JPS62140772U - - Google Patents
Info
- Publication number
- JPS62140772U JPS62140772U JP2772986U JP2772986U JPS62140772U JP S62140772 U JPS62140772 U JP S62140772U JP 2772986 U JP2772986 U JP 2772986U JP 2772986 U JP2772986 U JP 2772986U JP S62140772 U JPS62140772 U JP S62140772U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- width
- attaching
- land portion
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2772986U JPS62140772U (lm) | 1986-02-27 | 1986-02-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2772986U JPS62140772U (lm) | 1986-02-27 | 1986-02-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62140772U true JPS62140772U (lm) | 1987-09-05 |
Family
ID=30830033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2772986U Pending JPS62140772U (lm) | 1986-02-27 | 1986-02-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62140772U (lm) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012199269A (ja) * | 2011-03-18 | 2012-10-18 | Seiko Epson Corp | 電子部品及びその製造方法と、配線基板 |
US9095066B2 (en) | 2008-06-18 | 2015-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Printed board |
-
1986
- 1986-02-27 JP JP2772986U patent/JPS62140772U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9095066B2 (en) | 2008-06-18 | 2015-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Printed board |
JP2012199269A (ja) * | 2011-03-18 | 2012-10-18 | Seiko Epson Corp | 電子部品及びその製造方法と、配線基板 |