JPS62109326U - - Google Patents

Info

Publication number
JPS62109326U
JPS62109326U JP20231785U JP20231785U JPS62109326U JP S62109326 U JPS62109326 U JP S62109326U JP 20231785 U JP20231785 U JP 20231785U JP 20231785 U JP20231785 U JP 20231785U JP S62109326 U JPS62109326 U JP S62109326U
Authority
JP
Japan
Prior art keywords
contact
protrusion
electrode
contact portion
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20231785U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20231785U priority Critical patent/JPS62109326U/ja
Publication of JPS62109326U publication Critical patent/JPS62109326U/ja
Pending legal-status Critical Current

Links

Landscapes

  • High-Tension Arc-Extinguishing Switches Without Spraying Means (AREA)
JP20231785U 1985-12-26 1985-12-26 Pending JPS62109326U (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20231785U JPS62109326U (enrdf_load_html_response) 1985-12-26 1985-12-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20231785U JPS62109326U (enrdf_load_html_response) 1985-12-26 1985-12-26

Publications (1)

Publication Number Publication Date
JPS62109326U true JPS62109326U (enrdf_load_html_response) 1987-07-13

Family

ID=31166581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20231785U Pending JPS62109326U (enrdf_load_html_response) 1985-12-26 1985-12-26

Country Status (1)

Country Link
JP (1) JPS62109326U (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7061082B2 (en) 1997-02-25 2006-06-13 Micron Technology, Inc. Semiconductor die with attached heat sink and transfer mold
US7220615B2 (en) 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
US7244637B2 (en) 1998-09-03 2007-07-17 Micron Technology, Inc. Chip on board and heat sink attachment methods

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7061082B2 (en) 1997-02-25 2006-06-13 Micron Technology, Inc. Semiconductor die with attached heat sink and transfer mold
US7244637B2 (en) 1998-09-03 2007-07-17 Micron Technology, Inc. Chip on board and heat sink attachment methods
US7220615B2 (en) 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding

Similar Documents

Publication Publication Date Title
JPS61189522U (enrdf_load_html_response)
JPS62109326U (enrdf_load_html_response)
JPH0415119U (enrdf_load_html_response)
JPS62171135U (enrdf_load_html_response)
JPS63105237U (enrdf_load_html_response)
JPH0180741U (enrdf_load_html_response)
JPS5928921U (ja) 導電液体接点スイツチ
JPS6423810U (enrdf_load_html_response)
JPS6220479U (enrdf_load_html_response)
JPS61106022U (enrdf_load_html_response)
JPS61129246U (enrdf_load_html_response)
JPH0295139U (enrdf_load_html_response)
JPS61172433U (enrdf_load_html_response)
JPS62102228U (enrdf_load_html_response)
JPH0412225U (enrdf_load_html_response)
JPS62102235U (enrdf_load_html_response)
JPS63117014U (enrdf_load_html_response)
JPS61127539U (enrdf_load_html_response)
JPH0279573U (enrdf_load_html_response)
JPS62183363U (enrdf_load_html_response)
JPH02130824U (enrdf_load_html_response)
JPS62142130U (enrdf_load_html_response)
JPS6315537U (enrdf_load_html_response)
JPS6452225U (enrdf_load_html_response)
JPH0312773U (enrdf_load_html_response)