JPS62143321A - Manufacture of resin mold bushing - Google Patents
Manufacture of resin mold bushingInfo
- Publication number
- JPS62143321A JPS62143321A JP28397785A JP28397785A JPS62143321A JP S62143321 A JPS62143321 A JP S62143321A JP 28397785 A JP28397785 A JP 28397785A JP 28397785 A JP28397785 A JP 28397785A JP S62143321 A JPS62143321 A JP S62143321A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- shield electrode
- grounding shield
- cylindrical body
- center conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulators (AREA)
- Insulating Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[発明の技術分野]
本発明は、取付用のフランジを一体に有する合成樹脂製
のモールド層内に、中心導体とこの中心導体と同心状の
接地用シールド電極とを埋め込んでなる樹脂モールドブ
ッシングの製造方法に関する。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention includes a center conductor and a grounding shield electrode concentric with the center conductor in a synthetic resin molded layer integrally having a mounting flange. The present invention relates to a method of manufacturing an embedded resin molded bushing.
[発明の技術的背景とその間厘点]
従来、樹脂モールドブッシングは第5図に示すように取
付用フランジ1を一体に有した合成樹脂製のモールド層
2内に、中心導体3とこの中心導体3と同心状に金網に
より円筒状に形成された接地用シールド電極4とを埋め
込むとともに、この接地用シールド電極4の外周部に接
続線5を蝋付けし、この接続線5の先端部に同じく蝋付
けにより取着した取付は孔兼用のリング状の接地端子6
を前記取付用フランジ2内に埋め込んでいる。そして、
このモールドブッシングを製造する方法としては、第6
図に示すように、成形金型7を上型7a及び下型7bで
構成し、まず型合せ前の下型7bの中心部に中心導体3
を挿入するとともに、接地端子6.6を下型7bに立設
したガイドビン7c、7cに嵌め込むことにより接地用
シールド電極4を接続線5を介して中心導体3と同心状
に支持する。つぎに、上型7aを下型7bの上部にセッ
トし、フランジ成形用四部7dの上面部で接地端子6,
6の上端部を押え、且つ中心導体3の上端部を保持金具
7eで同心状に保持し、そして上型7a及び下型7bで
形成される空間部に合成樹脂を注入してモールド層2を
成形し、以て樹脂モールドブッシングを成形している。[Technical Background of the Invention and Points Therebetween] Conventionally, as shown in FIG. 5, a resin molded bushing has a central conductor 3 and a central conductor in a synthetic resin molded layer 2 integrally having a mounting flange 1. A grounding shield electrode 4 formed in a cylindrical shape with a wire mesh is embedded concentrically with the grounding shield electrode 4, and a connecting wire 5 is brazed to the outer periphery of the grounding shield electrode 4. A ring-shaped grounding terminal 6 that doubles as a hole is attached by brazing.
is embedded in the mounting flange 2. and,
As a method for manufacturing this molded bushing, the sixth method is
As shown in the figure, the molding die 7 is composed of an upper mold 7a and a lower mold 7b, and first, a center conductor 3 is placed in the center of the lower mold 7b before molding.
At the same time, the grounding shield electrode 4 is supported concentrically with the center conductor 3 via the connecting wire 5 by fitting the grounding terminal 6.6 into guide pins 7c, 7c set upright on the lower mold 7b. Next, the upper mold 7a is set on the upper part of the lower mold 7b, and the ground terminal 6,
6 and the upper end of the center conductor 3 is held concentrically with the holding fitting 7e, and a synthetic resin is injected into the space formed by the upper mold 7a and the lower mold 7b to form the mold layer 2. The resin molded bushing is then molded.
