JPS6214433A - Electronic circuit device and manufacture thereof - Google Patents
Electronic circuit device and manufacture thereofInfo
- Publication number
- JPS6214433A JPS6214433A JP15252585A JP15252585A JPS6214433A JP S6214433 A JPS6214433 A JP S6214433A JP 15252585 A JP15252585 A JP 15252585A JP 15252585 A JP15252585 A JP 15252585A JP S6214433 A JPS6214433 A JP S6214433A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- solder
- processed
- solders
- worked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は電子部品と電子回路基板とをはんだで接続する
電子回路装置およびその製造方法、とくに高信頼性の向
上に好適な電子回路装置およびその製造方法に関するも
のである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an electronic circuit device that connects an electronic component and an electronic circuit board by soldering, and a method for manufacturing the same, and particularly an electronic circuit device and its manufacturing method suitable for improving high reliability. This relates to a manufacturing method.
従来の電子回路装置においては、たとえば特公昭４３−
２８７３５号公報および米国特許第３８７１０１４号明
細書に記載されている如く、半導体および部品を量産性
に優れたはんだ付けによシ回路基板に接続したものが多
く考えられている。然るに上記の場合には、はんだを完
全に溶融した状態で半導体および部品と回路基板とを接
続しているため、これらの接続部のはんだが溶融・凝固
する過程で、形をし、疲労特性が悪くなるので、使用中
の穐々のストレスによって破壌しやすくなる問題点があ
った。In conventional electronic circuit devices, for example,
As described in Japanese Patent No. 28735 and US Pat. No. 3,871,014, there are many ideas in which semiconductors and components are connected to circuit boards by soldering, which is excellent in mass production. However, in the above case, since the semiconductors and components are connected to the circuit board with the solder completely melted, the solder in these connections loses its shape and fatigue properties during the process of melting and solidifying. There was a problem in that the stress of the rice cake during use caused it to easily break.
本発明は前記従来の問題点を解決し、高信頼性のあるは
んだ接続を可能とする電子回路装置およびその製造方法
を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems and provide an electronic circuit device and a method for manufacturing the same that enable highly reliable solder connection.
本発明は前記の目的を達成するため発明したもので、そ
の発明の一つは、電子部品と、電子回路基板との間に加
工・熱処理した高融点の加工はんだおよびこの加工はん
だに対して低温で焼結できる超微粉を介挿し、上記超微
粉のみを焼結してその反応によって上記電子部品、電子
回路基板および加工はんだを接続するように構成したこ
とを特徴とし、他の発明の一つは、電子部品および電子
回路基板と、加工・熱処理した高融点の加工はんだとの
間に超微粉を介挿し、この超微粉のみを焼結してその反
応によシ上配電子部品および電子回路基板と、加工はん
だとを接続することを特徴とするものである。上記超微
粉は約０．１μｍ以下の微粒子の集合形で形成され、比
表面積が１０〜７０台で焼結が融点のη〜ｌ／３の低温
度で始まるなどの特徴を有することが知られている。（
たとえば、賀集；「金属超微粉」材料科学１７ （１９
８０） １３６参照）
本発明は、上記超微粉の低温焼結を利用し、これに非常
に軟かく、伸びが大きいので、耐疲労性が優れかつ必要
な信頼性に応じて電子部品と電子回路基板との高さを調
整しうる特性を有する加工はんだを用いて電子部品と電
子回路基板とを接続するもへのでおる。The present invention was invented to achieve the above object, and one of the inventions is a high melting point processed solder processed and heat treated between an electronic component and an electronic circuit board, and a low temperature temperature for this processed solder. Another invention characterized in that the electronic component, the electronic circuit board, and the processed solder are connected by interposing ultrafine powder that can be sintered with the ultrafine powder, sintering only the ultrafine powder, and connecting the electronic component, electronic circuit board, and processed solder by the reaction. In this method, ultrafine powder is inserted between electronic components and electronic circuit boards and processed and heat-treated processed solder with a high melting point, and only this ultrafine powder is sintered to allow the reaction to occur. It is characterized by connecting a substrate and processed solder. It is known that the above-mentioned ultrafine powder is formed in the form of an aggregate of fine particles of about 0.1 μm or less, has a specific surface area of 10 to 70, and has characteristics such as sintering starts at a low temperature of η to 1/3 of the melting point. ing. (
For example, Kashu; "Ultrafine metal powder" Materials Science 17 (19
80) Refer to 136) The present invention utilizes low-temperature sintering of the above-mentioned ultrafine powder, and since it is extremely soft and has high elongation, it has excellent fatigue resistance and can be used for electronic parts and electronic circuits according to the required reliability. The present invention is directed toward connecting electronic components and electronic circuit boards using processed solder that has the property of being able to adjust the height with respect to the board.
