JPS62138440U - - Google Patents

Info

Publication number
JPS62138440U
JPS62138440U JP2585086U JP2585086U JPS62138440U JP S62138440 U JPS62138440 U JP S62138440U JP 2585086 U JP2585086 U JP 2585086U JP 2585086 U JP2585086 U JP 2585086U JP S62138440 U JPS62138440 U JP S62138440U
Authority
JP
Japan
Prior art keywords
semiconductor substrate
etching
semiconductor
chemical solution
irradiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2585086U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2585086U priority Critical patent/JPS62138440U/ja
Publication of JPS62138440U publication Critical patent/JPS62138440U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
  • Nozzles (AREA)
JP2585086U 1986-02-24 1986-02-24 Pending JPS62138440U (US20110009641A1-20110113-C00185.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2585086U JPS62138440U (US20110009641A1-20110113-C00185.png) 1986-02-24 1986-02-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2585086U JPS62138440U (US20110009641A1-20110113-C00185.png) 1986-02-24 1986-02-24

Publications (1)

Publication Number Publication Date
JPS62138440U true JPS62138440U (US20110009641A1-20110113-C00185.png) 1987-09-01

Family

ID=30826382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2585086U Pending JPS62138440U (US20110009641A1-20110113-C00185.png) 1986-02-24 1986-02-24

Country Status (1)

Country Link
JP (1) JPS62138440U (US20110009641A1-20110113-C00185.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002520850A (ja) * 1998-07-09 2002-07-09 エーシーエム リサーチ,インコーポレイティド 半導体デバイス上の金属相互接続を電解研磨する方法及び装置
JP2008047637A (ja) * 2006-08-11 2008-02-28 Fujikura Ltd ウェハのウェット処理方法及びウェハのエッチング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002520850A (ja) * 1998-07-09 2002-07-09 エーシーエム リサーチ,インコーポレイティド 半導体デバイス上の金属相互接続を電解研磨する方法及び装置
JP2008047637A (ja) * 2006-08-11 2008-02-28 Fujikura Ltd ウェハのウェット処理方法及びウェハのエッチング装置

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