JPS62131444U - - Google Patents
Info
- Publication number
- JPS62131444U JPS62131444U JP1364386U JP1364386U JPS62131444U JP S62131444 U JPS62131444 U JP S62131444U JP 1364386 U JP1364386 U JP 1364386U JP 1364386 U JP1364386 U JP 1364386U JP S62131444 U JPS62131444 U JP S62131444U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- recessed portion
- semiconductor package
- accommodating
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Die Bonding (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1364386U JPH043501Y2 (ko) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1364386U JPH043501Y2 (ko) | 1986-01-31 | 1986-01-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62131444U true JPS62131444U (ko) | 1987-08-19 |
JPH043501Y2 JPH043501Y2 (ko) | 1992-02-04 |
Family
ID=30802896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1364386U Expired JPH043501Y2 (ko) | 1986-01-31 | 1986-01-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH043501Y2 (ko) |
-
1986
- 1986-01-31 JP JP1364386U patent/JPH043501Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH043501Y2 (ko) | 1992-02-04 |