以下、本発明の実施例を示す第１図乃至第３図について
述べる。第１図は本発明の実施例を示す電子回路の斜視
図、第２図は第１図のＡ −Ａ’矢視拡大断面図、第３
図は接合プロセスを示す説明図である。同図においてｌ
は半導体チップ、２は基板にして、アルミナセラミック
スなどにて形成す）れている。３．４は電極にして、た
とえばＷ −Ｎ １−Ａｕから形成されている。５は加
工はんだにして、９５ｐｂ ｓｓｎ （重量パーセント
）のはんだを予じめ冷間圧延・熱処理して均質化すると
ともに所定の形状に成形されている。６は超微粉にして
、平均粒径８００Ａ’のｇ５ｐｂ ５Ｓｎで形成され、
焼結が上記加工はんだ５に比較して低温の２００〜２５
０’Ｃで開始する。つぎに第３図により接合プロセスに
ついて述べる。同図（ａ）に示す如く、基板２に形成さ
れた電極３上に超微粉６をメタルマスク（図示せず）を
介して供給する。ついで同図ｆｂ）Ｋ示す如く超微粉６
上の所定位置に加工はんだ５を供給したのち、約２３０
″Ｃｔで加熱して超微粉６のみ焼結を開始させ、その反
応によシ基板２と加工はんだ５とを接続する。同様にし
て半導体チップｌ上に形成され、た電極４上に超微粉６
を供給し、この超微粉６の所定位置に加工はんだ５を供
給したのち、約２３０°Ｃまで加熱して超微粉６のみ焼
結を開始させ、その反応によシ半導体チップｌと加工は
んだ５とを接続すると、同図（Ｃ）に示す如く、半導体
チップｌを加工はんだ５を介して基板２上に接続するこ
とができる。つぎに上記によって炸裂された試料を一５
５°〜＋１５０°Ｃ，１サイクル／ｌｈで温度サイクル
試験を行なって、その寿命評価をした結果、従来のもの
に比較して約５倍の長寿命を達成することができた。ま
た異種部材を接合する他の材料系においても同様な結果
を期待することができた。1 to 3 showing embodiments of the present invention will be described below. FIG. 1 is a perspective view of an electronic circuit showing an embodiment of the present invention, FIG. 2 is an enlarged sectional view taken along arrow A-A' in FIG. 1, and FIG.
The figure is an explanatory diagram showing the joining process. In the same figure, l
2 is a semiconductor chip, and 2 is a substrate, which is made of alumina ceramics or the like. 3.4 is an electrode, which is made of, for example, W-N 1-Au. 5 is processed solder, which is made of 95 pb ssn (weight percent) solder which is homogenized by cold rolling and heat treatment in advance and is formed into a predetermined shape. 6 is made of ultra-fine powder and made of g5pb 5Sn with an average particle size of 800A',
The sintering temperature is 200 to 25, which is lower than the processed solder 5 above.
Start at 0'C. Next, the bonding process will be described with reference to FIG. As shown in FIG. 2A, ultrafine powder 6 is supplied onto electrodes 3 formed on substrate 2 through a metal mask (not shown). Next, as shown in the same figure fb) K, ultrafine powder 6
After supplying processed solder 5 to the predetermined position above, approximately 230
The ultrafine powder 6 is heated with Ct to start sintering, and the reaction connects the substrate 2 and the processed solder 5.In the same way, the ultrafine powder is formed on the semiconductor chip l and on the electrode 4. 6
After supplying the processed solder 5 to a predetermined position of the ultrafine powder 6, it is heated to about 230°C to start sintering only the ultrafine powder 6, and through the reaction, the semiconductor chip l and the processed solder 5 are By connecting these, the semiconductor chip 1 can be connected to the substrate 2 via the processed solder 5, as shown in FIG. Next, 15 samples exploded as described above.
A temperature cycle test was carried out at 5° to +150°C, 1 cycle/lh, and the lifespan was evaluated. As a result, it was possible to achieve a lifespan approximately 5 times longer than that of conventional products. Similar results could also be expected for other material systems used to join dissimilar members.
