JPS62127003A - Method and apparatus for producing shoe sole - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a thick sole having a two-layer structure used in jogging shoes and other sports shoes that require cushioning properties, and to carry out the method. Regarding manufacturing equipment.

Conventional technology Shoe soles such as those mentioned above are usually made of rubber sponge, with a light and flexible insole molded from a material that increases the foaming rate of the sponge to reduce its specific gravity, and It has a two-layer structure with a ground-contact sole that has excellent wear resistance and is made of a material that has been pressed to increase its specific gravity.

Conventionally, such two-layer shoe soles have had an insole and a ground sole formed separately, and then glued together with an adhesive.

Problems to be Solved by the Invention However, in the method of manufacturing shoe soles by laminating, the bonding surfaces of the molded insole and the ground sole are puffed or primed, and then adhesive is applied once or twice. However, since the two were bonded after drying for a while, there were many manufacturing steps, which required time and effort, and the manufacturing cost was high.

The present invention was made in view of the above circumstances, and its purpose is to provide a method for manufacturing shoe soles that can simplify the manufacturing process, improve work efficiency, and significantly reduce manufacturing costs. The objective is to provide manufacturing equipment for carrying out the process.

Means for Solving the Problems In the method of manufacturing shoe soles according to the present invention, vulcanized rubber molded to predetermined dimensions is placed in each of the upper mold for forming the midsole and the lower mold for forming the ground sole. A preforming step of accommodating a sponge molding material, overlapping the upper mold and the lower mold with a partition plate interposed between their contact surfaces, heating for a predetermined time, and then cooling; By removing the partition plate, overlapping the upper mold and the lower mold with the adhesive-applied surfaces of the preformed intersole and ground sole facing each other, heating for a predetermined period of time, and then cooling. It is characterized by including a molding and bonding step of integrally molding the insole and the grounding sole while bonding them together. The adhesive may be applied to the surface of the molding material contained in the upper mold and the lower mold before the preforming process, or applied to the preformed midsole and ground sole after the preforming process. shall be applied or attached to the surface of

Furthermore, the shoe sole manufacturing apparatus according to the present invention includes an upper mold having a concave portion for molding a midsole, a lower mold having a concave portion for molding a ground sole, and an intervening mold between the upper mold and the lower mold. and a partition plate whose upper and lower surfaces are formed in a shape that matches the bonding surfaces of the joint insole and the grounding sole, and in the step of preforming the joint insole and the grounding sole, the partition plate It is interposed between the upper mold and the lower mold, and is configured to be removed during the molding and bonding process of the mating midsole and the grounding sole.

Embodiments Hereinafter, embodiments of the present invention will be described based on the drawings. 1st
The figure shows a molding apparatus for carrying out the method of the present invention. A partition plate 3 is provided. As clearly shown in FIGS. 2 and 3, the upper mold 1 is provided with a molding recess 4 that is deep at the heel and gradually becomes shallower toward the front bottom. As shown in FIGS. 4 and 5, the lower mold 2 has a front bottom end portion of the molding recess 5 that extends slightly from the front bottom of the upper mold 1 and is tapered, and has a non-slip surface on the bottom of the recess 5. uneven pattern 6 for forming the design of
is provided. The partition plate 3 has upper and lower surfaces formed in a shape that matches the bonding surface between the midsole and the ground sole, and in the embodiment, the portions corresponding to the rear end of the heel and the tip of the front sole are bent upward. .

The molding material for the sole of the shoe is polybutadiene (SR) or ethylene vinyl acetate (EV) for both the insole and the ground sole.
A type of vulcanized rubber sponge is often used, and for the insole, a material with a specific gravity of about 0.05 to 0.25 is used with a high foaming rate to make it light and flexible. For the ground-contact sole, it is preferable to use a material with a specific gravity of about 0.20 to 0.40 with less foaming to increase wear resistance.

As shown in FIGS. 6(a) and 6(b), the molding material 7 for the middle sole has a contour shape that is almost the same as the recess 4 of the upper mold 1, and the thickness t of each part is the same as that of the recess 4. A plate-shaped material is molded to have a dimension approximately 1.2 to 2.0 times the depth. As shown in FIGS. 7(a) and 7(b), the molding material 8 for the grounding bottom also has a contour shape that is almost the same as the molding recess 5 of the lower mold 2, and the thickness t2 is equal to the depth of the recess 5. A plate-shaped material is molded to a size approximately 1.2 to 2.0 times larger.

The molding materials 7 and 8 molded as described above are respectively fitted into the recesses 4 of the upper mold 1 and the recesses 5 of the lower mold 2 as shown in FIG. Bottom material 7
A solvent-volatile adhesive 9 is applied in advance to the adhesive surface of the grounding bottom material 8.
Apply and let dry. In addition, in this case, the partition plate 3
Teflon treatment is applied to both the upper and lower surfaces of to prevent the adhesive 9 from adhering.

Note that the adhesive 9 may be applied or attached to the adhesive surfaces of the preformed midsole 7a and the ground sole 8a after the preforming process described below is completed and the partition plate 3 is removed. In this case, the adhesive is preferably a hot-melt adhesive film that does not require a drying process after application, or a two-component reaction type adhesive that cures relatively quickly, rather than a solvent-volatile adhesive.

