JPH0119882B2 - - Google Patents
Info
- Publication number
- JPH0119882B2 JPH0119882B2 JP60268794A JP26879485A JPH0119882B2 JP H0119882 B2 JPH0119882 B2 JP H0119882B2 JP 60268794 A JP60268794 A JP 60268794A JP 26879485 A JP26879485 A JP 26879485A JP H0119882 B2 JPH0119882 B2 JP H0119882B2
- Authority
- JP
- Japan
- Prior art keywords
- sole
- molding
- upper mold
- lower mold
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000465 moulding Methods 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 238000005192 partition Methods 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 14
- 239000012778 molding material Substances 0.000 claims description 12
- 239000004636 vulcanized rubber Substances 0.000 claims description 3
- 239000004809 Teflon Substances 0.000 claims description 2
- 229920006362 Teflon® Polymers 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 238000000638 solvent extraction Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 10
- 230000005484 gravity Effects 0.000 description 4
- 238000005187 foaming Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
Landscapes
- Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、クツシヨン性が要求されるジヨギン
グシユーズその他のスポーツシユーズに採用され
ている２層構造から成る厚い靴底の製造方法及び
その方法を実施する製造装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing thick soles with a two-layer structure used in jogging shoes and other sports shoes that require cushioning properties, and a method thereof. The present invention relates to a manufacturing apparatus for carrying out the above.
従来の技術
上記のような靴底は通常、ゴムスポンジでつく
られ、スポンジの発泡率を高めて比重を小さくし
た仕込み材料で成形された軽くて柔軟性を有する
合中底と、スポンジの発泡を押えて比重を大きく
した仕込み材料で成形された耐摩耗性のすぐれた
接地底との２層構造から成つている。PRIOR TECHNOLOGY Shoe soles as described above are usually made of rubber sponge, with a light and flexible insole molded from a material that increases the foaming rate of the sponge and reduces its specific gravity; It has a two-layer structure with a ground-contact sole that has excellent wear resistance and is made of a material that has been pressed to increase its specific gravity.
従来、このような２層構造の靴底は、合中底と
接地底を別々に成形し、両者を接着剤で張り合わ
せていた。 Conventionally, such two-layer shoe soles have had an insole and a ground sole formed separately, and then glued together with an adhesive.
発明が解決しようとする問題点
しかし、張り合わせによる靴底の製造方法で
は、成形した合中底と接地底の接着表面にバフ掛
け又はプライマー処理を施したのち、接着剤を１
〜２回塗布し、しばらく乾燥させてから両者を接
着していたので、製造工程が多くて手間を要し、
製造コストが高くなる欠点があつた。Problems to be Solved by the Invention However, in the method of manufacturing shoe soles by laminating, the adhesive surfaces of the molded insole and the ground sole are buffed or primed, and then an adhesive is applied to the adhesive surface.
It was applied twice, allowed to dry for a while, and then glued together, so there were many manufacturing steps and it was time-consuming.
The drawback was that manufacturing costs were high.
本発明は、このような事情に鑑みなされたもの
で、その目的とするところは、製造工程を簡略化
して作業能率を向上させ、製造コストが大幅に低
減できる靴底の製造方法及びその方法を実施する
ための製造装置を提供することにある。 The present invention was made in view of the above circumstances, and its purpose is to provide a method for manufacturing shoe soles that can simplify the manufacturing process, improve work efficiency, and significantly reduce manufacturing costs. The objective is to provide manufacturing equipment for carrying out the process.
問題点を解決するための手段
本発明による靴底の製造方法は、合中底を成形
する上型と接地底を成形する下型の各型内に、そ
れぞれ所定寸法に型取りした加硫ゴムスポンジの
成形材料を収容し、その対接面の間に仕切り板を
介装した状態で前記上型と前記下型を重ね合わせ
て所定時間加熱したのち冷却する予備成形工程
と、続いて、前記仕切り板を除去し、予備成形さ
れた合中底と接地底の接着剤が塗布された表面を
対接して前記上型と前記下型を重ね合わせ、所定
時間加熱したのち冷却することによつて、前記合
中底と前記接地底を接着させながら、一体成形す
る成形接着工程と、を含むことを特徴とする。前
記接着剤は、前記予備成形工程の前に、前記上型
及び前記下型に収容した成形材料の表面に塗布す
るか、前記予備成形工程の後に、予備成形された
合中底及び接地底の表面に塗布又は添着するもの
とする。Means for Solving the Problems In the method of manufacturing a shoe sole according to the present invention, vulcanized rubber is molded to predetermined dimensions in each of the upper mold for molding the midsole and the lower mold for molding the ground sole. A preforming step of accommodating a sponge molding material, overlapping the upper mold and the lower mold with a partition plate interposed between their contact surfaces, heating for a predetermined time, and then cooling; By removing the partition plate, overlapping the upper mold and the lower mold with the adhesive-applied surfaces of the preformed middle sole and ground sole facing each other, heating for a predetermined period of time, and then cooling. , a molding and bonding step of integrally molding the insole and the grounding sole while bonding them together. The adhesive may be applied to the surface of the molding material contained in the upper mold and the lower mold before the preforming step, or applied to the preformed midsole and ground sole after the preforming step. It shall be applied or attached to the surface.
