JPS62125779U - - Google Patents

Info

Publication number
JPS62125779U
JPS62125779U JP1342186U JP1342186U JPS62125779U JP S62125779 U JPS62125779 U JP S62125779U JP 1342186 U JP1342186 U JP 1342186U JP 1342186 U JP1342186 U JP 1342186U JP S62125779 U JPS62125779 U JP S62125779U
Authority
JP
Japan
Prior art keywords
case
sealing
resin material
cushioning material
adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1342186U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1342186U priority Critical patent/JPS62125779U/ja
Publication of JPS62125779U publication Critical patent/JPS62125779U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1342186U 1986-01-30 1986-01-30 Pending JPS62125779U (xx)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1342186U JPS62125779U (xx) 1986-01-30 1986-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1342186U JPS62125779U (xx) 1986-01-30 1986-01-30

Publications (1)

Publication Number Publication Date
JPS62125779U true JPS62125779U (xx) 1987-08-10

Family

ID=30802466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1342186U Pending JPS62125779U (xx) 1986-01-30 1986-01-30

Country Status (1)

Country Link
JP (1) JPS62125779U (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05343452A (ja) * 1992-06-09 1993-12-24 Mitsubishi Electric Corp 半導体封止用樹脂の保持移送方法及びその装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05343452A (ja) * 1992-06-09 1993-12-24 Mitsubishi Electric Corp 半導体封止用樹脂の保持移送方法及びその装置

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