JPS62132626A - Positioning device for resin molding mold - Google Patents
Positioning device for resin molding moldInfo
- Publication number
- JPS62132626A JPS62132626A JP27337785A JP27337785A JPS62132626A JP S62132626 A JPS62132626 A JP S62132626A JP 27337785 A JP27337785 A JP 27337785A JP 27337785 A JP27337785 A JP 27337785A JP S62132626 A JPS62132626 A JP S62132626A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- bottom force
- lower mold
- pedestals
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/80—Measuring, controlling or regulating of relative position of mould parts
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野コ
この発明は、樹脂刺止型電子部品などを製作する場合に
使用する樹脂モールド′ブレスに設けられた樹脂モール
ド金型用位置合わせ装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention relates to a positioning device for a resin mold provided in a resin mold brace used in manufacturing resin-punched electronic components.
[従来の技術]
第3図は、樹脂14止型電子部品などを製作する場合に
使用する樹脂モールドブレスの概略構成図である。[Prior Art] FIG. 3 is a schematic diagram of a resin mold press used in manufacturing resin 14-stop type electronic components.
図において、1はこの樹脂モールドプレスのフレームを
構成するための主柱であって、この主柱1の下端は、基
礎台2にねじ3により同定され、主柱1の上端は、上部
台4にねじ5により固定されている。In the figure, reference numeral 1 denotes a main pillar for constructing the frame of this resin mold press. It is fixed with screws 5.
上部台4に、懸下部材6.7を介して上金型8が吊り下
げられている。すなわち、懸下部材6が、ねし9により
上部台4に固定され、この懸下部材6に水平方向の懸下
部材7がねじ1oより固定され、この水平方向の懸下部
材7に、上金型8が、ねじ11により固定されている。An upper mold 8 is suspended from the upper stand 4 via suspension members 6.7. That is, the suspension member 6 is fixed to the upper stand 4 with screws 9, the horizontal suspension member 7 is fixed to this suspension member 6 with screws 1o, and the upper A mold 8 is fixed with screws 11.
上記の上金型8内には、樹脂相を入れるポット部12が
設けられ、このポット部12内に、上部台4に取付けた
シリンダ13のピストン軸14の先端に設けたプランジ
ャ15が進退するように挿入される。A pot portion 12 for storing the resin phase is provided in the upper mold 8, and a plunger 15 provided at the tip of a piston shaft 14 of a cylinder 13 attached to the upper table 4 moves forward and backward into the pot portion 12. It will be inserted like this.
上記の上金型8に対向して下金型16が配置されるが、
この下金型16は、取付台17に、ねじ18により固定
され、この取付台17は、鉛直方向に昇降可能な基台1
9に固定され、この基台19は主柱1に挿通され、基礎
台2に設けた昇降機構20により鉛直方向に昇降可能に
設けられられている。A lower mold 16 is arranged opposite to the upper mold 8,
This lower mold 16 is fixed to a mounting base 17 with screws 18, and this mounting base 17 is a base 1 that can be raised and lowered in the vertical direction.
9, this base 19 is inserted through the main pillar 1, and is provided so as to be vertically movable by a lifting mechanism 20 provided on the base 2.
なお、上記の下金型16内には、キャビティ21が設け
られている。Note that a cavity 21 is provided in the lower mold 16 described above.
上記のように構成の樹脂モールドプレスは、まず、昇降
機構20の作動により、下金型が上昇し、上金型に密着
する。In the resin mold press configured as described above, the lower mold is first raised by the operation of the elevating mechanism 20 and brought into close contact with the upper mold.
次に、シリンダ13の作動により、そのピストン軸14
を介してプランジャ15が下降し、上金型8のポット部
12内に挿入され、あらかじめ投入しである樹脂相を、
下金j(’、、! l 6へ押出す。すなわち、ポット
部12から押出された溶融樹脂は、図示を省略したラン
9゛、ケートを介して下金型16のキャビティ21内へ
押出され、キャビティ21内に支持された電子部品を樹
脂DI tltする。Next, due to the operation of the cylinder 13, the piston shaft 14
The plunger 15 is lowered through the , and inserted into the pot part 12 of the upper mold 8, and the resin phase that has been charged in advance is poured into the pot part 12 of the upper mold 8.