然しなから、接地用シールド電極4は細線を編組した全
網製のもので自体の強度が弱いため、モールド層2の成
形時に注入された樹脂に押されて変形したり移動したり
し易く、中心導体3との同心状態が保たれないという問
題点がある。これを解決するため、第7図に示すように
接地用シールド電極4の外周部に複数個例えば4個のリ
ング状の金属製補強線8をロー付けして接地用シールド
電極4を補強し、その剛性を増加したものが供されてい
るが、この場合にはモールド層2の成形特合成樹脂が硬
化後に冷却されてゆく過程において、補強線8の剛性が
大で且つモールド層2と収縮量差があるため、これがモ
ールド層2の収縮を阻止するように作用して、モールド
層2内に発生ずる残留応力が大きくなり、その後の過電
流強度試験及びヒートサイクル試験の際、または使用時
の加熱冷却の繰返しによりクラック等が発生するという
新たな問題点を生ずる。However, since the grounding shield electrode 4 is made entirely of braided wire and has low strength, it is easily deformed or moved by the resin injected during molding of the mold layer 2. There is a problem that the concentric state with the center conductor 3 cannot be maintained. In order to solve this problem, as shown in FIG. 7, a plurality of ring-shaped metal reinforcing wires 8, for example four, are brazed to the outer circumference of the grounding shield electrode 4 to reinforce the grounding shield electrode 4. A version with increased rigidity is provided, but in this case, the stiffness of the reinforcing wire 8 is large and the shrinkage amount is greater than that of the mold layer 2 in the process of cooling the molded special synthetic resin of the mold layer 2 after hardening. Because of the difference, this acts to prevent the shrinkage of the mold layer 2, increasing the residual stress generated within the mold layer 2, and causing stress during subsequent overcurrent strength tests and heat cycle tests, or during use. A new problem arises in that cracks and the like occur due to repeated heating and cooling.
[発明の目的]
本発明は、」二記の事情に鑑みてなされたもので、その
目的は、゛モールド層の成形時における接地用シールド
電極の移動や変形を防止して中心導体との同心状態を保
ち得、且つ伸縮によりモールド層に発生する応力を極力
小さくして、クラック等の発生を防止し得る樹脂モール
ドブッシングの製造方法を提供するにある。[Object of the Invention] The present invention has been made in view of the following two circumstances, and the object thereof is to prevent the grounding shield electrode from moving or deforming during molding of the mold layer, and to prevent the grounding shield electrode from moving or deforming so that it is concentric with the center conductor. It is an object of the present invention to provide a method for manufacturing a resin molded bushing that can maintain its condition and minimize the stress generated in the mold layer due to expansion and contraction, thereby preventing the occurrence of cracks and the like.
[発明の概要]
本発明は、接地用シールド電極を外周部に保持突部を突
設した合成樹脂製の筒状体に一体モールドし、金型内に
前記接地用シールド電極と一体の筒状体及び中心導体を
同心に配設するとともに筒状体の前記保持突部を金型の
フランジ成形用凹部内に保持し、然る後、前記金型内に
合成樹脂を注入してモールド層を成形するようにしたも
ので、筒状体により接地用シールド電極を補強するとと
もに、保持突部により接地用シールド電極を中心導体と
同心状態に保持し、且つモールド層と筒状体との収縮量
差を小さくすることができて、モールド層の応力の減少
化を図ったところに特徴を有する。[Summary of the Invention] The present invention provides a method in which a grounding shield electrode is integrally molded into a synthetic resin cylindrical body having a holding protrusion protruding from the outer periphery, and a cylindrical body integral with the grounding shield electrode is placed in the mold. The body and the center conductor are arranged concentrically, and the holding protrusion of the cylindrical body is held in the flange molding recess of the mold, and then a synthetic resin is injected into the mold to form a mold layer. The cylindrical body reinforces the grounding shield electrode, the holding protrusion holds the grounding shield electrode concentrically with the center conductor, and the amount of shrinkage between the mold layer and the cylindrical body is reduced. The feature is that the difference can be made small and the stress in the mold layer can be reduced.
[発明の実施例] −
以下、本発明の一実施例につき第ニス乃至第4図を参照
して説明する。[Embodiment of the Invention] - Hereinafter, an embodiment of the present invention will be described with reference to Varnish No. 4 to FIG.
