JPS6214449A - Bend detecting method for semiconductor element lead - Google Patents
Bend detecting method for semiconductor element leadInfo
- Publication number
- JPS6214449A JPS6214449A JP15328085A JP15328085A JPS6214449A JP S6214449 A JPS6214449 A JP S6214449A JP 15328085 A JP15328085 A JP 15328085A JP 15328085 A JP15328085 A JP 15328085A JP S6214449 A JPS6214449 A JP S6214449A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bend
- camera
- external
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体素子のリード曲り検査方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a lead bending inspection method for semiconductor devices.
従来、ＴＶ左カメラ４を用いた画像処理による検査方法
は第４図（ａ） 、 （ｂ）に示すように半導体素子１
の各々片側全体の外部リード２を同時に画像処理するこ
とによシ基準サンプルを読み込ませたデータと比較して
良否の判定を行なっていた。Conventionally, the inspection method by image processing using the TV left camera 4 is as shown in FIGS. 4(a) and 4(b).
By simultaneously performing image processing on the entire external lead 2 on each side, the quality of the external lead 2 is determined by comparing it with the data read from the reference sample.
上述した従来のＴＶ左カメラ４を用いた画像処理による
検査方法は各々片側全体の外部リード２を同時Ｋｉ！！
！識するため、外部リード２の本数が多くなると、視野
を広げる必要があり、−画素当りの精度が悪くなるため
、限られた本数の外部リード２しか検出出来ないという
欠点があった。The above-described inspection method using image processing using the conventional TV left camera 4 simultaneously Ki! !
! As the number of external leads 2 increases, the field of view needs to be widened in order to detect the external leads 2, and the precision per pixel deteriorates, resulting in the drawback that only a limited number of external leads 2 can be detected.
また従来第４図（ａ） 、 （ｂ）に示すようにＴＶ左
カメラ４により上方向あるいは下方向からと左右側面方
向から半導体素子１の外部リード２を全体一度に認識す
るため、リード曲げ工程による曲げ位置のバラツキ、ガ
ラスケース等におけるリードフレームとケースの封止工
程での封止ズレによりケースとリードの相対位置の判定
基準が不安定となり、品種、ロフトが変わるたびにＹ方
向のリード曲りの検査精度がでないという欠点があった
。Furthermore, as shown in FIGS. 4(a) and 4(b), conventionally, the entire external lead 2 of the semiconductor element 1 is recognized at once from above or below and from the left and right sides using the TV left camera 4. The criteria for determining the relative position of the case and leads becomes unstable due to variations in the bending position due to the bending position, and sealing deviations in the sealing process between the lead frame and case in glass cases, etc., resulting in lead bending in the Y direction every time the product type or loft changes. The drawback was that the inspection accuracy was low.
本発明は半導体素子のリード単位で個別にリードの曲シ
の検査を行うリード曲シ検査方法を提供するものである
。The present invention provides a lead bend inspection method for individually inspecting lead bends in each lead of a semiconductor element.
本発明のリード曲り検出方法は半導体素子の外部リード
の折曲部及び先端部をそれぞれＴＶカメラで認識し外部
リードの先端と折曲部との画像をそれぞれ得て、両画像
の相対位置によりリードの曲りを判定することを特徴と
するものである。The lead bend detection method of the present invention uses a TV camera to recognize the bent part and the tip of an external lead of a semiconductor device, obtain images of the tip of the external lead and the bent part, and detect the lead based on the relative position of both images. It is characterized by determining the curvature of.
次に、本発明の一実施例について図面を参照して説明す
る。第１図（＆） 、 （ｂ）において、ＴＶカメラ３
により外部リード２の先端位置２ａを認識し、ＴＶカメ
ラ４により外部リード２の折曲部位置２ｂを認識する。Next, an embodiment of the present invention will be described with reference to the drawings. In Figure 1 (&) and (b), the TV camera 3
The tip position 2a of the external lead 2 is recognized by the TV camera 4, and the bent position 2b of the external lead 2 is recognized by the TV camera 4.
すなわち、外部リード２，１本について２台ＴＶカメラ
３．４で認識する。That is, each external lead 2 is recognized by two TV cameras 3.4.
第２図において、外部リード２の先端２ａをＴＶカメラ
３により認識したリード先端画像８の認識位置をＸ座標
９とＹ座標１０とで示す。この場合、６．７はモニター
のＸ、Ｙ座標基準線である。５は座標モニタである。In FIG. 2, the recognized position of a lead tip image 8 in which the tip 2a of the external lead 2 is recognized by the TV camera 3 is indicated by an X coordinate 9 and a Y coordinate 10. In this case, 6.7 is the monitor's X, Y coordinate reference line. 5 is a coordinate monitor.
第３図において、外部リード２の折曲部２ｂｔｌ−ＴＶ
カメラ４により認識したリード根本画像１１の認識位置
をＸ座標１２、Ｙ座標１３で示す。In FIG. 3, the bent portion 2btl-TV of the external lead 2
The recognized position of the lead root image 11 recognized by the camera 4 is indicated by an X coordinate 12 and a Y coordinate 13.
この第２図と第３図に示すリード先端画像８とリード根
本画像１１の認識座標のズレ量をリード曲シ量としてリ
ード１本ごとについて算出することにより、リード曲シ
を検出する。The amount of deviation between the recognized coordinates of the lead tip image 8 and the lead base image 11 shown in FIGS. 2 and 3 is calculated as the lead bend amount for each lead, thereby detecting the lead bend.
