JPS62102970A - Hard sn lapping surface plate - Google Patents
Hard sn lapping surface plateInfo
- Publication number
- JPS62102970A JPS62102970A JP60244758A JP24475885A JPS62102970A JP S62102970 A JPS62102970 A JP S62102970A JP 60244758 A JP60244758 A JP 60244758A JP 24475885 A JP24475885 A JP 24475885A JP S62102970 A JPS62102970 A JP S62102970A
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- lapping
- workpiece
- lapping surface
- rotated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ラッピング用定盤の改良、特にSn定盤摩耗
の維持改良及びSn定盤平面度の維持改良に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvement of a lapping surface plate, particularly to maintenance and improvement of Sn surface plate wear and maintenance and improvement of Sn surface plate flatness.
通常のラップ機は、例えば第1図に示す如き構造である
。主軸により支持ざれた円盤l3よびこの上に取り付け
られたラッピング定盤2が,主軸を駆動する駆動!!置
3によって回転する。この回転運動によってローラガイ
ドを有するアーム6に支持される修正リング7が自転を
する。また、ラノフリング5に接着された加工物4も,
修正リング内で自転する。加工物4ほ、ラソビング定盤
上の遊−11砥8.8により研viされる。A typical lapping machine has a structure as shown in FIG. 1, for example. The disk l3 supported by the main shaft and the lapping surface plate 2 mounted on it drive the main shaft! ! It rotates by position 3. This rotational movement causes the correction ring 7 supported by the arm 6 having a roller guide to rotate. In addition, the workpiece 4 glued to the ranofring 5 also
Rotates within the correction ring. Workpiece 4 is ground with a free-11 whetstone 8.8 on a rasobing surface plate.
従来のラッピング定盤の材質は、Snが90重量チで,
残りが実質的にPbからなる組成を有するものであった
◇
〔発明が解決しようとする問題点〕
上記のSnラッピング定盤は、軟質なため、修正リング
の定盤修正により定a摩耗が早く、例えはビノチ0.4
m勲溝深さQ.l mx,溝の谷部の角度120″を有
する定盤台形溝を用い,加工物にMn − Znフエラ
イト,遊離砥粒にダイヤモンドの1μ(羊結晶質ンの粒
子を用い加工を行った場合,溝深さ方向で30時間でO
.OBtnxo)摩耗をしてしまった。また、定盤が部
分的に偏M粍をすることがあり,定盤平面度を7〜10
μm/100m以下に保つことが困難℃あったつ
本発明の目的はラップ定盤の耐摩耗性を促進し。The material of the conventional lapping surface plate is Sn, which is 90% by weight.
The remainder had a composition consisting essentially of Pb ◇ [Problem to be solved by the invention] Since the Sn lapping surface plate described above is soft, the surface plate is corrected by the correction ring so that constant a wear is accelerated. , for example, Binochi 0.4
m groove depth Q. l mx, using a trapezoidal groove on a surface plate with a groove trough angle of 120'', Mn-Zn ferrite as the workpiece, and 1μ of diamond as the free abrasive grain (when machining is performed using sheep crystalline particles, O in 30 hours in groove depth direction
.. OBtnxo) It has worn out. In addition, the surface plate may be partially uneven, and the flatness of the surface plate should be adjusted to 7 to 10.
The object of the present invention is to promote the wear resistance of the lap surface plate when it is difficult to maintain the temperature below μm/100m.
かつ定盤平面度を高精度に維持出来るラッピング定盤を
提供することであろう
〔問題点を解決するための手段〕
本発明では上記目的を達成するために、Snの重量%を
93〜95に増加したラッピング定盤を採用したつまた
、5重量%以下のCu 、 A2 、 Znの少なくと
も13類の金属をこのSnラッピング定盤材料罠添加し
たものも使用することが出来るっ
本発明において、 Snとpbのタープ硬度はSn量が
pb量よりも多いので、 Snの重量%を増すことで定
盤は硬度を増すのであるが、加工物の面精度の点を考慮
すると、 Snを95重量%を越えると硬度が上りすぎ
て、加工物りエツジに欠けが発生するのでこれが限界で
きる。また、Sn 、 Pb以外の4種類の金属材料は
、Snよりも硬度が大であり、後加工工程で加工物の特
性に悪い影響を与えない材料を選定したつ
〔実施例〕
下表に示すよっに、 Sn量を90〜97重量%と変え
てSnが93重量パーセント、残りPbの5n−Pb合
金で作った定盤を用い、直径110絹の修正11ング内
に加工物!接着した直径1001mのラップリングを挿
入したものを載せ、5Qrpmで回転しているラップ機
に装着して、遊離ダイヤ1〜5μmの砥粒でラップした
っNnlに示す従来の定盤の場合は、上記条件で30時
間ランプするとラップの溝は、溝深さ方向で0,08龍
、定盤平面度は7〜10μm/100皿となるが、本発
明によるlV&12と3のラップ定盤の場合には、60
時間ラップ後でn深さ方向で0.08 mtnの摩耗に
抑制され、定盤平面度は5μm/loo朋以下に保たれ
た。5njlが本発明のものよりも多い嵩4のものを用
いた場合は、加工中に加工物に欠け、割れ等が生じた。[Means for solving the problem] In the present invention, in order to achieve the above object, the weight % of Sn is set to 93 to 95. In the present invention, it is also possible to use a Sn wrapping surface plate in which 5% by weight or less of at least 13 types of metals such as Cu, A2, and Zn are added to the Sn wrapping surface plate material. Regarding the tarp hardness of Sn and PB, the amount of Sn is greater than the amount of PB, so increasing the weight% of Sn increases the hardness of the surface plate, but considering the surface accuracy of the workpiece, it is necessary to increase the hardness of Sn by 95% by weight. If it exceeds %, the hardness