JPS62126283U - - Google Patents
Info
- Publication number
- JPS62126283U JPS62126283U JP1379386U JP1379386U JPS62126283U JP S62126283 U JPS62126283 U JP S62126283U JP 1379386 U JP1379386 U JP 1379386U JP 1379386 U JP1379386 U JP 1379386U JP S62126283 U JPS62126283 U JP S62126283U
- Authority
- JP
- Japan
- Prior art keywords
- liquid passage
- substrate
- hole
- passage recess
- holding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 12
Landscapes
- Coating Apparatus (AREA)
- Weting (AREA)
Description
第１図〜第５図は本考案の実施例を示し、第１
図は第１の実施例による基板回転保持装置の縦断
面図、第２図はその平面図、第３図は第２の実施
例による基板回転保持装置の縦断面図、第４図は
第３の実施例の斜視図、第５図は第４図のＡ―Ａ
縦断面図、第６図は従来例による縦断面図である
。
１……回転軸、２……回転ヘツド、２ａ……基
板保持面、３……基板、４……吸気孔、５……基
板の透孔、６・１６……通液凹部、９・１９……
通液孔、１４……基板囲いピン。
1 to 5 show embodiments of the present invention.
The figure is a longitudinal sectional view of the substrate rotation and holding device according to the first embodiment, FIG. 2 is a plan view thereof, FIG. 3 is a longitudinal sectional view of the substrate rotation and holding device according to the second embodiment, and FIG. FIG. 5 is a perspective view of the embodiment of FIG.
FIG. 6 is a vertical cross-sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1...Rotating shaft, 2...Rotating head, 2a...Substrate holding surface, 3...Substrate, 4...Intake hole, 5...Through hole in substrate, 6/16...Liquid passage recess, 9/19 ……
Liquid passage hole, 14...board enclosure pin.
Claims (1)
ツドの基板保持面に基板の透孔と同径又は透孔よ
り大径の通液凹部を形成し、基板の透孔から流下
した処理液をこの通液凹部を介して排出するよう
に構成した基板用処理装置の基板回転保持装置に
おいて、 通液凹部の周側から回転ヘツドの外側に亘つて
通液孔を貫通し、この通液孔を介して通液凹部内
に流下した処理液を排出するように構成したこと
を特徴とする基板処理装置の基板回転保持装置。 ２ 通液凹部側壁面を外側へ向けて下り勾配にし
た実用新案登録請求の範囲第１項に記載した基板
用処理装置の基板回転保持装置。[Scope of Claim for Utility Model Registration] 1. A rotating head is fixed to the upper end of the rotating shaft, and a liquid passage recess with the same diameter or a larger diameter than the through hole of the substrate is formed on the substrate holding surface of the rotating head, and In a substrate rotation and holding device of a substrate processing apparatus configured to discharge the processing liquid flowing down from the through hole through the liquid passage recess, the liquid passage hole is provided from the circumferential side of the liquid passage recess to the outside of the rotating head. 1. A substrate rotation and holding device for a substrate processing apparatus, characterized in that the processing liquid is penetrated through the liquid passage hole and discharged into the liquid passage recess through the liquid passage hole. 2. A substrate rotation and holding device for a substrate processing apparatus as set forth in claim 1 of the Utility Model Registration Claim, in which the side wall surface of the liquid passage recess is sloped downward toward the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986013793U JPH0441977Y2 (en) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986013793U JPH0441977Y2 (en) | 1986-01-31 | 1986-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62126283U true JPS62126283U (en) | 1987-08-11 |
| JPH0441977Y2 JPH0441977Y2 (en) | 1992-10-02 |
Family
ID=30803189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986013793U Expired JPH0441977Y2 (en) | 1986-01-31 | 1986-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0441977Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63143970A (en) * | 1986-12-09 | 1988-06-16 | Tokyo Electron Ltd | Substrate mounting stand |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5982257U (en) * | 1982-11-25 | 1984-06-02 | 株式会社東芝 | Resist coating equipment |
-
1986
- 1986-01-31 JP JP1986013793U patent/JPH0441977Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5982257U (en) * | 1982-11-25 | 1984-06-02 | 株式会社東芝 | Resist coating equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63143970A (en) * | 1986-12-09 | 1988-06-16 | Tokyo Electron Ltd | Substrate mounting stand |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0441977Y2 (en) | 1992-10-02 |
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