JPS62140730U - - Google Patents
Info
- Publication number
- JPS62140730U JPS62140730U JP2873486U JP2873486U JPS62140730U JP S62140730 U JPS62140730 U JP S62140730U JP 2873486 U JP2873486 U JP 2873486U JP 2873486 U JP2873486 U JP 2873486U JP S62140730 U JPS62140730 U JP S62140730U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- board
- wiring
- wire bonding
- copper plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Wire Bonding (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2873486U JPS62140730U (US07943777-20110517-C00090.png) | 1986-02-28 | 1986-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2873486U JPS62140730U (US07943777-20110517-C00090.png) | 1986-02-28 | 1986-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62140730U true JPS62140730U (US07943777-20110517-C00090.png) | 1987-09-05 |
Family
ID=30831971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2873486U Pending JPS62140730U (US07943777-20110517-C00090.png) | 1986-02-28 | 1986-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62140730U (US07943777-20110517-C00090.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848432A (ja) * | 1981-09-17 | 1983-03-22 | Denki Kagaku Kogyo Kk | 混成集積回路の製法 |
-
1986
- 1986-02-28 JP JP2873486U patent/JPS62140730U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848432A (ja) * | 1981-09-17 | 1983-03-22 | Denki Kagaku Kogyo Kk | 混成集積回路の製法 |