will increase too much and chipping will occur on the edge of the workpiece, so this is the limit. In addition, the four types of metal materials other than Sn and Pb have higher hardness than Sn, and we selected materials that do not have a negative effect on the characteristics of the workpiece in the post-processing process. Therefore, by changing the amount of Sn from 90 to 97% by weight and using a surface plate made of a 5n-Pb alloy with Sn at 93% by weight and the rest being Pb, the workpiece was placed in a modified 11 ring of silk with a diameter of 110 mm! A bonded wrap ring with a diameter of 1001 m was inserted, and the plate was mounted on a lapping machine rotating at 5 Qrpm, and lapped with free diamond abrasive grains of 1 to 5 μm. When lamped for 30 hours under the conditions, the groove of the lap becomes 0.08 mm in the groove depth direction, and the flatness of the surface plate becomes 7 to 10 μm/100 plates, but in the case of the lap surface plate of lV & 12 and 3 according to the present invention, , 60
After time lapping, wear was suppressed to 0.08 mtn in the n depth direction, and the flatness of the surface plate was maintained at 5 μm/loo or less. When a material with a bulk of 4, in which 5njl was larger than that of the present invention, was used, the workpiece was chipped, cracked, etc. during processing.
なお、ここに示していないがラッピング定盤の材質をS
n 、 Pbの他に、Cu、Aj、Znの金属材料を離
別したものでも良好な結果が得られたつ以下余白
表 Sn定盤材質の特性
〔発明の効果〕
本発明によれは、ラップ定盤の耐摩耗性がS深さ方向で
60時間で0.08朋摩耗する割合で優れているため、
ラップ定盤交換工数及び溝加工工数が半減することがで
きる。また、定盤平面度が5μm/100mmと憂れる
ため、加工物の寸法も蔦精度に仕上げることができる。Although not shown here, the material of the wrapping surface plate is S.
In addition to Sn and Pb, good results were also obtained with separated metal materials of Cu, Aj, and Zn. Because the wear resistance of S is excellent with a wear rate of 0.08 in 60 hours in the depth direction,
The man-hours for replacing the lap surface plate and the man-hours for groove machining can be halved. In addition, since the flatness of the surface plate is only 5 μm/100 mm, the dimensions of the workpiece can be finished with perfect precision.
第1図は通常のラップ機の平面図1と断面図である。 1:円盤、2:ラッピング定盤、3:駆動装置。 4:加工物、5ニラツブリング、6:アーム。 FIG. 1 shows a plan view 1 and a sectional view of a conventional lapping machine. 1: Disc, 2: Wrapping surface plate, 3: Drive device. 4: Workpiece, 5 Niratsubling, 6: Arm.
Claims (1)
らなる組成を有することを特徴とする硬質Snラッピン
グ定盤。 2、更に、Cu、Al、Znの少なくとも1種類の金属
を5重量%以下含有したことを特徴とする特許請求の範
囲第1項記載の硬質Snラッピング定盤。[Scope of Claims] 1. A hard Sn lapping surface plate characterized by having a composition of 93 to 95% by weight of Sn and the remainder substantially consisting of Pb. 2. The hard Sn wrapping surface plate according to claim 1, further containing 5% by weight or less of at least one metal of Cu, Al, and Zn.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60244758A JPS62102970A (en) | 1985-10-31 | 1985-10-31 | Hard sn lapping surface plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60244758A JPS62102970A (en) | 1985-10-31 | 1985-10-31 | Hard sn lapping surface plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62102970A true JPS62102970A (en) | 1987-05-13 |
Family
ID=17123459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60244758A Pending JPS62102970A (en) | 1985-10-31 | 1985-10-31 | Hard sn lapping surface plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62102970A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006075527A1 (en) * | 2005-01-12 | 2006-07-20 | Sumitomo Electric Industries, Ltd. | METHOD FOR ABRASING GaN SUBSTRATE |
-
1985
- 1985-10-31 JP JP60244758A patent/JPS62102970A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006075527A1 (en) * | 2005-01-12 | 2006-07-20 | Sumitomo Electric Industries, Ltd. | METHOD FOR ABRASING GaN SUBSTRATE |
JP2006196609A (en) * | 2005-01-12 | 2006-07-27 | Sumitomo Electric Ind Ltd | POLISHING METHOD OF GaN SUBSTRATE |
CN100421224C (en) * | 2005-01-12 | 2008-09-24 | 住友电气工业株式会社 | Method for grinding GaN substrate |
US7452814B2 (en) | 2005-01-12 | 2008-11-18 | Sumitomo Electric Industries, Ltd. | Method of polishing GaN substrate |
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