JPS62105602U - - Google Patents

Info

Publication number
JPS62105602U
JPS62105602U JP19717685U JP19717685U JPS62105602U JP S62105602 U JPS62105602 U JP S62105602U JP 19717685 U JP19717685 U JP 19717685U JP 19717685 U JP19717685 U JP 19717685U JP S62105602 U JPS62105602 U JP S62105602U
Authority
JP
Japan
Prior art keywords
electromagnetic wave
wave absorbing
absorbing material
waveguide
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19717685U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19717685U priority Critical patent/JPS62105602U/ja
Publication of JPS62105602U publication Critical patent/JPS62105602U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Non-Reversible Transmitting Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る電磁波吸収装置を示す破
断斜視図、第2図は他の実施例を示す破断斜視図
、第3図は第1図の―線部の部分拡大図、第
4図呼び第5図は従来の電磁波吸収装置の断面図
である。 符号の説明、100……電磁波吸収装置、10
……電磁波吸収物質、20……導波管。
Fig. 1 is a cutaway perspective view showing an electromagnetic wave absorbing device according to the present invention, Fig. 2 is a cutaway perspective view showing another embodiment, Fig. 3 is a partially enlarged view of the portion marked with - in Fig. 1, and Fig. 4 FIG. 5 is a sectional view of a conventional electromagnetic wave absorbing device. Explanation of symbols, 100... Electromagnetic wave absorber, 10
...Electromagnetic wave absorbing material, 20...Waveguide.

Claims (1)

【実用新案登録請求の範囲】 (1) 電磁波吸収物質が導波管内に接合されてな
る電磁波吸収装置。 (2) 前記電磁波吸収物質は金属ロウ層、ハンダ
層あるいは樹脂層から選ばれるいずれか少なくと
も1種の接合層を介して導波管内に接合されてな
る実用新案登録請求の範囲第1項記載の装置。 (3) 前記電磁波吸収物質は導波管内に焼ばめさ
れてなる実用新案登録請求の範囲第1項記載の装
置。 (4) 前記電磁波吸収物質は炭化珪素焼結体であ
る実用新案登録請求の範囲第1項記載の装置。
[Claims for Utility Model Registration] (1) An electromagnetic wave absorbing device in which an electromagnetic wave absorbing material is bonded within a waveguide. (2) The utility model according to claim 1, wherein the electromagnetic wave absorbing material is bonded within the waveguide via at least one bonding layer selected from a metal solder layer, a solder layer, and a resin layer. Device. (3) The device according to claim 1, wherein the electromagnetic wave absorbing material is shrink-fitted into a waveguide. (4) The device according to claim 1, wherein the electromagnetic wave absorbing material is a sintered silicon carbide body.
JP19717685U 1985-12-21 1985-12-21 Pending JPS62105602U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19717685U JPS62105602U (en) 1985-12-21 1985-12-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19717685U JPS62105602U (en) 1985-12-21 1985-12-21

Publications (1)

Publication Number Publication Date
JPS62105602U true JPS62105602U (en) 1987-07-06

Family

ID=31156660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19717685U Pending JPS62105602U (en) 1985-12-21 1985-12-21

Country Status (1)

Country Link
JP (1) JPS62105602U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01115304U (en) * 1988-01-29 1989-08-03

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036911U (en) * 1973-08-06 1975-04-17
JPS607529U (en) * 1983-06-27 1985-01-19 株式会社東芝 air conditioner

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036911U (en) * 1973-08-06 1975-04-17
JPS607529U (en) * 1983-06-27 1985-01-19 株式会社東芝 air conditioner

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01115304U (en) * 1988-01-29 1989-08-03

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