また、本発明による靴底製造装置は、合中底を
成形する凹部を設けた上型と、接地底を成形する
凹部を設けた下型と、前記上型と前記下型との間
に介装され、その上下両面が合中底及び接地底の
接着表面に合致する形状に形成されている仕切り
板とを備え、前記仕切り板が、合中底と接地底を
予備成形する工程においては前記上型と前記下型
との間に介装され、合中底と接地底との成形接着
工程においては除去されるように構成されてい
る。 Furthermore, the shoe sole manufacturing apparatus according to the present invention includes an upper mold having a concave portion for molding a midsole, a lower mold having a concave portion for molding a ground sole, and an intervening mold between the upper mold and the lower mold. and a partition plate whose upper and lower surfaces are formed in a shape that matches the bonding surfaces of the joint insole and the grounding sole, and in the step of preforming the joint insole and the grounding sole, the partition plate It is interposed between the upper mold and the lower mold, and is configured to be removed during the molding and bonding process of the mating midsole and the grounding sole.
実施例
以下、本発明の実施例を図面に基づいて説明す
る。第１図は本発明方法を実施する成形装置を示
しており、該装置は合中底を成形する上型１と、
接地底を成形する下型２と、上型１と下型２の間
に介装する仕切り板３とを備えている。上型１
は、第２図、第３図に良く示されているように、
踵部は深く、前底部に至るにしたがい漸次浅くな
る成形凹部４が設けられている。下型２は、第４
図、第５図に示すように、成形凹部５の前底先端
部分が上型１の前底部より少し延長して先細にな
つており、凹部５の底面に滑り止めの意匠を成形
するための凹凸模様６が設けられている。仕切り
板３は、上下両面が合中底と接地底との接着表面
に合致する形状に形成され、実施例においては、
踵部後端と前底先端に対応する箇所が上向きに屈
曲している。Embodiments Hereinafter, embodiments of the present invention will be described based on the drawings. FIG. 1 shows a molding device for carrying out the method of the present invention, and the device includes an upper mold 1 for molding an insole,
It includes a lower mold 2 for forming a grounded sole, and a partition plate 3 interposed between the upper mold 1 and the lower mold 2. Upper mold 1
As shown in Figures 2 and 3,
The heel part is deep and is provided with a molded recess 4 that becomes shallower as it reaches the front bottom part. The lower mold 2 is the fourth
As shown in Figures 5 and 5, the tip of the front bottom of the molding recess 5 extends slightly from the front bottom of the upper mold 1 and becomes tapered. An uneven pattern 6 is provided. The partition plate 3 has upper and lower surfaces formed in a shape that matches the bonding surface between the inner sole and the grounded sole, and in the embodiment,
The parts corresponding to the rear end of the heel and the tip of the front sole are bent upward.
靴底の成形材料は、合中底、接地底ともポリブ
タジエン系（BR系）又はエチレンビニールアセ
テート系（EVA系）の加硫ゴムスポンジを用い
るケースが多く、合中底用には、軽くて柔軟性を
保有させるため発泡率を高めて比重が約0.05〜
0.25の材料を使用し、接地底用には、耐摩耗性を
大きくするため発泡を少なくして比重が約0.20〜
0.40の材料を使用することが好ましい。 The molding material for shoe soles is often polybutadiene-based (BR-based) or ethylene vinyl acetate-based (EVA-based) vulcanized rubber sponge for both the insole and the ground sole. In order to maintain its properties, the foaming rate has been increased and the specific gravity is approximately 0.05~
0.25 material is used, and for the ground bottom, foaming is reduced to increase wear resistance and the specific gravity is approximately 0.20 ~
Preferably, 0.40 material is used.
