JPS62104172U - - Google Patents
Info
- Publication number
- JPS62104172U JPS62104172U JP19691585U JP19691585U JPS62104172U JP S62104172 U JPS62104172 U JP S62104172U JP 19691585 U JP19691585 U JP 19691585U JP 19691585 U JP19691585 U JP 19691585U JP S62104172 U JPS62104172 U JP S62104172U
- Authority
- JP
- Japan
- Prior art keywords
- heater
- heater block
- block
- planar
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000009529 body temperature measurement Methods 0.000 claims 1
- 238000010792 warming Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図および第２図は本考案の実施例を示し、
第１図はこの実施例の分解斜視図、第２図は組立
状態の縦断側面図である。
１……電子部品、５……第１ヒータブロツク、
６……第２ヒータブロツク、７……平面形ヒータ
、８，９……凹部、１１……載置面、１６，１７
……保温室。
1 and 2 show an embodiment of the present invention,
FIG. 1 is an exploded perspective view of this embodiment, and FIG. 2 is a longitudinal sectional side view of the assembled state. 1...Electronic component, 5...First heater block,
6... Second heater block, 7... Planar heater, 8, 9... Recessed portion, 11... Placement surface, 16, 17
... Warming room.
Claims (1)
と、外表面のほぼ全面にわたつて発熱する平面形
ヒータと、第２ヒータブロツクとを備え、 前記第１ヒータブロツクと第２ヒータブロツク
との間に平面形ヒータを挟み込んだ状態で、これ
ら３者を一体的に結合すると共に、 前記両ヒータブロツクのうち、少なくとも一方
のヒータブロツクに凹部を形成し、この凹部と前
記平面形ヒータまたは他の部材とで保温室を構成
してなる電子部品の高温測定用加熱装置。[Claims for Utility Model Registration] A first heater block comprising: a first heater block having a mounting surface for electronic components; a planar heater that generates heat over almost the entire outer surface; and a second heater block; and the second heater block, with the planar heater sandwiched between the three heater blocks and the second heater block, and a recess is formed in at least one of the two heater blocks. A heating device for high temperature measurement of electronic components, which comprises a heating chamber formed by the planar heater or other members.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19691585U JPH0434463Y2 (en) | 1985-12-20 | 1985-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19691585U JPH0434463Y2 (en) | 1985-12-20 | 1985-12-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62104172U true JPS62104172U (en) | 1987-07-02 |
| JPH0434463Y2 JPH0434463Y2 (en) | 1992-08-17 |
Family
ID=31156156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19691585U Expired JPH0434463Y2 (en) | 1985-12-20 | 1985-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434463Y2 (en) |
-
1985
- 1985-12-20 JP JP19691585U patent/JPH0434463Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0434463Y2 (en) | 1992-08-17 |
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