JPS62109477U - - Google Patents
Info
- Publication number
- JPS62109477U JPS62109477U JP20078085U JP20078085U JPS62109477U JP S62109477 U JPS62109477 U JP S62109477U JP 20078085 U JP20078085 U JP 20078085U JP 20078085 U JP20078085 U JP 20078085U JP S62109477 U JPS62109477 U JP S62109477U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pads
- die bonding
- bonding pad
- resistor
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20078085U JPS62109477U (nl) | 1985-12-27 | 1985-12-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20078085U JPS62109477U (nl) | 1985-12-27 | 1985-12-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62109477U true JPS62109477U (nl) | 1987-07-13 |
Family
ID=31163616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20078085U Pending JPS62109477U (nl) | 1985-12-27 | 1985-12-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62109477U (nl) |
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1985
- 1985-12-27 JP JP20078085U patent/JPS62109477U/ja active Pending