JPS62129591U - - Google Patents
Info
- Publication number
- JPS62129591U JPS62129591U JP1985153897U JP15389785U JPS62129591U JP S62129591 U JPS62129591 U JP S62129591U JP 1985153897 U JP1985153897 U JP 1985153897U JP 15389785 U JP15389785 U JP 15389785U JP S62129591 U JPS62129591 U JP S62129591U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting elements
- parallel
- showing
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985153897U JPH0328474Y2 (es) | 1985-10-08 | 1985-10-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985153897U JPH0328474Y2 (es) | 1985-10-08 | 1985-10-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62129591U true JPS62129591U (es) | 1987-08-15 |
JPH0328474Y2 JPH0328474Y2 (es) | 1991-06-19 |
Family
ID=31073198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985153897U Expired JPH0328474Y2 (es) | 1985-10-08 | 1985-10-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0328474Y2 (es) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004512697A (ja) * | 2000-10-24 | 2004-04-22 | ゼネラル・エレクトリック・カンパニイ | Led電源 |
JP2008052238A (ja) * | 2006-07-27 | 2008-03-06 | Kotohira Kogyo Kk | 発光モジュール配列表示装置 |
JP2009535799A (ja) * | 2006-04-25 | 2009-10-01 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Ledアレイグリッド、前記ledグリッド、及び前記において使用するledコンポーネントを作製する方法並びに装置 |
JP2011253700A (ja) * | 2010-06-02 | 2011-12-15 | Sparkling Lights Kk | 切断可能な照明装置及びその製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53102279U (es) * | 1977-01-22 | 1978-08-17 |
-
1985
- 1985-10-08 JP JP1985153897U patent/JPH0328474Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53102279U (es) * | 1977-01-22 | 1978-08-17 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004512697A (ja) * | 2000-10-24 | 2004-04-22 | ゼネラル・エレクトリック・カンパニイ | Led電源 |
JP2009535799A (ja) * | 2006-04-25 | 2009-10-01 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Ledアレイグリッド、前記ledグリッド、及び前記において使用するledコンポーネントを作製する方法並びに装置 |
JP2008052238A (ja) * | 2006-07-27 | 2008-03-06 | Kotohira Kogyo Kk | 発光モジュール配列表示装置 |
JP2011253700A (ja) * | 2010-06-02 | 2011-12-15 | Sparkling Lights Kk | 切断可能な照明装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0328474Y2 (es) | 1991-06-19 |