JPS6214448A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPS6214448A JPS6214448A JP15223385A JP15223385A JPS6214448A JP S6214448 A JPS6214448 A JP S6214448A JP 15223385 A JP15223385 A JP 15223385A JP 15223385 A JP15223385 A JP 15223385A JP S6214448 A JPS6214448 A JP S6214448A
- Authority
- JP
- Japan
- Prior art keywords
- cracks
- resin
- element mounting
- semiconductor device
- mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、樹脂封止型半導体装置用リードフレームに関
し、特にリード線の集合体と半導体素子を搭載するため
の素子載置部を備える樹脂封止型半導体装置用リードフ
レームに関するものである。Detailed Description of the Invention [Field of Application of the Invention] The present invention relates to a lead frame for a resin-sealed semiconductor device, and particularly to a lead frame for a resin-sealed semiconductor device that includes an assembly of lead wires and an element mounting portion for mounting a semiconductor element. The present invention relates to a lead frame for a fixed type semiconductor device.
樹脂封止型半導体装置は、線膨張率の小さい半導体素子
やリードフレームを線膨張率の大きい樹脂で封止する構
造をとる。このため、装置に熱負荷が加わると、装置内
に熱応力が発生する。この熱応力は、リードフレームあ
るいは半導体素子の端部で顕著に大きくなる０発生熱応
力の大きさが、例えば封止樹脂の強度より大きくなると
樹脂クラックが発生する。樹脂クラックが装置表面に達
すると水分が装置内部に容易に浸入するので、装置の耐
湿信頼性が著しく劣化してしまう、このため、装置の耐
湿信頼性を確保するためには樹脂クラックを防ぐ必要が
ある。樹脂クラックを防ぐ方法として、例えば特開昭５
８−１９９５４７号公報に記載されているように、素子
載置部の側面を凹凸形状とするリードフレーム構造が提
案されている。しかし、この構造では、側面に多くの凹
凸形状をつけることは逆に熱応力の集中する端部を多く
つくることになり好ましい構造とはなっていなかった。A resin-sealed semiconductor device has a structure in which a semiconductor element or a lead frame having a low coefficient of linear expansion is sealed with a resin having a high coefficient of linear expansion. Therefore, when a thermal load is applied to the device, thermal stress is generated within the device. This thermal stress becomes significantly large at the end of the lead frame or the semiconductor element. When the magnitude of the generated thermal stress becomes greater than the strength of the sealing resin, for example, resin cracks occur. When resin cracks reach the surface of the device, moisture easily enters the inside of the device, significantly degrading the moisture resistance of the device. Therefore, it is necessary to prevent resin cracks in order to ensure the moisture resistance and reliability of the device. There is. For example, as a method for preventing resin cracks,
As described in Japanese Patent No. 8-199547, a lead frame structure has been proposed in which the side surface of the element mounting portion has an uneven shape. However, in this structure, providing many uneven shapes on the side surface would conversely create a large number of edges where thermal stress is concentrated, which was not a desirable structure.
本発明の目的は、樹脂封止型半導体装置において、樹脂
クラックの発生を防止する半導体装置用リードフレーム
構造を提供することにある。An object of the present invention is to provide a lead frame structure for a semiconductor device that prevents the occurrence of resin cracks in a resin-sealed semiconductor device.
樹脂封止型半導体装置においては、樹脂クラックの多く
が、半導体素子載置部の側面の下端部にクラックの起点
を持っている。特に載置部側面中央部の下端からクラッ
クが発生し、載置部の下端に沿って側面周辺部に向かっ
てクラックが進行する場合が多い、そこで樹脂クラック
を防止するためには、素子載置部側面の中央部下端近傍
に発生する熱応力を緩和してクラックの発生を防止する
か、万一クラックが発生してもその進展を止めてやれば
よい、クラックが、素子載置部側面の下端に沿って中央
部から周辺部へ向かって進展することから、このクラッ
クの進展を抑制するには、素子載置部の側辺形状を直線
ではなく凹凸形状とすればよい、しかし、凹凸を設ける
ことにより、応力の集中箇所となる端部が形成され、逆
にクラックの発生箇所を増加させる原因となるので、凹
凸を形成することは応力的には好ましくない、そこで、
クラックの発生起点となる素子載置部側面の中央部のみ
を凸形状あるいは凹形状とすればクランクの周辺部の進
展を抑止できる。この場合の発生熱応力の変化を解析し
た結果が第１図である。In a resin-sealed semiconductor device, most resin cracks have their origin at the lower end of the side surface of the semiconductor element mounting portion. In particular, cracks often occur from the lower end of the central part of the side surface of the mounting section and progress along the lower edge of the mounting section toward the periphery of the side surface.In order to prevent resin cracks, it is necessary to It is best to prevent cracks from occurring by alleviating the thermal stress that occurs near the center lower end of the side surface of the element mounting section, or to stop the growth of cracks in the event that they occur. Since the cracks propagate from the center to the periphery along the lower edge, in order to suppress the propagation of this crack, the side shape of the element mounting part should be made uneven rather than straight. The formation of unevenness is undesirable in terms of stress, as it creates edges where stress is concentrated, and conversely increases the number of places where cracks occur.