The molten resin extruded from the pot part 12 is extruded into the cavity 21 of the lower mold 16 via a run 9' and a cage (not shown). , the electronic component supported within the cavity 21 is coated with resin DI tlt.
その後、下金型16を′ji“−降機構20により下降
させ、キャビティ21内より樹脂封止された電子部品を
取出す。Thereafter, the lower mold 16 is lowered by the lowering mechanism 20, and the resin-sealed electronic component is taken out from the cavity 21.
上記のように構成の樹脂モールドブレススにおいて、初
期設定時に、プランジャ15と、このプランジャ15が
挿入されるポット部部12との相対的位置を正確に合わ
せなけれはならないが、従来ては次のようにして、その
位置合わせなしていた。In the resin mold breather configured as described above, the relative position of the plunger 15 and the pot portion 12 into which the plunger 15 is inserted must be accurately aligned during initial setting. In that way, it was not aligned.
すなわち、最初に1−金型8、おまひ下金型16をそれ
ぞれ懸下部H47、および取付台16にねじ11.18
て硬く固定しない状態で、これらの外周をハンマでたた
き、少しずつ水平面内で移動させ、プランジャ15と、
ポット部12との隙間が所定の隙間になるように位置合
わせし、位置が合わさったところで、ねじ11.18を
硬く締付けるという調整作業を行っている。That is, first, attach the screws 11 and 18 to the hanging part H47 and the mounting base 16, respectively.
Without firmly fixing the plunger 15, hit the outer periphery of these parts with a hammer and move them little by little in a horizontal plane.
The adjustment work is carried out by aligning so that the gap with the pot part 12 is a predetermined gap, and when the positions are aligned, the screws 11.18 are tightly tightened.
[発明が解決しようとする問題点]
従来の樹脂モールドブレスにおける位置調整作業は、以
上のようにして行われ、その場合に、一般にこの種の樹
脂モールドブレスに用いられる上、下の金型8.16は
重量が嵩み、因に1トン以上となる場合もあり、かかる
場合に、上、下金型8.16の外周を、ハンマでたたき
ながらプランジャ15とポット部12との隙間を、たと
えば0゜05〜0.08mmの均一の隙間になるように
調整することは、非常な労力と時間を要するという問題
点があった。[Problems to be Solved by the Invention] The position adjustment work in a conventional resin molded press is performed as described above, and in that case, the upper and lower molds 8 generally used for this type of resin molded press are .16 is heavy, and may weigh more than 1 ton. In such cases, the outer periphery of the upper and lower molds 8.16 is struck with a hammer to remove the gap between the plunger 15 and the pot part 12. For example, there is a problem in that adjusting the gap to have a uniform gap of 0.05 to 0.08 mm requires a great deal of labor and time.
[発明の目的コ
この発明は、上記のような問題点を解決するためになさ
れたもので、精度良くプランジャ15と、ポット部12
との隙間を、労力を少なく、かつ短時間に調整すること
ができる樹脂モールド金型用位置合わせ装置を得ること
を目的とする。[Purpose of the Invention] This invention was made to solve the above-mentioned problems, and it is possible to accurately connect the plunger 15 and the pot part 12.
It is an object of the present invention to provide a positioning device for a resin mold that can adjust the gap between the resin mold and the mold with less labor and in a short time.
[問題点を解決するための手段]
この発明に係る樹脂モールド金型用位置合わせ装置は、
下金型を載置する取1」台の外周に複数個の台座を設け
、この台座に、調整ねしをねじ込み、その先端が前記下
金型の外周に当るようにしたものである。[Means for solving the problems] The positioning device for resin molding die according to the present invention has the following features:
A plurality of pedestals are provided on the outer periphery of the tray on which the lower mold is placed, and adjustment screws are screwed into the pedestals so that the tips of the screws touch the outer periphery of the lower mold.
[作用コ
この発明の樹脂モールド金型用位置合わせ装置において
は、台座に設けた調整ねじを回すことによって、その調
整ねじの先端で、下金型の外周を押し、水平面内でX−
Y方向に下金型を微動させる。[Operation] In the positioning device for resin molds of the present invention, by turning the adjusting screw provided on the pedestal, the tip of the adjusting screw pushes the outer periphery of the lower mold and aligns the X-
Move the lower mold slightly in the Y direction.