合中底用の成形材料７は、第６図ａ，ｂに示す
ように、輪郭形状が上型１の凹部４とほぼ同一形
状をなし、各部の長さt1が凹部４の深さの約1.2
〜2.0倍の寸法に型取りした板状材料とする。接
地底用の成形材料８も、第７図ａ，ｂに示すよう
に、輪郭形状が下型２の成形凹部５とほぼ同一形
状をなし、厚さt2が凹部５の深さの約1.2〜2.0倍
の寸法に型取りした板状材料とする。 As shown in FIGS. 6a and 6b, the molding material 7 for the middle sole has a contour shape that is almost the same as the recess 4 of the upper mold 1, and the length t1 of each part is equal to the depth of the recess 4. Approximately 1.2
A plate-shaped material is molded to ~2.0 times the size. As shown in FIGS. 7a and 7b, the molding material 8 for the grounding bottom also has an outline shape that is almost the same as the molding recess 5 of the lower mold 2, and the thickness t2 is approximately 1.2 of the depth of the recess 5. A plate-shaped material is molded to ~2.0 times the size.
上記のように型取りした成形材料７，８はそれ
ぞれ、第１図に示すように、上型１の凹部４と下
型２の凹部５に嵌め込んで仕込むが、この仕込み
前に、合中底用材料７と接地底用材料８の接着面
に予め溶媒揮発型の接着剤９を塗布し、乾燥して
おく。また、この場合、仕切り板３の上下両面に
は接着剤９の付着を防ぐためテフロン処理を施
す。なお、接着剤９は、後述する予備成形工程が
終了し、仕切り板３を除去した後に、予備成形さ
れた合中底７ａ及び接地底８ａの接着面に塗布又
は添着しても良い。この場合、接着剤は溶媒揮発
型よりは塗布後の乾燥工程が不要なホツトメルト
の接着フイルムや、あるいは二液反応型の比較的
接着硬化の早い接着剤が望ましい。 The molding materials 7 and 8 molded as described above are respectively fitted into the recess 4 of the upper mold 1 and the recess 5 of the lower mold 2 as shown in FIG. A solvent-volatile adhesive 9 is applied in advance to the bonding surfaces of the bottom material 7 and the grounded bottom material 8 and dried. Further, in this case, Teflon treatment is applied to both the upper and lower surfaces of the partition plate 3 to prevent the adhesive 9 from adhering. Note that the adhesive 9 may be applied or attached to the adhesive surfaces of the preformed midsole 7a and the ground sole 8a after the preforming process described below is completed and the partition plate 3 is removed. In this case, the adhesive is preferably a hot-melt adhesive film that does not require a drying process after application, or a two-component reaction type adhesive that cures relatively quickly, rather than a solvent-volatile adhesive.
上述のように、上型１と下型２にそれぞれ成形
材料７，８を仕込んだのち、先ず第８図に示すよ
うに、成形材料７，８の対接面の間に仕切り板３
を介装した状態で、上型１と下型２を重ね合わ
せ、所定時間加熱したのち冷却して、予備成形さ
れた合中底７ａと接地底８ａを得る。このとき、
各凹部４，５に仕込まれた成形材料７，８は仕切
り板３によつて圧縮されるから、凹部４及び５の
形状に添つて忠実に意匠が成形されると共に、成
形された合中底７ａと接地底８ａの接着表面が同
一形状に形成される。 As described above, after filling the upper mold 1 and the lower mold 2 with the molding materials 7 and 8, first, as shown in FIG.
The upper mold 1 and the lower mold 2 are placed on top of each other, heated for a predetermined period of time, and then cooled to obtain a preformed intersole 7a and a grounded sole 8a. At this time,
Since the molding materials 7 and 8 charged into the respective recesses 4 and 5 are compressed by the partition plate 3, the design is molded faithfully according to the shape of the recesses 4 and 5, and the molded intersole is The bonding surfaces of 7a and the grounding sole 8a are formed in the same shape.
