JPS62131447U - - Google Patents
Info
- Publication number
- JPS62131447U JPS62131447U JP1986018446U JP1844686U JPS62131447U JP S62131447 U JPS62131447 U JP S62131447U JP 1986018446 U JP1986018446 U JP 1986018446U JP 1844686 U JP1844686 U JP 1844686U JP S62131447 U JPS62131447 U JP S62131447U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- semiconductor device
- side surfaces
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986018446U JPS62131447U (US06312121-20011106-C00033.png) | 1986-02-12 | 1986-02-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986018446U JPS62131447U (US06312121-20011106-C00033.png) | 1986-02-12 | 1986-02-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62131447U true JPS62131447U (US06312121-20011106-C00033.png) | 1987-08-19 |
Family
ID=30812126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986018446U Pending JPS62131447U (US06312121-20011106-C00033.png) | 1986-02-12 | 1986-02-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62131447U (US06312121-20011106-C00033.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0497352U (US06312121-20011106-C00033.png) * | 1990-07-26 | 1992-08-24 |
-
1986
- 1986-02-12 JP JP1986018446U patent/JPS62131447U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0497352U (US06312121-20011106-C00033.png) * | 1990-07-26 | 1992-08-24 |
