JPS62116547U - - Google Patents
Info
- Publication number
- JPS62116547U JPS62116547U JP324586U JP324586U JPS62116547U JP S62116547 U JPS62116547 U JP S62116547U JP 324586 U JP324586 U JP 324586U JP 324586 U JP324586 U JP 324586U JP S62116547 U JPS62116547 U JP S62116547U
- Authority
- JP
- Japan
- Prior art keywords
- storage
- sides
- pair
- pieces
- guide rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
Landscapes
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP324586U JPS62116547U (enExample) | 1986-01-14 | 1986-01-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP324586U JPS62116547U (enExample) | 1986-01-14 | 1986-01-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62116547U true JPS62116547U (enExample) | 1987-07-24 |
Family
ID=30782828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP324586U Pending JPS62116547U (enExample) | 1986-01-14 | 1986-01-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62116547U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03185718A (ja) * | 1989-12-14 | 1991-08-13 | Nec Corp | 半導体ウェハー熱処理装置 |
-
1986
- 1986-01-14 JP JP324586U patent/JPS62116547U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03185718A (ja) * | 1989-12-14 | 1991-08-13 | Nec Corp | 半導体ウェハー熱処理装置 |
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