JPS62118458U - - Google Patents
Info
- Publication number
- JPS62118458U JPS62118458U JP508386U JP508386U JPS62118458U JP S62118458 U JPS62118458 U JP S62118458U JP 508386 U JP508386 U JP 508386U JP 508386 U JP508386 U JP 508386U JP S62118458 U JPS62118458 U JP S62118458U
- Authority
- JP
- Japan
- Prior art keywords
- glass
- mesa
- junction
- covered
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims 2
- 238000002161 passivation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thyristors (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP508386U JPS62118458U (US08088918-20120103-C00476.png) | 1986-01-20 | 1986-01-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP508386U JPS62118458U (US08088918-20120103-C00476.png) | 1986-01-20 | 1986-01-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62118458U true JPS62118458U (US08088918-20120103-C00476.png) | 1987-07-28 |
Family
ID=30786336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP508386U Pending JPS62118458U (US08088918-20120103-C00476.png) | 1986-01-20 | 1986-01-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62118458U (US08088918-20120103-C00476.png) |
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1986
- 1986-01-20 JP JP508386U patent/JPS62118458U/ja active Pending