先ず第2図において、11は中心導体、12は中心導体
11の外周に間隔を存して同心状に配置された接地用シ
ールド電極で、これは細線を編組した金網により円筒状
に形成され、その両端部12aが円弧状に曲成されてい
る。13は第4図に゛ 示すように接地用シールド電極
12の外周部を覆うように可撓性ある合成樹脂により所
謂インサート成形によって該電極12と一体となるよう
に形成された筒状体で、これの両端は接地用シールド電
極12と同心状のリング部13aとして形成され、この
リング部13aの外周囲には凹欠部13bがm数個例え
ば4個形成されている。14は筒状体13の外周部略中
央に突設され先端を球状に形成したm数個例えば4個の
保持突部である。15は保持突部14内に埋め込まれた
接続線で、これの一端部は第3図にも示すように接地用
シールド電極12に蝋付けされており、他端部は取付は
孔兼用のりジグ状の接地端子16に接続されている。1
7は中心導体11.接地用シールド電極12、筒状体1
3.保持突部14及び接地端子16を埋め込むようにエ
ポキシ樹脂等の合成樹脂で成形されたモールド層で、こ
の−ルド層17の外周部の略中央即ち接地用シールド電
極12の外方に取付用フランジ18が一体に形成されて
おり、この取付用フランジ18内に接地端子16を配置
しており、以て樹脂モールドブッシング19を構成して
いる。First, in FIG. 2, 11 is a center conductor, and 12 is a grounding shield electrode arranged concentrically at intervals around the outer periphery of the center conductor 11, which is formed into a cylindrical shape by a wire mesh made of braided fine wires. Both ends 12a are curved into an arc shape. 13 is a cylindrical body formed integrally with the grounding shield electrode 12 by so-called insert molding using a flexible synthetic resin so as to cover the outer periphery of the grounding shield electrode 12, as shown in FIG. Both ends of this are formed as a ring part 13a concentric with the grounding shield electrode 12, and m number of recessed parts 13b, for example four, are formed around the outer periphery of this ring part 13a. Reference numeral 14 designates m number of, for example, four, holding protrusions which are protruded from approximately the center of the outer circumference of the cylindrical body 13 and have spherical tips. Reference numeral 15 denotes a connecting wire embedded in the holding protrusion 14, one end of which is soldered to the grounding shield electrode 12 as shown in FIG. It is connected to the ground terminal 16 of the shape. 1
7 is the center conductor 11. Grounding shield electrode 12, cylindrical body 1
3. A molded layer made of synthetic resin such as epoxy resin so as to embed the holding protrusion 14 and the grounding terminal 16, and a mounting flange is provided approximately in the center of the outer circumferential portion of this lead layer 17, that is, on the outside of the grounding shield electrode 12. 18 is integrally formed, and a ground terminal 16 is disposed within this mounting flange 18, thereby forming a resin molded bushing 19.
つぎに樹脂モールドブッシング19の製造方法につき1
悦明する。第1図において、20は下型21と上型22
とによって構成されたモールド層17成形用の金型であ
り、上型22を上方に移動させた型開き状態において、
まず下型21の内底部中心の嵌合孔21aに中心導体1
1の下端部を挿入支持する。つぎに予めインサート成形
により接地用シールド電極12と一体モールドされた筒
状体13をその下端のリング部13aを下型21の内面
部21bに接触させるようにして保持突部14の先端を
下型21の上端面に載置し、且つ接地端子16を下型2
1の上端面に立設したガイドビン23に1茨め込み、以
て接地用シールド電極12を中心導体11と同心状にセ
ットする。つぎに1−!!!22をその内面部22aに
筒状体13の」一端のリング部13aを接触させるよう
に下型21の」二部に型合せし、そのフランジ成形用四
部22bの」二端面で保持突部14の先端及び接地端子
16の上端部を押え保持する。また、上型22の上部に
矩形状の保持金具24を取付け、この保持金具24の孔
24aに中心導体11の上端部を挿入支持する。これに
より中心導体11及び接地用シールド電極12は金型2
0内に同心状態に保持される。Next, 1 regarding the manufacturing method of the resin molded bushing 19.
Be happy. In FIG. 1, 20 is a lower mold 21 and an upper mold 22.
This is a mold for molding the mold layer 17, and in an open state with the upper mold 22 moved upward,
First, insert the center conductor 1 into the fitting hole 21a at the center of the inner bottom of the lower mold 21.
Insert and support the lower end of 1. Next, the cylindrical body 13, which has been integrally molded with the grounding shield electrode 12 by insert molding in advance, is brought into contact with the inner surface 21b of the lower mold 21 so that the ring portion 13a at the lower end of the cylindrical body 13 is brought into contact with the inner surface 21b of the lower mold 21, and the tip of the holding protrusion 14 is attached to the lower mold. 21, and the ground terminal 16 is placed on the upper end surface of the lower mold 2.
The grounding shield electrode 12 is set concentrically with the center conductor 11 by inserting the grounding shield electrode 12 into the guide pin 23 erected on the upper end surface of the electrode 1 . Next 1-! ! ! 22 is molded to the second part of the lower mold 21 so that the ring part 13a at one end of the cylindrical body 13 is brought into contact with the inner surface 22a, and the holding protrusion 14 is attached to the second end surface of the four flange forming parts 22b. and the upper end of the ground terminal 16. Further, a rectangular holding fitting 24 is attached to the upper part of the upper mold 22, and the upper end portion of the center conductor 11 is inserted and supported into the hole 24a of this holding fitting 24. As a result, the center conductor 11 and the grounding shield electrode 12 are connected to the mold 2.
It is held concentrically within 0.