次に、第９図に示すように、上型１と下型２を
一旦離間して仕切り板３を除去したのち、第１０
図のように、合中底７ａと接地底８ａの接着剤９
が塗布された表面を対接して再び上型１と下型２
を重ね合わせ、所定時間加熱したのち冷却して、
予備成形された合中底７ａと接地底８ａとを接着
剤９で接着させながら一体成形する。このとき、
予備成形された合中底７ａ及び接地底８ａは加熱
成形直後で接着界面が半活性状態であるから、接
着剤９により接着させ易く、したがつてスポンジ
が圧縮され適正な剛さのゴム状弾性物質となつた
合中底７ｂと接地底８ｂは完全に一体化され、第
１１図に示すように、合中底７ｂと接地底８ｂの
２層構造からなる靴底１０が完成する。 Next, as shown in FIG. 9, after separating the upper mold 1 and the lower mold 2 and removing the partition plate 3,
As shown in the figure, the adhesive 9 between the mating sole 7a and the grounding sole 8a
Upper mold 1 and lower mold 2 are placed again with the coated surfaces facing each other.
are stacked on top of each other, heated for a specified period of time, and then cooled.
The preformed inner sole 7a and the ground sole 8a are integrally molded while being adhered with an adhesive 9. At this time,
Since the adhesive interface of the preformed midsole 7a and the ground sole 8a is in a semi-active state immediately after heat molding, it is easy to adhere them with the adhesive 9, and the sponge is compressed and has a rubber-like elasticity of appropriate stiffness. The material insole 7b and the ground sole 8b are completely integrated, and as shown in FIG. 11, a shoe sole 10 having a two-layer structure of the insole 7b and the ground sole 8b is completed.
発明の効果
以上説明したように、本発明方法は、上型１及
び下型２に仕込んだ成形材料７，８を仕切り板３
を介して圧縮成形することにより合中底７ａ及び
接地底８ａを予備成形したのち、仕切り板３を除
去して再び上型１と下型２を重ね合わせ、型内で
前記合中底７ａと接地底８ａを接着剤９で接着す
ると同時に、適正な剛さの合中底７ｂと接地底８
ｂにして一体成形するようにしたから、合中底と
接地底を別々に成形したのち、両者を接着剤で張
り合わせる従来方法に比べて工程が簡略化され、
製造コストを大幅に低減できる効果がある。Effects of the Invention As explained above, the method of the present invention allows the molding materials 7 and 8 charged in the upper mold 1 and the lower mold 2 to be transferred to the partition plate 3.
After preforming the mating midsole 7a and the grounding sole 8a by compression molding through a At the same time, the grounding sole 8a is glued with adhesive 9, and the middle sole 7b and the grounding sole 8 are bonded with appropriate rigidity.
Since it is integrally molded as B, the process is simplified compared to the conventional method of molding the intersole and the grounding sole separately and then pasting them together with adhesive.
This has the effect of significantly reducing manufacturing costs.
また、本発明の２番目の発明によれば、上型１
と下型２との間に仕切り板３を介装するという簡
単な手段によつて上記方法が実施できる効果があ
る。更に本発明装置によれば、予備成形された合
中底７ａ及び接地底８ａの接着表面が、仕切り板
３によつて互いに合致する形状に形成されるか
ら、これに続く成形接着工程における接着処理が
確実で、かつ仕上りも美麗である。 Further, according to the second invention of the present invention, the upper mold 1
There is an advantage that the above method can be carried out by a simple means of interposing the partition plate 3 between the mold 2 and the lower mold 2. Furthermore, according to the device of the present invention, since the bonding surfaces of the preformed inner sole 7a and the ground sole 8a are formed into shapes that match each other by the partition plate 3, the bonding treatment in the subsequent molding bonding step is not necessary. It is reliable and has a beautiful finish.
第１図は本発明方法を実施する成形装置の要部
縦断側面図、第２図は同上型の平面図、第３図は
第２図の３−３線に沿う断面図、第４図は同下型
の平面図、第５図は第４図の５−５線に沿う断面
図、第６図ａは合中底成形材料の平面図、ｂは同
側面図、第７図ａは接地底成形材料の平面図、ｂ
は同側面図、第８図ないし第１０図は成形工程の
説明図、第１１図は完成された靴底の斜視図であ
る。
１…上型、２…下型、３…仕切り板、４，５…
成形凹部、６…凹凸模様、７，８…成形材料、７
ａ…予備成形された合中底、８ａ…予備成形され
た接地底、７ｂ…合中底、８ｂ…接地底、９…接
着剤、１０…靴底。
Fig. 1 is a vertical sectional side view of the main part of a molding apparatus for carrying out the method of the present invention, Fig. 2 is a plan view of the same mold, Fig. 3 is a sectional view taken along the line 3-3 in Fig. 2, and Fig. 4 is a FIG. 5 is a sectional view taken along the line 5-5 in FIG. 4, FIG. Top view of the underground forming material, b
8 to 10 are explanatory diagrams of the molding process, and FIG. 11 is a perspective view of the completed shoe sole. 1... Upper mold, 2... Lower mold, 3... Partition plate, 4, 5...