[実施例]
以下に、この発明の実施例について、第1図および第2
図を参照して説明する。[Example] Examples of the present invention will be described below with reference to FIGS. 1 and 2.
This will be explained with reference to the figures.
なお、従来例を示す第3図と、同一、または相当部分に
は、同一符号を付して、その詳しい説明は省略する。Note that the same or corresponding parts as in FIG. 3 showing the conventional example are given the same reference numerals, and detailed explanation thereof will be omitted.
そこで、樹脂モールドプレスの取付台17の周囲、すな
わち、下金型16の外周に近接する位置に複数の台座2
2を設ける。この台座22の数は、下金型16の大きさ
や、下金型16の形状によって決定されるか、この実施
例のように、下金型16が直方体であれば、少なくとも
その直方体の対向面に1組ずつ設け、対向面の両面から
調整可能な構造とする。Therefore, a plurality of pedestals 2 are provided around the mounting base 17 of the resin mold press, that is, at a position close to the outer periphery of the lower mold 16.
2 will be provided. The number of pedestals 22 is determined by the size and shape of the lower mold 16, or if the lower mold 16 is a rectangular parallelepiped as in this embodiment, at least the opposing surface of the rectangular parallelepiped. One set is provided on each side, and the structure allows adjustment from both sides of the opposing surfaces.
−1−記の台座22には、水平方向に進退するように調
整ねじ23を、ねじ込み、下金型16の外周に当るよう
にする。An adjustment screw 23 is screwed into the pedestal 22 described in -1- so as to move forward and backward in the horizontal direction so as to contact the outer periphery of the lower mold 16.
上記の構成において、調整ねじ23を、スパナなどの工
具で回せは、調整ねじ23の推力に助けられ、重量の嵩
む下金型16、およびこの下金型16−Lに重ね合わせ
られている上金型8がX−Y方向に微動する。したがっ
て、各方向の調整ねじ23を交互に回し、その都度、プ
ランジャ15を下降させ、ポット部18との隙間が均一
になるまで調整を繰り返し、かかる隙間が均一になった
ところで、ねし11.18を十分締付けて、上、下金型
8.16を完全に固定し、初期設定を終了する。In the above configuration, the adjustment screw 23 can be turned with a tool such as a spanner by the thrust of the adjustment screw 23, and the lower mold 16, which is heavy, and the upper mold superimposed on the lower mold 16-L can be The mold 8 moves slightly in the X-Y direction. Therefore, the adjustment screws 23 in each direction are turned alternately, the plunger 15 is lowered each time, and the adjustment is repeated until the gap with the pot part 18 becomes uniform. When the gap becomes uniform, the screw 11. 18 is sufficiently tightened to completely fix the upper and lower molds 8 and 16, and the initial setting is completed.
[発明の効果]
以上説明したように、この発明は下金型を乗せる取付台
の外周に複数個の台座を設け、この台座に、その先Eか
前記下金型の外周に当る調整ねじを設けたので、調整ね
しを回すことにより、前記下金型、およびこの下金型に
重ね合わせられた上金型が容易に水平面内でX−Y方向
に微動し、従来のようにハンマなど使用することなく、
重量の嵩む金型の位置調整が、労力中なく、かつ短時間
にできるなど優れた効果を奏する。[Effects of the Invention] As explained above, in the present invention, a plurality of pedestals are provided on the outer periphery of a mounting base on which the lower mold is placed, and an adjustment screw is provided on the pedestal at the tip E or the outer periphery of the lower mold. By turning the adjustment screw, the lower mold and the upper mold superimposed on the lower mold can be easily moved slightly in the X-Y direction within the horizontal plane, and can be easily moved using a hammer or the like as in the conventional method. without using
The position adjustment of heavy molds can be done in a short time and without much labor, resulting in excellent effects.
