JPS62129591U - - Google Patents

Info

Publication number
JPS62129591U
JPS62129591U JP1985153897U JP15389785U JPS62129591U JP S62129591 U JPS62129591 U JP S62129591U JP 1985153897 U JP1985153897 U JP 1985153897U JP 15389785 U JP15389785 U JP 15389785U JP S62129591 U JPS62129591 U JP S62129591U
Authority
JP
Japan
Prior art keywords
light
emitting elements
parallel
showing
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985153897U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0328474Y2 (es
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985153897U priority Critical patent/JPH0328474Y2/ja
Publication of JPS62129591U publication Critical patent/JPS62129591U/ja
Application granted granted Critical
Publication of JPH0328474Y2 publication Critical patent/JPH0328474Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
JP1985153897U 1985-10-08 1985-10-08 Expired JPH0328474Y2 (es)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985153897U JPH0328474Y2 (es) 1985-10-08 1985-10-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985153897U JPH0328474Y2 (es) 1985-10-08 1985-10-08

Publications (2)

Publication Number Publication Date
JPS62129591U true JPS62129591U (es) 1987-08-15
JPH0328474Y2 JPH0328474Y2 (es) 1991-06-19

Family

ID=31073198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985153897U Expired JPH0328474Y2 (es) 1985-10-08 1985-10-08

Country Status (1)

Country Link
JP (1) JPH0328474Y2 (es)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004512697A (ja) * 2000-10-24 2004-04-22 ゼネラル・エレクトリック・カンパニイ Led電源
JP2008052238A (ja) * 2006-07-27 2008-03-06 Kotohira Kogyo Kk 発光モジュール配列表示装置
JP2009535799A (ja) * 2006-04-25 2009-10-01 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ledアレイグリッド、前記ledグリッド、及び前記において使用するledコンポーネントを作製する方法並びに装置
JP2011253700A (ja) * 2010-06-02 2011-12-15 Sparkling Lights Kk 切断可能な照明装置及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102279U (es) * 1977-01-22 1978-08-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102279U (es) * 1977-01-22 1978-08-17

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004512697A (ja) * 2000-10-24 2004-04-22 ゼネラル・エレクトリック・カンパニイ Led電源
JP2009535799A (ja) * 2006-04-25 2009-10-01 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ledアレイグリッド、前記ledグリッド、及び前記において使用するledコンポーネントを作製する方法並びに装置
JP2008052238A (ja) * 2006-07-27 2008-03-06 Kotohira Kogyo Kk 発光モジュール配列表示装置
JP2011253700A (ja) * 2010-06-02 2011-12-15 Sparkling Lights Kk 切断可能な照明装置及びその製造方法

Also Published As

Publication number Publication date
JPH0328474Y2 (es) 1991-06-19

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