JPH0434463Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a heating device for high temperature measurement, which is used, for example, to measure the electrical characteristics of electronic components in a high temperature state.

<Prior art> Conventionally, devices for heating electronic components to a predetermined measurement temperature include, for example, a heater rod inserted into the center of a heater block that has a mounting surface for electronic components, and the heat generated by the heater rod is used to heat the device. A known device heats a heater block at a predetermined temperature and heats electronic components on the heater block to a measurement temperature.

<Problems to be solved by the invention> However, in such conventional heating devices, since the center of the heater block is close to the heater rod, it is possible to obtain the necessary heating temperature; The required heating temperature cannot be obtained in the peripheral portions of the heater block that are far away from the heater block. Therefore, the heater block as a whole is
There is a problem in that the temperature is high in the central part, and the temperature distribution becomes more uneven as you move toward the periphery, making it impossible to uniformly heat the electronic components on the heater block.

In view of these conventional problems, an object of the present invention is to provide a heating device for high temperature measurement that can uniformly heat electronic components to be measured to a measurement temperature.

Furthermore, it is an object of the present invention to provide a heating device for high temperature measurement that has excellent heating efficiency.

<Means for solving the problem> In order to achieve this purpose, this invention
A heating device for high temperature measurement of electronic components includes a first heater block having a mounting surface for electronic components, a planar heater that generates heat over almost the entire outer surface, and a second heater block.
a heater block, with a planar heater sandwiched between the first heater block and the second heater block, these three are integrally connected, and at least one of the two heater blocks A recess is formed on the inner surface of the heater block, and the recess and the planar heater form a sealed space inside.

<Function> According to the above configuration, the planar heater heats the entire surface of the heater block almost uniformly, and since the planar heater is sandwiched between both heater blocks, the amount of heat radiated is extremely small. This allows the heater block to be heated more uniformly and efficiently.

Furthermore, a sealed space is formed in the heater block, reducing the volume of the heater block and increasing the heating capacity of the heater per unit volume of the heater block, which also makes heating the heater block more efficient. It will be done.

Although the air in the sealed space has a large specific heat, the weight ratio with the heater block material is so large that the specific heat can be ignored. This air does not interfere with the heating of the heater block, making it possible to heat the heater block efficiently as described above.

<Example> Hereinafter, the present invention will be described in detail based on an example shown in the drawings.

Figure 1 is an exploded perspective view of this embodiment;
The figure is a longitudinal sectional side view of the assembled state. The heating device for high temperature measurement shown in these figures heats, for example, electronic components 1 in units. This electronic component 1 is a quad type C component in which a group of lead terminals 3 are drawn out from four sides of a package portion 2. The lead terminal group 3 of each electronic component 1 is connected to a long lead frame 4 and is formed integrally with this lead frame 4, and when measuring high temperature, the electronic components of the unit number on the lead frame 4 are connected to each other. 1 are treated as one unit.

The heating device for high temperature measurement of this embodiment is composed of first and second heater blocks 5, 6, and a planar heater 7 sandwiched between both heater blocks 5, 6. Both heater blocks 5 and 6 each consist of a horizontally long flat rectangular parallelepiped block, and each has a plurality of recesses 8 and 9 formed on one side thereof. The surface of the first heater block 5 that faces the opening surface 10 of the recess 8 serves as a mounting surface 11 for the electronic component 1, and the mounting surface 11 has a plurality of fitting recesses 12 on the lead frame 4. They are formed in one row at the same pitch as the arrangement pitch of the electronic components 1. This fitting recess 12 is into which the package part 2 of each electronic component 1 is fitted, and is formed in the same shape as the package part 2.

The planar heater 7 is a thin, rectangular heater 7 having the same shape as the main surfaces of both heater blocks 5 and 6, and has a heater wire 14 in a meandering repeating pattern in its base 13, extending almost from the base 13. It is embedded over the entire surface, and when energized, heat is generated over almost the entire outer surface.

The first and second heater blocks 5, 6 and the planar heater 7 are integrally coupled with the opening surfaces 10, 15 of the recesses 8, 9 of each heater block facing the front and back surfaces of the planar heater 7. Can be assembled. In this assembled state, the recesses 8 and 9 are sealed on both sides of the planar heater 7, thereby forming sealed spaces 16 and 17.

In the above configuration, when the planar heater 7 is energized to generate heat, heat is transferred to both heater blocks 5 and 6 from almost the entire surface of the joint surface with the planar heater 7, resulting in a uniform temperature distribution over the entire surface. Furthermore, since the planar heater 7 is sandwiched between both heater blocks 5 and 6, the amount of heat radiated is extremely small.
Sealed spaces 16 and 1 are provided in the heater blocks 5 and 6.
7 is formed, the volumes of the heater blocks 5 and 6 are reduced, and the heating capacity per unit volume of the heater blocks 5 and 6 by the heater 7 is increased, and the synergistic effect of these makes the heating of the heater blocks 5 and 6 extremely efficient. Well done.

Although the air in the sealed spaces 16 and 17 has a large specific heat, the weight ratio with the material of the heater blocks 5 and 6 is so large that the specific heat can be ignored. Since the heat is difficult to be radiated to the outside, the air in the sealed spaces 16 and 17 does not interfere with heating the heater blocks, making it possible to efficiently heat the heater blocks 5 and 6 as described above.

Normally, the heating control of the heater blocks 5 and 6 is performed by detecting the temperature of the heater blocks 5 and 6 using a sensor, and turning on the heater when the temperature is out of the set value range.
It is controlled ON and OFF. If the heating efficiency of the heater block is improved as in the present invention, when the temperature of the heater block becomes lower than the set range and the heater is turned on, the temperature of the heater block will increase rapidly, and this will cause the heater block to The temperature of the block can always be maintained accurately within the set value range.

<Effects of the invention> As described above, according to the invention, the heater block is heated uniformly and efficiently, so that electrical property measurements of electronic components in high-temperature conditions can be performed satisfactorily. .

[Brief explanation of drawings]

1 and 2 show an embodiment of the present invention,
FIG. 1 is an exploded perspective view of this embodiment, and FIG. 2 is a longitudinal sectional side view of the assembled state. 1...Electronic component, 5...First heater block,
6... Second heater block, 7... Planar heater, 8, 9... Recessed portion, 11... Placement surface, 16, 1
7...Sealed space section.

Claims (1)

[Claims for Utility Model Registration] A first heater block having a mounting surface for electronic components, a planar heater that generates heat over almost the entire outer surface, and a second heater block, the first heater block and the second heater block, with the planar heater sandwiched between the three heater blocks, and a recess is formed in the inner surface of at least one of the two heater blocks. A heating device for high temperature measurement of electronic components, comprising a sealed space inside the recess and the planar heater.