第1図は、この発明の一実施例を示す樹脂モールド金型
用位置合わせ装置を設けた樹脂モールドブレスの斜視図
、第2図は、−1−記樹脂モールドブレスの一部を断面
とした正面図、第3図は、樹脂モールド金型用位置合わ
せ装置の14属しない従来の樹脂モールドプレスの一部
を断面とした正面図である。
図において、8・・・−L金型、12・・・ポット部、
15・・・プランジャ、16・・・下金型、17・・・
取付台、20・・・昇降機構、22・・・台座、23・
・・調整ねしである。
なお、各図中、同一符号は同一、または相当部分を示す
。Fig. 1 is a perspective view of a resin mold press equipped with a positioning device for a resin mold according to an embodiment of the present invention, and Fig. 2 is a cross-sectional view of a part of the resin mold press described in -1-. 3 is a partially sectional front view of a conventional resin mold press that does not belong to the positioning device for resin mold molds. In the figure, 8...-L mold, 12... pot part,
15...Plunger, 16...Lower mold, 17...
Mounting base, 20... Lifting mechanism, 22... Pedestal, 23.
...There is no adjustment. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
を有する上金型と、昇降機構によって鉛直方向に移動可
能な基台上に取付台を介して固定される前記上金型のポ
ット部に対向して設けたキャビティ部を有する下金型と
、前記上金型のポット部に挿入され、溶融樹脂を圧力を
加えて送るシリンダのピストン軸に設けられたプランジ
ャとを備え、前記ポット部と、このポット部に挿入され
る前記プランジャとの水平面内の相対的位置を、設定時
に調整するものにおいて、前記下金型が固定される取付
台上に、前記下金型の外周に近接して複数の台座を設け
、この台座に、前記下金型の外周に当る調整ねじをねじ
込み、この調整ねじにより、前記ポット部と、このポッ
ト部に挿入される前記プランジャとの水平面内の相対的
位置を調整するようにしたことを特徴とする樹脂モール
ド金型用位置合わせ装置。An upper mold having a pot part suspended from a frame via a suspension member, and a pot part of the upper mold fixed via a mounting base on a base movable in the vertical direction by an elevating mechanism. A lower mold having cavity portions provided opposite to each other, and a plunger inserted into a pot portion of the upper mold and provided on a piston shaft of a cylinder for feeding molten resin under pressure; , in which the relative position in a horizontal plane with the plunger inserted into the pot part is adjusted at the time of setting, on a mounting base to which the lower mold is fixed, close to the outer periphery of the lower mold. A plurality of pedestals are provided, and adjustment screws corresponding to the outer periphery of the lower mold are screwed into the pedestals, and the adjustment screws adjust the relative positions in the horizontal plane of the pot part and the plunger inserted into the pot part. A positioning device for a resin mold, characterized in that the positioning device is adapted to adjust the position of the resin mold.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27337785A JPS62132626A (en) | 1985-12-06 | 1985-12-06 | Positioning device for resin molding mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27337785A JPS62132626A (en) | 1985-12-06 | 1985-12-06 | Positioning device for resin molding mold |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62132626A true JPS62132626A (en) | 1987-06-15 |
Family
ID=17527049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27337785A Pending JPS62132626A (en) | 1985-12-06 | 1985-12-06 | Positioning device for resin molding mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62132626A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007063673A1 (en) * | 2005-11-29 | 2007-06-07 | Towa Corporation | Resin-sealed molding apparatus with sealing means, and method of dismounting constituent part of die assembly fitted therein |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5040813B1 (en) * | 1970-11-04 | 1975-12-26 | ||
JPS568238A (en) * | 1979-07-03 | 1981-01-28 | Toyota Motor Corp | Positioning method for insert die of metal mold for injection molding |
-
1985
- 1985-12-06 JP JP27337785A patent/JPS62132626A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5040813B1 (en) * | 1970-11-04 | 1975-12-26 | ||
JPS568238A (en) * | 1979-07-03 | 1981-01-28 | Toyota Motor Corp | Positioning method for insert die of metal mold for injection molding |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007063673A1 (en) * | 2005-11-29 | 2007-06-07 | Towa Corporation | Resin-sealed molding apparatus with sealing means, and method of dismounting constituent part of die assembly fitted therein |
JP2007150054A (en) * | 2005-11-29 | 2007-06-14 | Towa Corp | Sealing mechanism in resin sealing mold apparatus |
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