JPS62142512U - - Google Patents
Info
- Publication number
- JPS62142512U JPS62142512U JP3073386U JP3073386U JPS62142512U JP S62142512 U JPS62142512 U JP S62142512U JP 3073386 U JP3073386 U JP 3073386U JP 3073386 U JP3073386 U JP 3073386U JP S62142512 U JPS62142512 U JP S62142512U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- guide pin
- chuck portion
- holds
- setting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示すモールド成形
装置の正面図、第２図は従来のモールド成形装置
の正面図、第３図は第２図の側面図、第４図及び
第５図は第２図における動作説明図、第６図は第
１図の側面図である。
１……モールド成形金型、２……上金型、３…
…下金型、１０……ローダー、１１……チヤツク
部、２０……リードフレーム、４０……キヤビテ
イ部、４１……ガイドピン、４３……セツト部材
、４５……移動装置。
Fig. 1 is a front view of a mold forming apparatus showing an embodiment of the present invention, Fig. 2 is a front view of a conventional mold forming apparatus, Fig. 3 is a side view of Fig. 2, and Figs. 4 and 5. is an explanatory diagram of the operation in FIG. 2, and FIG. 6 is a side view of FIG. 1. 1...Mold molding die, 2...Upper mold, 3...
... lower mold, 10 ... loader, 11 ... chuck section, 20 ... lead frame, 40 ... cavity section, 41 ... guide pin, 43 ... setting member, 45 ... moving device.
Claims (1)
を有するモールド成形金型と、 前記リードフレームを着脱自在に把持するチヤ
ツク部を有し、前記ガイドピンの位置まで前記リ
ードフレームを搬送するローダーとを備えたモー
ルド成形装置において、 前記ガイドピンと所定の位置関係を有しそのガ
イドピンの上方位置で前記リードフレームを支持
する上下動自在のセツト部材と、 前記セツト部材を上下動させそのセツト部材の
下降時に該セツト部材に支持された前記リードフ
レームを前記ガイドピン側に転送させる移動装置
とを、 設けたことを特徴とするモールド成形装置。[Claims for Utility Model Registration] A molding die having a guide pin that locks the lead frame in a fixed position, and a chuck portion that detachably holds the lead frame, and the lead frame is provided with a chuck portion that holds the lead frame in a removable manner, and the lead frame is moved to the position of the guide pin. A mold forming apparatus comprising a loader for conveying a frame, a set member having a predetermined positional relationship with the guide pin and supporting the lead frame at a position above the guide pin, the set member being vertically movable; and a moving device for moving the lead frame supported by the setting member to the guide pin side when the setting member is lowered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3073386U JPS62142512U (en) | 1986-03-04 | 1986-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3073386U JPS62142512U (en) | 1986-03-04 | 1986-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62142512U true JPS62142512U (en) | 1987-09-08 |
Family
ID=30835814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3073386U Pending JPS62142512U (en) | 1986-03-04 | 1986-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62142512U (en) |
-
1986
- 1986-03-04 JP JP3073386U patent/JPS62142512U/ja active Pending
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