以上説明したように本発明はリード曲り検査において外
部リードの折曲部と先端を２台のＴＶカメラで認識する
ことによシリード先端画像とリード根本画像の相対位置
をリード曲り量として判定するため、リード曲げ工程に
おける曲げ位置のバラツキ、封止工程における封止ズレ
等に対しても精度よく検出でき、また外部リードの１本
ずつ曲り量を判定するため、外部リードの本数に制限な
くでき、多種多様のリード曲り検出に適用できる効果を
有するものである。As explained above, the present invention recognizes the bent portion and the tip of the external lead using two TV cameras in the lead bending inspection, and determines the relative position of the lead tip image and the lead root image as the amount of lead bending. , it is possible to accurately detect variations in the bending position in the lead bending process, sealing deviation in the sealing process, etc. Also, since the amount of bending of each external lead is determined one by one, there is no limit to the number of external leads. This has an effect that can be applied to a wide variety of lead bend detections.
第１図（ａ）は本発明のリード曲シ検出方法を示す側面
図、（ｂ）は同正面図、第２図は外部リードの先端をＴ
Ｖカメラで認識したモニター図、第３図は外部リードの
折曲部をＴＶカメラで認識したモニター図、第４図（、
）は従来方法を示す正面図、（ｂ）は同側面図である。
１・・・半導体素子、２・・・外部リード、３・・・外
部リード先端認識用ＴＶカメラ、４・・・外部リード折
曲部認識用ＴＶカメラ、５・・・座標モニター、６・・
・モニターＸ座標基準線、７・・・モニターＹ座標基準
線、８・・・外部リード先端画像、９・・・外部リード
先端Ｘ座標、１０・・・外部リード先端Ｙ座標、１１・
・・外部リード折曲部画像、１２・・・外部リード折曲
部Ｘ座標、１３・・・外部リード折曲部Ｙ座標Ｏ
特許出願人 九州日本電気株式会社
第１
図
（ａン
第４
ｒｂ〕
図FIG. 1(a) is a side view showing the lead bend detection method of the present invention, FIG. 1(b) is a front view of the same, and FIG.
Figure 3 is a monitor diagram recognized by a TV camera, and Figure 4 is a monitor diagram recognized by a TV camera.
) is a front view showing the conventional method, and (b) is a side view of the same. DESCRIPTION OF SYMBOLS 1...Semiconductor element, 2...External lead, 3...TV camera for recognizing the tip of the external lead, 4...TV camera for recognizing the bent portion of the external lead, 5...Coordinate monitor, 6...
・Monitor X coordinate reference line, 7... Monitor Y coordinate reference line, 8... External lead tip image, 9... External lead tip X coordinate, 10... External lead tip Y coordinate, 11.
... External lead bent part image, 12... External lead bent part X coordinate, 13... External lead bent part Y coordinate O Patent applicant Kyushu NEC Co., Ltd. 〕 figure
Claims (1)
子の外部リードの折曲部と先端とをＴＶカメラで撮像し
リードの折曲部と先端部との画像をそれぞれ得て、両像
の相対位置によりリードの曲り量を検査することを特徴
とする半導体素子のリード曲り検出方法。(1) In the lead bend inspection of semiconductor devices, images of the bent portion and tip of the external lead of the semiconductor device are taken with a TV camera, images of the bent portion and tip of the lead are obtained, and the relative positions of the two images are taken. 1. A method for detecting lead bending of a semiconductor device, the method comprising inspecting the bending amount of a lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15328085A JPS6214449A (en) | 1985-07-11 | 1985-07-11 | Bend detecting method for semiconductor element lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15328085A JPS6214449A (en) | 1985-07-11 | 1985-07-11 | Bend detecting method for semiconductor element lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214449A true JPS6214449A (en) | 1987-01-23 |
Family
ID=15559016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15328085A Pending JPS6214449A (en) | 1985-07-11 | 1985-07-11 | Bend detecting method for semiconductor element lead |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214449A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5490084A (en) * | 1987-06-01 | 1996-02-06 | Hitachi Techno Engineering Co., Ltd. | Method and apparatus for detecting bent leads in electronic components |
| US8082589B2 (en) | 2002-11-18 | 2011-12-20 | Arm Limited | Diagnostic data capture control for multi-domain processors |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60111434A (en) * | 1983-11-22 | 1985-06-17 | Toshiba Corp | Detection of broken leg and bent leg of semiconductor device |
| JPS60160137A (en) * | 1984-01-30 | 1985-08-21 | Nec Kyushu Ltd | Bent lead detection process |
-
1985
- 1985-07-11 JP JP15328085A patent/JPS6214449A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60111434A (en) * | 1983-11-22 | 1985-06-17 | Toshiba Corp | Detection of broken leg and bent leg of semiconductor device |
| JPS60160137A (en) * | 1984-01-30 | 1985-08-21 | Nec Kyushu Ltd | Bent lead detection process |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5490084A (en) * | 1987-06-01 | 1996-02-06 | Hitachi Techno Engineering Co., Ltd. | Method and apparatus for detecting bent leads in electronic components |
| US8082589B2 (en) | 2002-11-18 | 2011-12-20 | Arm Limited | Diagnostic data capture control for multi-domain processors |
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