JPS62140829A - Laminated sheet and its preparation - Google Patents

Abstract

PURPOSE:To make adhesive strength and productivity higher without polishing an adhesive surface by preparing a rough surface for an adhesive surface with flexible print base and by overlaying a convexo-concave release paper on one surface of a laminate made of pieces of prepreg when they are heated and pressed. CONSTITUTION:A laminated 4 consisting of laminated pieces of prepreg 3 prepared by impregnating a base material such as a woven synthetic cloth with a resin vanish and drying it, and a release paper 5 with a convexo-concave surface what is called a mat-treated release paper overlapped on the upper surface of this laminated 4 are one set of the layer. A laminated sheet A is produced by laying sets of the layer between hot plates of the plate die 7 and by laminating them in one piece by applying heat and pressure. The release paper side 5 of this laminated sheet A is an adhesive surface 2 with a convexo- concave surface 6. This convexo-concave surface 6 has 5mu or desirably 10mu in depth. This laminated sheet A is adhered to the flexible print base 1 based on a polyester film, a polyimide film, etc. on the rough adhesive surface 2 of the convexo-concave 6 by using a thermosetting adhesive 8 to become a back material.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an 82N board used as a backing material for a 7-lexiple printed circuit board and a method for manufacturing the same.

[Background technology 1 Conventionally, a backing material such as an aluminum plate or a normal laminate board is attached with an adhesive to reinforce a flexible printed circuit board, but it is difficult to bond this backing material and a 7 lexiple printed circuit board. You have to sand the backing material to increase its strength and that's it! The number of la steps was increased, resulting in low productivity.

[Objective of the Invention 1 The present invention has been made in view of the above-mentioned circumstances, and its purpose is to eliminate the need for polishing the adhesive surface when used as a backing material for a 7 lexiple printed circuit board. To provide a laminate that can be used as is and can increase productivity. - [Disclosure of the Invention] The laminate of the present invention is a laminate used as a backing material for a flexible printed circuit board 1, and is characterized in that the bonding surface 2 to the flexible printed circuit board 1 is a rough surface. In addition, the method for manufacturing a laminate of the present invention is a method for manufacturing a laminate in which a plurality of prepregs 3 formed by impregnating a base material with resin varnish and drying are stacked and heated and pressed. This is characterized in that a release paper 5 with irregularities is layered on one side of a stack 4 of a plurality of prepregs 3 during pressing, and with this configuration, the above object can be achieved. That is, by adhering the laminate A to the 7-lexiple printed circuit board 1 using the adhesive surface 2, the adhesive strength between the laminate A and the 7-lexiple printed circuit board 1 can be increased without requiring a conventional polishing process. (It is possible,
Furthermore, according to the manufacturing method of the present invention, the unevenness 6 can be formed on one side of the laminate A using the release paper 5, and the laminate A, which has a rough adhesive surface to the lexical printed circuit board 1, can be easily and sensibly processed. It ends with a dispatch.

Hereinafter, the present invention will be explained in detail based on the accompanying drawings. Prepreg 3 is formed by impregnating a base material such as glass cloth, asbestos paper, or synthetic fiber cloth with a resin varnish made of thermosetting resin or thermoplastic resin such as 7 ether, unsaturated polyester, or epoxy resin, and drying it. This is what I did. A plurality of sheets of this prepreg 3 are stacked, and this stacked body 4
A release paper 5 with irregularities on the upper surface, so-called matte release paper, is layered, and a plurality of sets of this paper are placed between heating plates via a plate mold 7, for example, 150 to 1).
The laminate A is manufactured by heating and pressing at 0° C. or higher at 20 to 150 kg/cm” for 40 to 100 minutes to integrate the laminate.

The release paper 5111 of this laminate A has an adhesive surface 2 having irregularities 6. This unevenness 6 is 5μ, preferably 1Gμ
It is. This laminate A is bonded to a 7 lexiple printed circuit board 1 based on polyester film, polyimide film, etc. via a thermosetting adhesive 8 on an adhesive surface 2 which is roughened with unevenness 6. Use as backing material.

Next, examples of the present invention will be specifically described.

(Example 1) Four sheets of prepreg formed by impregnating and drying a phenol resin were stacked, and a mold release #1 (triacetyl cellulose mat film made by Fu± Film, trade name "7 Shitaku Kumat") was stacked on one side and pressure was applied. A laminate having a thickness of 0.81 mm was obtained by heat molding.

Remove the release paper from this laminate, cut it to a predetermined size, use the side from which the release paper was removed as the adhesive surface, and apply adhesive.
It was heated at 50° C. for 30 minutes to integrate it with a 7-rekin pull printed circuit board. The glabellar peel strength of this product was measured. The results are shown in Table 1.

(Example 2) The release paper was changed (Tetler film manufactured by Somar Co., Ltd.)
A laminate was obtained in the same manner as in Example 1 except for the product name [Tetra-100s83ONRJ], and it was adhered to a 7 lexiple printed circuit board in the same manner as in Example 1, and the glabella peel strength was measured.

(Comparative Example 1) For comparison, a laminate without unevenness was manufactured in the same manner as in Example 1 except that no release paper was used, and this laminate and a 7 lexiple printed circuit board were attached via adhesive. However, it could not be integrated.

(Comparative Example 2) The laminate obtained in Comparative Example 1 was polished to make the surface rough,
An adhesive was applied to this surface and adhered to a 7 lexiple printed circuit board under the same conditions as in Example 1, and the glabella peel strength was measured. The results are shown in Table 1.

Surface roughness of first surface laminate Glabella peel strength μ k C-2 Example 1
24,5 4.52 10.8
3.0 Comparative Example 1 4.0
-2 10~20 4.4 1st
From the results in the table, it can be seen that the examples of the present invention have a glabellar peel strength comparable to that of Comparative Example 2, which was polished.

[Effects of the Invention] Since the laminate of the present invention has a rough surface for adhesion to the 7-lexiple printed circuit board, it can be bonded to the 7-lexiple printed circuit board using the adhesive surface, making it possible to bond the laminate to the 7-lexiple printed circuit board using the adhesive surface. It is possible to increase the strength of the 7 lexiple printed circuit board without the need for a polishing process, and according to the manufacturing method of the present invention, one side of a stack of multiple prepregs is removed when heated and pressurized. Since the release paper with unevenness is stacked on the surface of the laminate, the release paper can form unevenness on one side of the laminate, and the laminate with a rough surface to be bonded to the lexiple printed circuit board can be easily manufactured.

[Brief explanation of drawings]

FIG. 1 is a schematic cross-sectional view showing a state in which the laminate of the present invention is integrated with a 7-lexiple printed circuit board, and FIG. 2 is a schematic cross-sectional view showing an embodiment of the manufacturing method of the present invention. is a laminated board, 1 is a 7 lexiple printed circuit board, 2 is an adhesive surface, 3
4 is a prepreg, 4 is a stack, 5 is a release paper, and 6 is an uneven surface. Agent Patent Attorney Ishi 1) Ai 7 Figure 1 Figure 2

Claims (2)

[Claims] (1) A laminate used as a backing material for a flexible printed circuit board, the laminate having a rough surface for adhesion to the flexible printed circuit board. (2) In a laminate manufacturing method in which multiple prepregs formed by impregnating and drying a base material with resin varnish are stacked and heated and pressed, one side of the stack of multiple prepregs becomes uneven when heated and pressed. A method for manufacturing a laminate, characterized by stacking release paper.