JPS62107457U - - Google Patents

Info

Publication number
JPS62107457U
JPS62107457U JP1985202064U JP20206485U JPS62107457U JP S62107457 U JPS62107457 U JP S62107457U JP 1985202064 U JP1985202064 U JP 1985202064U JP 20206485 U JP20206485 U JP 20206485U JP S62107457 U JPS62107457 U JP S62107457U
Authority
JP
Japan
Prior art keywords
cap
circuit board
ring
alumite
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985202064U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0341474Y2 (is
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985202064U priority Critical patent/JPH0341474Y2/ja
Publication of JPS62107457U publication Critical patent/JPS62107457U/ja
Application granted granted Critical
Publication of JPH0341474Y2 publication Critical patent/JPH0341474Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1515Shape
    • H01L2924/15153Shape the die mounting substrate comprising a recess for hosting the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
JP1985202064U 1985-12-24 1985-12-24 Expired JPH0341474Y2 (is)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985202064U JPH0341474Y2 (is) 1985-12-24 1985-12-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985202064U JPH0341474Y2 (is) 1985-12-24 1985-12-24

Publications (2)

Publication Number Publication Date
JPS62107457U true JPS62107457U (is) 1987-07-09
JPH0341474Y2 JPH0341474Y2 (is) 1991-08-30

Family

ID=31166103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985202064U Expired JPH0341474Y2 (is) 1985-12-24 1985-12-24

Country Status (1)

Country Link
JP (1) JPH0341474Y2 (is)

Also Published As

Publication number Publication date
JPH0341474Y2 (is) 1991-08-30

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