Molding recess, 6... uneven pattern, 7, 8... molding material, 7
a... Preformed intersole, 8a... Preformed ground sole, 7b... Folded insole, 8b... Ground sole, 9... Adhesive, 10... Sole.
Claims (1)
型の各型内に、それぞれ所定寸法に型取りした加
硫ゴムスポンジの成形材料を収容し、その対接面
の間に仕切り板を介装した状態で前記上型と前記
下型を重ね合わせて所定時間加熱したのち冷却す
る予備成形工程と、 続いて、前記仕切り板を除去し、予備成形され
た合中底と接地底の接着剤が塗布された表面を対
接して前記上型と前記下型を重ね合わせ、所定時
間加熱したのち冷却することによつて、前記合中
底と前記接地底を接着させながら、一体成形する
成形接着工程と、 を含む靴底の製造方法。 ２ 前記予備成形工程の前に、前記上型及び前記
下型に収容した前記成形材料の表面に接着剤を塗
布することを特徴とする特許請求の範囲第１項記
載の靴底の製造方法。 ３ 前記予備成形工程の後、予備成形された合中
底及び接地底の表面に接着剤を塗布することを特
徴とする特許請求の範囲第１項記載の靴底の製造
方法。 ４ 合中底を成形する凹部を設けた上型と、 接地底を成形する凹部を設けた下型と、 前記上型と前記下型との間に介装され、その上
下両面が合中底及び接地底の接着表面に合致する
形状に形成されている仕切り板とを備え、 前記仕切り板が、合中底と接地底を予備成形す
る工程においては前記上型と前記下型との間に介
装され、合中底と接地底との成形接着工程におい
ては除去されるように構成されている靴底の製造
装置。 ５ 前記仕切り板の上下両面にテフロン処理が施
されていることを特徴とする特許請求の範囲第４
項記載の靴底の製造装置。[Scope of Claims] 1. A molding material of vulcanized rubber sponge molded to predetermined dimensions is housed in each of the upper mold for molding the middle sole and the lower mold for molding the grounded sole, and A preforming step in which the upper mold and the lower mold are overlapped with a partition plate interposed between the surfaces, heated for a predetermined period of time, and then cooled, and then the partition plate is removed and the preformed composite is heated. The upper mold and the lower mold are overlapped with the adhesive-applied surfaces of the midsole and the grounded sole facing each other, heated for a predetermined period of time, and then cooled to bond the jointed midsole and the grounded sole. A method for manufacturing a shoe sole, comprising: a molding adhesion step of integrally molding the sole while 2. The method of manufacturing a shoe sole according to claim 1, characterized in that, before the preforming step, an adhesive is applied to the surface of the molding material accommodated in the upper mold and the lower mold. 3. The method of manufacturing a shoe sole according to claim 1, wherein after the preforming step, an adhesive is applied to the surfaces of the preformed insole and ground sole. 4. An upper mold having a concave portion for molding a ground sole, a lower mold having a concave portion for molding a grounding sole, and an upper mold and a lower mold interposed between the upper mold and the lower mold, the upper and lower surfaces of which are formed into a joint sole. and a partition plate formed in a shape that matches the adhesive surface of the grounding sole, and the partitioning plate is provided between the upper mold and the lower mold in the step of preforming the joint sole and the grounding sole. A manufacturing device for a shoe sole, which is constructed to be interposed and removed in a process of forming and adhering an insole and a ground sole. 5. Claim 4, characterized in that both upper and lower surfaces of the partition plate are treated with Teflon.
The manufacturing device for shoe soles described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60268794A JPS62127003A (en) | 1985-11-28 | 1985-11-28 | Method and apparatus for producing shoe sole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60268794A JPS62127003A (en) | 1985-11-28 | 1985-11-28 | Method and apparatus for producing shoe sole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62127003A JPS62127003A (en) | 1987-06-09 |
| JPH0119882B2 true JPH0119882B2 (en) | 1989-04-13 |
Family
ID=17463358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60268794A Granted JPS62127003A (en) | 1985-11-28 | 1985-11-28 | Method and apparatus for producing shoe sole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62127003A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02149206A (en) * | 1988-11-30 | 1990-06-07 | Moon Star Co | Manufacture of shoe |
-
1985
- 1985-11-28 JP JP60268794A patent/JPS62127003A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62127003A (en) | 1987-06-09 |
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