然る後、上型22の内面部22aと保持金具24との間
に存在する開口部分から金型20内に樹脂を注入して取
付用フランジ18を一体に有したモールド層17を成形
して樹脂モールドブフランジ19を製造する。この場合
、金型2o内に注入された樹脂は、筒状体13のリング
部13aに形成された凹欠部13bから該筒状体重3の
外側に浸入し、取付用フランジ18として成形される。After that, resin is injected into the mold 20 through the opening between the inner surface 22a of the upper mold 22 and the holding fitting 24 to form a mold layer 17 that integrally has the mounting flange 18. A resin molded flange 19 is manufactured. In this case, the resin injected into the mold 2o enters the outside of the cylindrical body 3 through the recessed part 13b formed in the ring part 13a of the cylindrical body 13, and is molded as the mounting flange 18. .
上記した樹脂モールドブッシング19の製造方法におい
ては、金型20内のフランジ成形用四部22b内に筒状
体13の保持突部14を嵌合保持させることにより、接
地用シールド電極12が中心導体11と同心状態に保持
されるので、モールド層17及び取付用フランジ18を
成形するとき注入された樹脂により接地用シールド電極
12が移動されることがない。更に、接地用シールド電
極12は筒状体13に予め一体化されていることにより
補強されているので、注入された樹脂により押圧されて
も変形することがなく、中心導体11と接地用シールド
電極12との同心状態が正常に保持できる。また、筒状
体13は合成樹脂製で可撓性が比較的良好であるため、
モールド層17の成形時における合成樹脂の収縮や、使
用時における加熱冷却に伴うモールド層17の伸縮に順
応して伸縮できるので、金属製の補強線9によって補強
された従来とは異なり、モールド層17に発生する応力
を極力小さくすることができ、過電流試験及びヒートサ
イクル試験が行なわれたり、または使用時に加熱冷却が
繰返えされた場合にもモールド層17にクラック等が発
生することを防止できる。In the method for manufacturing the resin molded bushing 19 described above, the holding protrusion 14 of the cylindrical body 13 is fitted and held within the four flange forming parts 22b in the mold 20, so that the grounding shield electrode 12 is connected to the center conductor 11. Since the grounding shield electrode 12 is held concentrically with the grounding shield electrode 12, the grounding shield electrode 12 is not moved by the resin injected when molding the mold layer 17 and the mounting flange 18. Furthermore, since the grounding shield electrode 12 is reinforced by being integrated into the cylindrical body 13 in advance, it will not deform even when pressed by the injected resin, and the center conductor 11 and the grounding shield electrode The concentric state with 12 can be maintained normally. In addition, since the cylindrical body 13 is made of synthetic resin and has relatively good flexibility,
The mold layer 17 can expand and contract according to the contraction of the synthetic resin during molding and the expansion and contraction of the mold layer 17 due to heating and cooling during use. The stress generated in the mold layer 17 can be minimized, and cracks etc. will not occur in the mold layer 17 even when overcurrent tests and heat cycle tests are performed, or when heating and cooling are repeated during use. It can be prevented.
[発明の効果コ
本発明は、以上の説明から明らかなように、接地用シー
ルド電極を外周部に保持突部を突設した合成樹脂製の筒
状体に一体モールドし、金型内にこの接地用シールド電
極と一体の筒状体及び中心導体を同心に配設すると共に
筒状体の前記保持突部を金型のフランジ成形用凹部内に
保持し、然る後、前記金型内に樹脂を注入して前記モー
ルド層を成形するようにしたので、接地用シールド?f
S、I4の移動や変形を防止し得て中心導体との同心状
態を保ち得、且つモールド層と筒状体との伸縮量差を小
さくしてモールド層に発生する応力を減少しクラック等
が生ずることを防止し得るという効果を奏する。[Effects of the Invention] As is clear from the above description, the present invention is such that a grounding shield electrode is integrally molded into a synthetic resin cylindrical body with a holding protrusion protruding from the outer periphery, and this is placed in a mold. A cylindrical body integral with a grounding shield electrode and a center conductor are disposed concentrically, and the holding protrusion of the cylindrical body is held in a flange forming recess of a mold, and then the cylindrical body is placed in the mold. Since the mold layer is formed by injecting resin, is it a grounding shield? f
It is possible to prevent the movement and deformation of S and I4 and maintain a concentric state with the center conductor, and to reduce the difference in the amount of expansion and contraction between the mold layer and the cylindrical body, reducing stress generated in the mold layer and preventing cracks, etc. This has the effect of preventing this from occurring.
