JPS62137663U - - Google Patents
Info
- Publication number
- JPS62137663U JPS62137663U JP2374886U JP2374886U JPS62137663U JP S62137663 U JPS62137663 U JP S62137663U JP 2374886 U JP2374886 U JP 2374886U JP 2374886 U JP2374886 U JP 2374886U JP S62137663 U JPS62137663 U JP S62137663U
- Authority
- JP
- Japan
- Prior art keywords
- holding frame
- horizontally
- rear part
- guide piece
- floats
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2374886U JPS62137663U (OSRAM) | 1986-02-19 | 1986-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2374886U JPS62137663U (OSRAM) | 1986-02-19 | 1986-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62137663U true JPS62137663U (OSRAM) | 1987-08-29 |
Family
ID=30822333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2374886U Pending JPS62137663U (OSRAM) | 1986-02-19 | 1986-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62137663U (OSRAM) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5593291A (en) * | 1979-01-09 | 1980-07-15 | Kondo Kenji | Device for soldering printed board |
-
1986
- 1986-02-19 JP JP2374886U patent/JPS62137663U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5593291A (en) * | 1979-01-09 | 1980-07-15 | Kondo Kenji | Device for soldering printed board |
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