本発明は以上述べたる如く、軟かくかつ延性および検力
特性のすぐれた加工はんだを溶融しないで、これと同一
組成の超微粉のみの焼結反応によシミ子部品と基板とを
接続するものであるから、高信頼性の電子回路装置を得
ることができ、かつ今後ますます高信頼度が要求される
電子回路装置における面付実装部分に実施したとき、高
機能化・に大きな貢献をすることができる効果を有する
。As described above, the present invention connects a shim element component and a substrate by a sintering reaction of only ultrafine powder having the same composition as the processed solder, which is soft and has excellent ductility and test force characteristics, without melting it. Therefore, it is possible to obtain highly reliable electronic circuit devices, and when implemented in surface mounting parts of electronic circuit devices that will require increasingly high reliability in the future, it will greatly contribute to higher functionality. It has the effect that it can.
第１図は本発明の実施例を示す電子回路装置の斜視図、
第２図は第１図のＡ−Ａ矢視断面拡大図、大３図は本発
明による電子回路装置の接合プロセスを示す説明図。
ｌ・・・半導体チップ、２・・・基板、３．４・・・Ｋ
ｍ、５・・・加工はんだ、６・・・超微粉。
代理人 弁理士 秋 本 正 実
第１図
第２図FIG. 1 is a perspective view of an electronic circuit device showing an embodiment of the present invention;
FIG. 2 is an enlarged cross-sectional view taken along the line A-A in FIG. 1, and FIG. 3 is an explanatory diagram showing a bonding process for an electronic circuit device according to the present invention. l...Semiconductor chip, 2...Substrate, 3.4...K
m, 5...processed solder, 6...ultra fine powder. Agent Patent Attorney Tadashi Akimoto Figure 1 Figure 2
Claims (1)
子回路装置において、上記電子部品と、電子回路基板と
の間に、上記はんだとして加工・熱処理した高融点の加
工はんだおよびこの加工はんだよりも低温焼結可能な超
微粉を介挿し、この超微粉のみを局部的に焼結してその
反応により電子部品、電子回路基板および加工はんだを
接続するようにしたことを特徴とする電子回路装置。 ２、前記超微粉は、前記加工はんだと同一組成で形成さ
れていることを特徴とする特許請求の範囲第１項記載の
電子回路装置。 ３、電子部品をはんだで電子回路基板に接続する電子回
路の製造方法において、上記はんだを加工・熱処理した
高融点の加工はんだと、上記電子部品および電子回路基
板との間に低温焼結可能な超微粉を介挿し、この超微粉
のみを焼結してその反応より電子部品および電子回路基
板と、加工はんだとを接続することを特徴とする電子回
路の製造方法。[Scope of Claims] 1. In an electronic circuit device in which an electronic component and an electronic circuit board are connected by solder, a high-melting-point processed and heat-treated solder is provided between the electronic component and the electronic circuit board. By inserting solder and ultrafine powder that can be sintered at a lower temperature than the processed solder, only this ultrafine powder is locally sintered, and the reaction connects electronic components, electronic circuit boards, and processed solder. Characteristic electronic circuit device. 2. The electronic circuit device according to claim 1, wherein the ultrafine powder has the same composition as the processed solder. 3. In a method of manufacturing an electronic circuit in which electronic components are connected to an electronic circuit board by soldering, a high melting point processed solder obtained by processing and heat treating the above solder and the above electronic component and the electronic circuit board can be sintered at low temperature. A method for manufacturing an electronic circuit, which comprises inserting ultrafine powder, sintering only this ultrafine powder, and connecting electronic components and electronic circuit boards with processed solder through the reaction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15252585A JPS6214433A (en) | 1985-07-12 | 1985-07-12 | Electronic circuit device and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15252585A JPS6214433A (en) | 1985-07-12 | 1985-07-12 | Electronic circuit device and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214433A true JPS6214433A (en) | 1987-01-23 |
Family
ID=15542340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15252585A Pending JPS6214433A (en) | 1985-07-12 | 1985-07-12 | Electronic circuit device and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214433A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5075965A (en) * | 1990-11-05 | 1991-12-31 | International Business Machines | Low temperature controlled collapse chip attach process |
| US5729440A (en) * | 1995-05-25 | 1998-03-17 | International Business Machines Corporation | Solder hierarchy for chip attachment to substrates |
| US7569164B2 (en) * | 2007-01-29 | 2009-08-04 | Harima Chemicals, Inc. | Solder precoating method |
-
1985
- 1985-07-12 JP JP15252585A patent/JPS6214433A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5075965A (en) * | 1990-11-05 | 1991-12-31 | International Business Machines | Low temperature controlled collapse chip attach process |
| US5729440A (en) * | 1995-05-25 | 1998-03-17 | International Business Machines Corporation | Solder hierarchy for chip attachment to substrates |
| US7569164B2 (en) * | 2007-01-29 | 2009-08-04 | Harima Chemicals, Inc. | Solder precoating method |
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