JPS62103273U - - Google Patents
Info
- Publication number
- JPS62103273U JPS62103273U JP19450785U JP19450785U JPS62103273U JP S62103273 U JPS62103273 U JP S62103273U JP 19450785 U JP19450785 U JP 19450785U JP 19450785 U JP19450785 U JP 19450785U JP S62103273 U JPS62103273 U JP S62103273U
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- light emitting
- nickel plating
- reflection mechanism
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000013307 optical fiber Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Description
第１図は本考案の一実施例の構成を示した断面
図、第２図は従来の光フアイバ通信用発光装置の
構成例を示す説明図である。 １……ステム電極、２……反射機構、６……発
光ダイオード素子、９……ニツケルメツキ層、１
０……金メツキ層。
図、第２図は従来の光フアイバ通信用発光装置の
構成例を示す説明図である。 １……ステム電極、２……反射機構、６……発
光ダイオード素子、９……ニツケルメツキ層、１
０……金メツキ層。
Claims (1)
- 発光ダイオード素子が固着される電極部にすり
ばち状の反射機構を形成し、この反射機構の表面
にニツケルメツキ層を介して、０．０５〜０．５
μｍ厚さの金メツキ層を施したことを特徴とする
光フアイバ通信用発光装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19450785U JPS62103273U (ja) | 1985-12-18 | 1985-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19450785U JPS62103273U (ja) | 1985-12-18 | 1985-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62103273U true JPS62103273U (ja) | 1987-07-01 |
Family
ID=31151544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19450785U Pending JPS62103273U (ja) | 1985-12-18 | 1985-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62103273U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0492660U (ja) * | 1990-12-28 | 1992-08-12 |
-
1985
- 1985-12-18 JP JP19450785U patent/JPS62103273U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0492660U (ja) * | 1990-12-28 | 1992-08-12 |