JPS62104458U - - Google Patents
Info
- Publication number
- JPS62104458U JPS62104458U JP19667985U JP19667985U JPS62104458U JP S62104458 U JPS62104458 U JP S62104458U JP 19667985 U JP19667985 U JP 19667985U JP 19667985 U JP19667985 U JP 19667985U JP S62104458 U JPS62104458 U JP S62104458U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- insulating film
- pad
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19667985U JPS62104458U (zh) | 1985-12-20 | 1985-12-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19667985U JPS62104458U (zh) | 1985-12-20 | 1985-12-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62104458U true JPS62104458U (zh) | 1987-07-03 |
Family
ID=31155720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19667985U Pending JPS62104458U (zh) | 1985-12-20 | 1985-12-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62104458U (zh) |
-
1985
- 1985-12-20 JP JP19667985U patent/JPS62104458U/ja active Pending