As mentioned above, the upper mold 1 and the lower mold 2 are filled with molding material 7,
8, as shown in FIG. After being heated for a period of time, it is cooled to obtain a preformed intersole 7a and a ground sole 8a.

At this time, the molding materials 7 and 8 charged into the respective recesses 4 and 5 are compressed by the partition plate 3, so that the design is faithfully molded according to the shape of the recesses 4 and 5, and the molded materials are compressed by the partition plate 3. The bonding surfaces of the bottom 7a and the ground bottom 8a are formed in the same shape.

Next, as shown in FIG. 9, after separating the upper mold 1 and the lower mold 2 and removing the partition plate 3, as shown in FIG. The upper mold 1 and the lower mold 2 are stacked again with the coated surfaces facing each other, heated for a predetermined time and then cooled, and the preformed middle sole 7a and ground sole 8a are bonded with adhesive 9. It is molded in one piece. At this time, since the preformed intersole 7a and the ground sole 8a have just been heat-formed and the adhesive interface is in a viable state, the adhesive 9
Therefore, when the sponge is compressed and becomes a rubber-like elastic material with an appropriate stiffness, the midsole 7b and the grounding sole 8b are completely integrated, and as shown in FIG. A shoe sole 10 having a two-layer structure with a grounding sole 8b is completed.

As described in detail, the method of the present invention compresses and molds the molding materials 7 and 8 charged into the upper mold 1 and the lower mold 2 through the partition plate 3, thereby forming the mating midsole 7a and the grounding sole 8a. After preforming, the partition plate 3 is removed, the upper mold 1 and the lower mold 2 are overlapped again, and the above-mentioned middle sole 7a and the grounding sole 8a are bonded with adhesive 9 in the mold, and at the same time, a suitable rigidity is applied. Since the mating midsole 7b and the grounding sole 8b are integrally molded, the manufacturing process is simplified compared to the conventional method of molding the mating midsole and the grounding sole separately and then pasting them together with adhesive. This has the effect of significantly reducing costs.

Further, according to the second invention of the present invention, the upper mold 1 and the lower mold 2
The above method can be carried out simply by interposing the partition plate 3 between the two. Furthermore, according to the device of the present invention, the adhesion surfaces of the preformed inner sole 7a and the ground sole 8a are formed into shapes that match each other by the partition plate 3, so that the adhesion process in the subsequent molding and adhesion process is reliable. And the finish is beautiful.

[Brief explanation of drawings]

Fig. 1 is a longitudinal cross-sectional side view of the main part of a molding apparatus for carrying out the method of the present invention, Fig. 2 is a plan view of the same mold, and Fig. 3 is 3-3 in Fig. 2.
4 is a plan view of the lower mold, FIG. 5 is a sectional view taken along line 5-5 in FIG. 4, and FIG. 6(a) is a plan view of the insole molding material. (b) is a side view of the same, Figure 7 (a) is a plan view of the grounded bottom molding material, (b) is a side view of the same, Figures 8 to 10 are explanatory diagrams of the molding process, and Figure 11 is the completed product. FIG. 1... Upper mold 2... Lower mold 3... Partition plate 4, 5... Molding recess 6... Uneven pattern
7, 8...Molding material 7a...Preformed insole 8a...Preformed grounding sole 7b...Insole 8b...Grounding sole 9...Adhesive 10. ... Shoe sole patent applicant Mitsuno Co., Ltd. Fig. 2 Fig. 5 Fig. 4 Fig. 1i Fig. S Fig. 7 Fig. 11

Claims (5)

[Claims] (1) A molding material of vulcanized rubber sponge molded to the specified dimensions is placed in each of the upper mold for molding the midsole and the lower mold for molding the grounded sole, and the molding material is placed between the opposing surfaces. A preforming step in which the upper mold and the lower mold are overlapped with a partition plate interposed therebetween, heated for a predetermined period of time, and then cooled, and then the partition plate is removed and the preformed intersole is joined. The upper mold and the lower mold are placed one on top of the other with the surfaces coated with the adhesive applied to the bottom facing each other, heated for a predetermined period of time, and then cooled, thereby bonding the middle sole and the grounding sole together. A method for manufacturing a shoe sole, comprising: a molding and bonding process; (2) Manufacturing the shoe sole according to claim 1, characterized in that, before the preforming step, an adhesive is applied to the surface of the molding material accommodated in the upper mold and the lower mold. Method. (3) After the preforming step, an adhesive is applied to the surfaces of the preformed insole and ground sole. (4) An upper mold having a concave portion for forming a mating midsole, and a lower mold having a concave portion for molding a grounding sole, which is interposed between the upper mold and the lower mold, and whose upper and lower surfaces are mated. and a partition plate formed in a shape that matches the bonding surface of the midsole and the grounding sole, and the partitioning plate is formed between the upper mold and the lower mold in the step of preforming the mating midsole and the grounding sole. A manufacturing device for a shoe sole, which is interposed between the inner sole and the ground sole, and is configured to be removed in the process of forming and adhering the insole and the ground sole. (5) The shoe sole manufacturing apparatus according to claim 4, wherein both upper and lower surfaces of the partition plate are treated with Teflon.