガラス管３に封入された構造で、リード
片１，２の対向端部は一定のオーバーラツプとギ
ヤツプをもつて接点部分Ａを形成している。 There is a reed switch shown in FIG. 1 that uses this type of contact. The reed switch has a structure in which a pair of reed pieces 1 and 2, which are metal pieces made of magnetic material such as 52 alloy, are sealed in a glass tube 3, and the opposite ends of the reed pieces 1 and 2 have a certain overlap and gap. A contact portion A is formed.
リードスイツチ用電気接点としては種々のもの
があるが、その中にロジウムめつきを接点とした
ものがあり、これはロジウムの接点特性が他に比
べ極めて優れているため長寿命で且つ接触抵抗の
低いスイツチとして周知である。 There are various types of electrical contacts for reed switches, but some of them are rhodium-plated contacts, which have extremely superior contact characteristics compared to other types, so they have a long life and low contact resistance. It is known as a low switch.
このようなロジウムめつき接点を更に長寿命化
させる際の問題点として接点電流による接点自体
の加熱がある。すなわち、電流の開閉によつて接
点部にはジユール熱が発生し該接点は加熱される
が、この際接点温度が上昇するにしたがつて接点
の転移消耗が激しくなる傾向にあり、対向接点が
部分的に一方が凸に他方が凹になつて最後には開
離不能になつてしまう。 A problem with extending the life of such rhodium-plated contacts is that the contact itself is heated by the contact current. That is, when the current is switched on and off, Joule heat is generated in the contact and the contact is heated, but as the contact temperature rises, the transfer and wear of the contact tends to increase, and the opposing contact One part becomes convex and the other part becomes concave, and eventually they become impossible to separate.
ところが、従来接点は第２図に示す如く、リー
ド片１，２の端部のみに金等の下地めつき層４を
形成しその上にロジウム層５をめつき形成した構
造のためロジウム自体の放熱は良好なものとは言
えない。 However, as shown in Fig. 2, conventional contacts have a structure in which a base plating layer 4 such as gold is formed only on the ends of the lead pieces 1 and 2, and a rhodium layer 5 is plated thereon. Heat dissipation cannot be said to be good.
本考案の目的はロジウム等の高融点貴金属めつ
き層の放熱性を改善し、更に長寿命なリードスイ
ツチを提供可能にさせるものである。 The purpose of the present invention is to improve the heat dissipation of a layer plated with a high-melting point noble metal such as rhodium, thereby making it possible to provide a reed switch with a longer life.
以下、本考案の一実施例を第３図を参照しなが
ら説明する。 Hereinafter, one embodiment of the present invention will be described with reference to FIG.
第３図おいて、１′，２′はリード片、４′は下
地めつき層、５′はロジウム層、６′は銀或いは銅
の熱良導体金属層である。 In FIG. 3, 1' and 2' are lead pieces, 4' is a base plating layer, 5' is a rhodium layer, and 6' is a metal layer of silver or copper that is a good thermal conductor.
本実施例において、ロジウム層５′は二層にめ
つき形成され、層間にリード片１′，２′の接点部
から他端側へ延長した銀或いは銅の熱および電気
伝導の良い熱良導体金属層６′が介在され、ロジ
ウム層５′の内部に蓄えられる熱を外部へ放出で
きる構造となつている。 In this embodiment, the rhodium layer 5' is formed by plating into two layers, and a thermally conductive metal with good thermal and electrical conductivity such as silver or copper extends between the layers from the contact portion of the lead pieces 1' and 2' to the other end. A layer 6' is interposed so that the heat stored inside the rhodium layer 5' can be released to the outside.
又、下地めつき層４′も金属層６′と同様に熱良
導体金属で形成され、リード片１′，２′の他端側
へ延長され、ロジウムおよびリード片に対する密
着性を図ると共に、放熱作用を有するように構成
している。 In addition, the base plating layer 4' is also made of a metal with good thermal conductivity, similar to the metal layer 6', and is extended to the other ends of the lead pieces 1' and 2' to ensure adhesion to the rhodium and the lead pieces, and to dissipate heat. It is configured to have an effect.
尚、下地めつき層４′はロジウムおよびリード
片に対する密着性を得るために形成するものであ
り、熱良導体に限定されるものではない。 Note that the base plating layer 4' is formed to obtain adhesion to rhodium and lead pieces, and is not limited to being a good thermal conductor.
以上の本考案によれば、接点部に発生するジユ
ール熱を、多層のロジウム層間に介在し、金属片
の他端側に延びる熱良導性金属体により、水平方
向に逃がすことができ、且つ該延長部分が放熱部
として作用し、接点の温度上昇を抑えることが可
能となり、接点の一層の長寿命化を達成できるも
ので、その効果は著しい。 According to the present invention described above, the Joule heat generated at the contact part can be dissipated in the horizontal direction by the thermally conductive metal body interposed between the multiple rhodium layers and extending to the other end of the metal piece. The extended portion acts as a heat dissipation portion, making it possible to suppress the rise in temperature of the contact, thereby achieving a further extension of the life of the contact, which has a remarkable effect.
第１図はリードスイツチを示す図、第２図は従
来の接点構造を示す断面図、第３図は本考案に係
る接点構造の断面図である。
符号の説明、１′，２′……リード片、４′……
下地めつき層、５′……多層めつきされたロジウ
ム層、６′……銀或いは銅の熱良導体金属層。
FIG. 1 is a diagram showing a reed switch, FIG. 2 is a sectional view showing a conventional contact structure, and FIG. 3 is a sectional view of a contact structure according to the present invention. Explanation of symbols, 1', 2'...Lead piece, 4'...
Base plating layer, 5'... multi-layer plated rhodium layer, 6'... silver or copper metal layer with good thermal conductivity.
Claims (1)
めつき形成してなるリードスイツチ用の電気接点
において、前記ロジウムを多層構成とすると共に
該層間に熱良導体金属である銀或いは銅を介在さ
せ、且つ該熱良導体金属層である銀或いは銅を前
記金属片上の他端部側へ延長させて該延長部を放
熱部分としたことを特徴とする電気接点。 An electrical contact for a reed switch in which rhodium, which is a high-melting point noble metal, is plated on the end of a metal piece, the rhodium is formed into a multilayer structure, and silver or copper, which is a metal with good thermal conductivity, is interposed between the layers, An electrical contact characterized in that the thermally conductive metal layer, such as silver or copper, is extended toward the other end of the metal piece, and the extended portion is used as a heat dissipation portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18297880U JPS6214571Y2 (en) | 1980-12-19 | 1980-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18297880U JPS6214571Y2 (en) | 1980-12-19 | 1980-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57106126U JPS57106126U (en) | 1982-06-30 |
| JPS6214571Y2 true JPS6214571Y2 (en) | 1987-04-14 |
Family
ID=29981827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18297880U Expired JPS6214571Y2 (en) | 1980-12-19 | 1980-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214571Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104217893B (en) * | 2014-09-26 | 2019-09-06 | 敬德强 | High current magnetic reed switch |
-
1980
- 1980-12-19 JP JP18297880U patent/JPS6214571Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57106126U (en) | 1982-06-30 |
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