第1図乃至第4図は本発明の一実施例を示すもので、第
1図は製造過程における縦断面図、第2図は樹脂モール
ドブッシングの縦断面図、第3図は第2図中■−■線に
沿う縦断面図、第4図は筒状体の斜視図であり、第5図
は従来例を示す第2図相当図、第6図は同従来例の第1
図相当図、第7図は他の従来例を示す第1図相当図であ
る。
図中、11は中心導体、12は接地用シールド電極、1
3は筒状体、14は保持突部、17はモールド層、18
は取付用フランジ、19は樹脂モールドブッシング、2
0は金型、22bはフランジ成形用四部を示す。
8伽劉
第3図
第4図
第5図
7皇
第 6 図、。Figures 1 to 4 show an embodiment of the present invention. Figure 1 is a longitudinal cross-sectional view of the manufacturing process, Figure 2 is a longitudinal cross-sectional view of a resin molded bushing, and Figure 3 is a cross-sectional view of the resin molded bushing. Fig. 4 is a perspective view of the cylindrical body, Fig. 5 is a view corresponding to Fig. 2 showing a conventional example, and Fig. 6 is a view corresponding to Fig. 1 of the conventional example.
FIG. 7 is a diagram equivalent to FIG. 1 showing another conventional example. In the figure, 11 is the center conductor, 12 is the grounding shield electrode, 1
3 is a cylindrical body, 14 is a holding protrusion, 17 is a mold layer, 18
is a mounting flange, 19 is a resin molded bushing, 2
0 indicates a mold, and 22b indicates four parts for flange forming. 8 Garyu Figure 3 Figure 4 Figure 5 Figure 7 Emperor Figure 6.
Claims (1)
製のモールド層内に、中心導体とこの中心導体と同心状
の接地用シールド電極とを埋め込んでなる樹脂モールド
ブッシングを製造する方法において、前記接地用シール
ド電極を外周部に保持突部を突設した合成樹脂製の筒状
体に一体モールドし、金型内に前記接地用シールド電極
と一体の筒状体及び中心導体を同心に配設するとともに
筒状体の前記保持突部を金型の前記フランジ成形用凹部
内に保持し、然る後、前記金型内に合成樹脂を注入して
前記モールド層を成形するようにして成る樹脂モールド
ブッシングの製造方法。1. A method for manufacturing a resin molded bushing in which a center conductor and a grounding shield electrode concentric with the center conductor are embedded in a synthetic resin mold layer that integrally has a mounting flange on the outer periphery, The grounding shield electrode is integrally molded into a cylindrical body made of synthetic resin with a holding protrusion protruding from the outer periphery, and the cylindrical body integral with the grounding shield electrode and the center conductor are arranged concentrically within the mold. At the same time, the holding protrusion of the cylindrical body is held in the flange forming recess of the mold, and then a synthetic resin is injected into the mold to mold the mold layer. Method for manufacturing resin molded bushings.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28397785A JPS62143321A (en) | 1985-12-17 | 1985-12-17 | Manufacture of resin mold bushing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28397785A JPS62143321A (en) | 1985-12-17 | 1985-12-17 | Manufacture of resin mold bushing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62143321A true JPS62143321A (en) | 1987-06-26 |
Family
ID=17672683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28397785A Pending JPS62143321A (en) | 1985-12-17 | 1985-12-17 | Manufacture of resin mold bushing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62143321A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010514395A (en) * | 2006-12-20 | 2010-04-30 | アーベーベー・リサーチ・リミテッド | Bushing and method for manufacturing the bushing |
JP2012119159A (en) * | 2010-11-30 | 2012-06-21 | Toshiba Corp | Insulation supporting device and method of manufacturing the same |
WO2014045611A1 (en) * | 2012-09-18 | 2014-03-27 | 三菱電機株式会社 | Resin molded bushing and switch |
-
1985
- 1985-12-17 JP JP28397785A patent/JPS62143321A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010514395A (en) * | 2006-12-20 | 2010-04-30 | アーベーベー・リサーチ・リミテッド | Bushing and method for manufacturing the bushing |
JP2012119159A (en) * | 2010-11-30 | 2012-06-21 | Toshiba Corp | Insulation supporting device and method of manufacturing the same |
WO2014045611A1 (en) * | 2012-09-18 | 2014-03-27 | 三菱電機株式会社 | Resin molded bushing and switch |
CN104641439A (en) * | 2012-09-18 | 2015-05-20 | 三菱电机株式会社 | Resin molded bushing and switch |
US9318887B2 (en) | 2012-09-18 | 2016-04-19 | Mitsubishi Electric Corporation | Resin molded bushing and switchgear |
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