JPS62118435U - - Google Patents
Info
- Publication number
- JPS62118435U JPS62118435U JP1986004827U JP482786U JPS62118435U JP S62118435 U JPS62118435 U JP S62118435U JP 1986004827 U JP1986004827 U JP 1986004827U JP 482786 U JP482786 U JP 482786U JP S62118435 U JPS62118435 U JP S62118435U
- Authority
- JP
- Japan
- Prior art keywords
- thermocompression bonding
- base
- bonding device
- adhered
- thermocompression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
-
- H10W72/072—
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986004827U JPS62118435U (enExample) | 1986-01-17 | 1986-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986004827U JPS62118435U (enExample) | 1986-01-17 | 1986-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62118435U true JPS62118435U (enExample) | 1987-07-28 |
Family
ID=30785851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986004827U Pending JPS62118435U (enExample) | 1986-01-17 | 1986-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118435U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0262059A (ja) * | 1988-08-29 | 1990-03-01 | Hitachi Ltd | 半導体装置の製造方法及び装置 |
-
1986
- 1986-01-17 JP JP1986004827U patent/JPS62118435U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0262059A (ja) * | 1988-08-29 | 1990-03-01 | Hitachi Ltd | 半導体装置の製造方法及び装置 |
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