By making only the central portion of the side surface of the element mounting portion, which is the starting point of crack generation, a convex or concave shape, it is possible to prevent the development of the peripheral portion of the crank. FIG. 1 shows the results of analyzing the changes in thermal stress generated in this case.
第１図は素子載置部側面とリードの間隔りと、素子載置
部側面下端に発生する熱応力６の関係を示したものであ
る。この第１図から、素子載置部側面とリードの間隔が
短いほど発生熱応力が減少することがわかる。したがっ
て、素子載置部側面め中央部を凸形状にすると、クラッ
クの進展を抑止するのみでなく、クラックの起点となる
素子載置部側面下端に発生する熱応力を緩和することが
できる。FIG. 1 shows the relationship between the distance between the side surface of the element mounting part and the leads and the thermal stress 6 generated at the lower end of the side surface of the element mounting part. From FIG. 1, it can be seen that the shorter the distance between the side surface of the element mounting portion and the lead, the less the generated thermal stress. Therefore, by forming the central portion of the side surface of the element mounting portion into a convex shape, it is possible not only to suppress the propagation of cracks, but also to alleviate the thermal stress generated at the lower end of the side surface of the element mounting portion, which is the starting point of the crack.
以下、本発明の一実施例を第２図により説明する。第２
図に示すような素子載置部固定リード３が素子載置部１
の側面部から出ている場合には、この素子載置部固定リ
ード３のない側面の中央部を凸形状とする。この平面構
造により凸形状とした部分とリード２の間隔も短くなる
０本実施例によれば、半導体装置の樹脂クラックの起点
となる素子載置部側面下端近傍の熱応力を緩和できるの
でクラック発生を抑止する効果がある。さらに、クラッ
クが発生した場合にも、側面形状が直線ではなく段差が
あるために、クラックの素子載置部側面下端に沿った進
展を抑止するという効果もある。なお、凸形状とした部
分の形状は本実施例のような台形形状に限らず、矩形あ
るいは円弧等どのような形状でもかまわない、さらに、
周辺部に微小凸部等を設けても本効果を妨げるものでは
ない。An embodiment of the present invention will be described below with reference to FIG. Second
The element mounting part fixing lead 3 as shown in the figure is attached to the element mounting part 1.
, the central portion of the side surface without the element mounting portion fixing lead 3 is formed into a convex shape. Due to this planar structure, the distance between the convex portion and the lead 2 is also shortened.According to this embodiment, the thermal stress near the lower end of the side surface of the element mounting part, which is the starting point of resin cracks in semiconductor devices, can be alleviated, so cracks occur. It has the effect of suppressing Furthermore, even if a crack occurs, since the side surface shape is not a straight line but has a step, there is also the effect of suppressing the propagation of the crack along the lower end of the side surface of the element mounting portion. Note that the shape of the convex portion is not limited to the trapezoidal shape as in this embodiment, but may be any shape such as a rectangle or an arc.
Even if a minute convex portion or the like is provided in the peripheral portion, this effect will not be hindered.
次に本発明の他の実施例を第３図により説明する。この
実施例では、素子載置部固定リード３を素子載置部１の
各端部口箇所から取り出している。Next, another embodiment of the present invention will be described with reference to FIG. In this embodiment, the element mounting part fixing lead 3 is taken out from each end opening of the element mounting part 1.
そこで、素子載置部１の各側面の中央部を凸形状として
いる。この凸部の形状は第一の実施例で示したように、
矩形９円弧等どのようなものでもかまわない、この実施
例においても第２図に示した実施例と同様な効果がある
。Therefore, the central portion of each side surface of the element mounting portion 1 is formed into a convex shape. The shape of this convex portion is as shown in the first embodiment.
Any shape such as a rectangular shape and 9 circular arcs may be used, and this embodiment also has the same effect as the embodiment shown in FIG. 2.
本発明によれば、樹脂封止型半導体装置の半導体素子載
置部側面下端近傍に発生する樹脂クラックを抑止するこ
とができるので、半導体装置の耐湿信頼性を向上させる
ことができるという効果がある。According to the present invention, it is possible to suppress resin cracks that occur near the lower end of the side surface of the semiconductor element mounting portion of a resin-sealed semiconductor device, thereby improving the moisture resistance reliability of the semiconductor device. .
