JPS62119952U - - Google Patents
Info
- Publication number
- JPS62119952U JPS62119952U JP693086U JP693086U JPS62119952U JP S62119952 U JPS62119952 U JP S62119952U JP 693086 U JP693086 U JP 693086U JP 693086 U JP693086 U JP 693086U JP S62119952 U JPS62119952 U JP S62119952U
- Authority
- JP
- Japan
- Prior art keywords
- output
- articulation
- dial
- variable resistor
- output current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000024121 nodulation Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Electrotherapy Devices (AREA)
- Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP693086U JPH0421545Y2 (enExample) | 1986-01-20 | 1986-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP693086U JPH0421545Y2 (enExample) | 1986-01-20 | 1986-01-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62119952U true JPS62119952U (enExample) | 1987-07-30 |
| JPH0421545Y2 JPH0421545Y2 (enExample) | 1992-05-18 |
Family
ID=30789907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP693086U Expired JPH0421545Y2 (enExample) | 1986-01-20 | 1986-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0421545Y2 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6982488B2 (en) | 1999-08-24 | 2006-01-03 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7061120B2 (en) | 1999-05-20 | 2006-06-13 | Amkor Technology, Inc. | Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| US7190071B2 (en) | 1999-05-07 | 2007-03-13 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US9466545B1 (en) | 2007-02-21 | 2016-10-11 | Amkor Technology, Inc. | Semiconductor package in package |
-
1986
- 1986-01-20 JP JP693086U patent/JPH0421545Y2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7190071B2 (en) | 1999-05-07 | 2007-03-13 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7061120B2 (en) | 1999-05-20 | 2006-06-13 | Amkor Technology, Inc. | Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US6982488B2 (en) | 1999-08-24 | 2006-01-03 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7211900B2 (en) | 1999-08-24 | 2007-05-01 | Amkor Technology, Inc. | Thin semiconductor package including stacked dies |
| US9466545B1 (en) | 2007-02-21 | 2016-10-11 | Amkor Technology, Inc. | Semiconductor package in package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0421545Y2 (enExample) | 1992-05-18 |