JPS62118453U - - Google Patents
Info
- Publication number
- JPS62118453U JPS62118453U JP531886U JP531886U JPS62118453U JP S62118453 U JPS62118453 U JP S62118453U JP 531886 U JP531886 U JP 531886U JP 531886 U JP531886 U JP 531886U JP S62118453 U JPS62118453 U JP S62118453U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin molded
- molded semiconductor
- fixture
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000013013 elastic material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP531886U JPS62118453U (cs) | 1986-01-17 | 1986-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP531886U JPS62118453U (cs) | 1986-01-17 | 1986-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62118453U true JPS62118453U (cs) | 1987-07-28 |
Family
ID=30786789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP531886U Pending JPS62118453U (cs) | 1986-01-17 | 1986-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118453U (cs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09121008A (ja) * | 1995-10-25 | 1997-05-06 | Nec Corp | 半導体装置のパッケージ |
| US11195775B2 (en) | 2019-07-03 | 2021-12-07 | Fuji Electric Co., Ltd. | Semiconductor module, semiconductor device, and manufacturing method of semiconductor module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4735237U (cs) * | 1971-05-10 | 1972-12-19 | ||
| JPS554569B2 (cs) * | 1977-01-31 | 1980-01-31 |
-
1986
- 1986-01-17 JP JP531886U patent/JPS62118453U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4735237U (cs) * | 1971-05-10 | 1972-12-19 | ||
| JPS554569B2 (cs) * | 1977-01-31 | 1980-01-31 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09121008A (ja) * | 1995-10-25 | 1997-05-06 | Nec Corp | 半導体装置のパッケージ |
| US11195775B2 (en) | 2019-07-03 | 2021-12-07 | Fuji Electric Co., Ltd. | Semiconductor module, semiconductor device, and manufacturing method of semiconductor module |