第１図は樹脂封止型半導体装置における素子載置部側面
下端に発生する熱応力と同側面とリードとの間隔の関係
図、第２図は本発明のリードフレームの一実施例を説明
する平面図、第３図は本発明のリードフレームの他の実
施例を説明する平面図である。
１・・・半導体素子載置部、２・・・リード、３・・・
半導体素子載置部固定リード、４・・・半導体素子、５
・・・封止樹脂、６・・・ボンディングワイヤ。
代理人 弁理士 小川勝男 ゝ・
Ｚ ｌ 口
ρ ρ、ｌ ρ、２ ρ３ ρ、４ ／ρ
ｆ子載１舒乙リードｑ間隔しくｍｍン
■ ２ 図
男 ３ 図FIG. 1 is a diagram showing the relationship between the thermal stress generated at the lower end of the side surface of the element mounting part in a resin-sealed semiconductor device and the distance between the same side surface and the lead, and FIG. 2 illustrates an embodiment of the lead frame of the present invention. A plan view and FIG. 3 are plan views illustrating another embodiment of the lead frame of the present invention. 1... Semiconductor element mounting part, 2... Lead, 3...
Semiconductor element mounting part fixed lead, 4... semiconductor element, 5
... Sealing resin, 6... Bonding wire. Agent Patent attorney Katsuo Ogawa ゝ・Z l 口ρ ρ,l ρ,2 ρ3 ρ,4 /ρ
f child loading 1 舒 ot lead q spacing mm■ 2 figure man 3 figure
Claims (1)
置部を備える半導体装置用リードフレームにおいて、素
子載置部側面の中央部の少くとも一箇所を凸形状とした
ことを特徴とする半導体装置用リードフレーム。A lead frame for a semiconductor device comprising an assembly of lead wires and an element mounting part for mounting a semiconductor element, characterized in that at least one central part of the side surface of the element mounting part is formed into a convex shape. Lead frame for equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60152233A JP2559364B2 (en) | 1985-07-12 | 1985-07-12 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60152233A JP2559364B2 (en) | 1985-07-12 | 1985-07-12 | Lead frame for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6214448A true JPS6214448A (en) | 1987-01-23 |
| JP2559364B2 JP2559364B2 (en) | 1996-12-04 |
Family
ID=15535994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60152233A Expired - Lifetime JP2559364B2 (en) | 1985-07-12 | 1985-07-12 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2559364B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4951120A (en) * | 1985-10-07 | 1990-08-21 | Hitachi, Ltd. | Lead frame and semiconductor device using the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5818948A (en) * | 1981-07-27 | 1983-02-03 | Toshiba Corp | Lead frame |
| JPS5839059U (en) * | 1981-09-09 | 1983-03-14 | 日本電気ホームエレクトロニクス株式会社 | lead frame |
| JPS61280645A (en) * | 1985-06-05 | 1986-12-11 | Hitachi Cable Ltd | Manufacture of lead frame |
-
1985
- 1985-07-12 JP JP60152233A patent/JP2559364B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5818948A (en) * | 1981-07-27 | 1983-02-03 | Toshiba Corp | Lead frame |
| JPS5839059U (en) * | 1981-09-09 | 1983-03-14 | 日本電気ホームエレクトロニクス株式会社 | lead frame |
| JPS61280645A (en) * | 1985-06-05 | 1986-12-11 | Hitachi Cable Ltd | Manufacture of lead frame |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4951120A (en) * | 1985-10-07 | 1990-08-21 | Hitachi, Ltd. | Lead frame and semiconductor device using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2559364B2 (en) | 1996-12-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6779264B2 (en) | Electronic device | |
| JP2001015668A (en) | Resin-sealed semiconductor package | |
| JPS6214448A (en) | Lead frame for semiconductor device | |
| US8836150B2 (en) | Semiconductor device | |
| US5465027A (en) | Chip-in-glass fluorescent indicator panel with heat protection | |
| JPH0223640A (en) | Resin sealed type semiconductor device | |
| JPH06342865A (en) | Lead frame for semiconductor device and resinsealed semiconductor device | |
| JPH0382059A (en) | Resin sealed type semiconductor device | |
| JPH0519958Y2 (en) | ||
| JPH01296653A (en) | Resin-sealed semiconductor device | |
| JP2751896B2 (en) | Resin-sealed semiconductor device | |
| JPS61267333A (en) | Semiconductor device | |
| JPH0228353A (en) | Resin sealed type semiconductor device | |
| JPH0254567A (en) | Resin-sealed semiconductor device | |
| KR960004101Y1 (en) | Lead frame | |
| JPH02253646A (en) | Lead frame | |
| JP2653951B2 (en) | Resin-sealed semiconductor device | |
| JPH0974163A (en) | Lead frame | |
| JPH0453241A (en) | Package | |
| JPH05166989A (en) | Resin-sealed semiconductor device | |
| JPH02133951A (en) | Resin-sealed type semiconductor device | |
| JPH06268145A (en) | Semiconductor device | |
| JPH0379066A (en) | Lead frame for semiconductor device | |
| JPS6384143A (en) | Lead frame | |
| JPH0590477A (en) | Semiconductor integrated circuit device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |