JPS62129591U - - Google Patents

Info

Publication number
JPS62129591U
JPS62129591U JP1985153897U JP15389785U JPS62129591U JP S62129591 U JPS62129591 U JP S62129591U JP 1985153897 U JP1985153897 U JP 1985153897U JP 15389785 U JP15389785 U JP 15389785U JP S62129591 U JPS62129591 U JP S62129591U
Authority
JP
Japan
Prior art keywords
light
emitting elements
parallel
showing
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985153897U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0328474Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985153897U priority Critical patent/JPH0328474Y2/ja
Publication of JPS62129591U publication Critical patent/JPS62129591U/ja
Application granted granted Critical
Publication of JPH0328474Y2 publication Critical patent/JPH0328474Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
JP1985153897U 1985-10-08 1985-10-08 Expired JPH0328474Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985153897U JPH0328474Y2 (enrdf_load_stackoverflow) 1985-10-08 1985-10-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985153897U JPH0328474Y2 (enrdf_load_stackoverflow) 1985-10-08 1985-10-08

Publications (2)

Publication Number Publication Date
JPS62129591U true JPS62129591U (enrdf_load_stackoverflow) 1987-08-15
JPH0328474Y2 JPH0328474Y2 (enrdf_load_stackoverflow) 1991-06-19

Family

ID=31073198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985153897U Expired JPH0328474Y2 (enrdf_load_stackoverflow) 1985-10-08 1985-10-08

Country Status (1)

Country Link
JP (1) JPH0328474Y2 (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004512697A (ja) * 2000-10-24 2004-04-22 ゼネラル・エレクトリック・カンパニイ Ｌｅｄ電源
JP2008052238A (ja) * 2006-07-27 2008-03-06 Kotohira Kogyo Kk 発光モジュール配列表示装置
JP2009535799A (ja) * 2006-04-25 2009-10-01 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ｌｅｄアレイグリッド、前記ｌｅｄグリッド、及び前記において使用するｌｅｄコンポーネントを作製する方法並びに装置
JP2011253700A (ja) * 2010-06-02 2011-12-15 Sparkling Lights Kk 切断可能な照明装置及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102279U (enrdf_load_stackoverflow) * 1977-01-22 1978-08-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102279U (enrdf_load_stackoverflow) * 1977-01-22 1978-08-17

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004512697A (ja) * 2000-10-24 2004-04-22 ゼネラル・エレクトリック・カンパニイ Ｌｅｄ電源
JP2009535799A (ja) * 2006-04-25 2009-10-01 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ｌｅｄアレイグリッド、前記ｌｅｄグリッド、及び前記において使用するｌｅｄコンポーネントを作製する方法並びに装置
JP2008052238A (ja) * 2006-07-27 2008-03-06 Kotohira Kogyo Kk 発光モジュール配列表示装置
JP2011253700A (ja) * 2010-06-02 2011-12-15 Sparkling Lights Kk 切断可能な照明装置及びその製造方法

Also Published As

Publication number Publication date
JPH0328474Y2 (enrdf_load_stackoverflow) 1991-06-19

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