JPS62101432A - Copper lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a copper-clad laminate formed by laminating a glass cloth woven fabric layer and a glass nonwoven fabric layer.

[Technological disadvantages of inventions and their problems]

FIG. 3 shows a cross-sectional view of a conventional copper-clad laminate. It is formed in a Zandwidge structure in which glass cloth woven fabric layers 12 are laminated on both sides of a glass cloth nonwoven fabric layer 11.

The glass cloth woven fabric layer 12 is cut at a predetermined location of this copper-clad laminate to form a V-groove 14 that reaches the inner glass non-woven fabric layer 11, and the copper-clad laminate is divided into copper-clad laminates of a predetermined size. It looks like this. The copper-clad laminate 13 for mounting electronic components is formed by printing a pattern of copper foil or the like on each of the V-grooves 14 as boundaries.

After forming the wiring portion 13, this copper-clad laminate is subjected to processing such as component mounting and soldering.
4 as a boundary, but during these machining processes, it may break at the V-groove 14 as a boundary, making it impossible to perform the desired addition. For this reason, (1) the groove 14 is formed shallowly, but it becomes difficult to break, and when dividing from the V groove 1/I, the outer glass cloth woven fabric 1i'1j12 and the inner glass cloth nonwoven fabric layer are separated. There was a problem that layer delamination occurred with No. 11.

[Purpose of the invention]

The present invention has been made in consideration of the above circumstances, and aims to provide a copper-clad laminate that prevents bending at V tM during processing and prevents layer peeling during splitting.

[Summary of the invention]

In order to achieve the above object, the copper clad laminate according to the present invention has the following features:
It is characterized by a woven glass cloth layer provided at the center of the board thickness.

[Embodiments of the invention]

FIG. 1 is a sectional view of a copper-clad laminate according to an embodiment of the present invention. A glass cloth woven fabric layer 1 is placed in the center of the plate thickness, and a glass cloth nonwoven fabric layer 2 is laminated on the upper and lower surfaces of this glass cloth woven fabric layer 1. Another woven glass cloth layer 3 is laminated to form a five-layer structure. The V'M'I for division is cut from the top and bottom of the glass cloth woven fabric layer 3 as the outer layer, and is processed up to the glass cloth nonwoven fabric layer 2 as the middle layer. It is processed so that it does not reach this level. The V-groove 4 must not be applied to the glass cloth 11 layer 1 at the center of the plate thickness゛C1
Cutting strength is improved by the woven glass cloth layer 1 at the center of the thickness of the plate, and there is no possibility of it breaking from the V-groove 4 during processing such as component mounting and soldering. In addition, by spacing the glass cloth woven fabric layer 1 by about 1 m at the center of the board thickness, the binding strength of the entire board is increased, and the bonding force between the glass cloth nonwoven layer 2 and the outer glass layer 1 [I woven fabric / 13] Layer peeling can be suppressed. Furthermore, when dividing, a slightly stronger force is applied than before. , copper foil or the like is formed on each outer surface of the upper and lower glass cloth layers 3 .

FIG. 2 shows copper 41i'hII according to another embodiment of the present invention.
Figure 3 shows a cross-sectional view of the lamina. The copper-clad laminate of this embodiment has a three-layer structure in which a glass cloth layer 2 is laminated on the lower surface of the glass cloth layer 1. The wiring portion 5 is formed on each side of the upper and lower glass cloth woven fabric layers 2, but the V fi% 'I for division is formed only on this side glass cloth woven fabric layer 2, and 1 is not formed. Therefore, this embodiment can provide the same effects as the previous embodiment.

The present invention is not limited to the above embodiments, and various modifications are possible.

For example, in order to increase the strength, a woven glass cloth layer may be further provided outside the non-woven glass cloth layer.

〔Effect of the invention〕

As described above, according to the present invention, since the woven glass cloth layer is provided at the center of the thickness of the board, the cutting strength is improved, and the board does not break or peel during cutting. Further, since it is easy to divide, there is no problem in separating the parts after processing.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a wiring board according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a copper-clad laminate according to another embodiment of the present invention,
FIG. 3 is a cross-sectional view of a conventional copper-clad laminate. 1.3. '11.13...Glass cloth woven fabric layer, 2.12
...Glass cloth nonwoven fabric layer, 4.14...V groove. Applicant's agent Mr. Sato Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] 1. A copper-clad laminate comprising a woven glass cloth layer and a non-woven glass cloth layer, characterized in that a woven glass cloth layer is provided at the center of the thickness of the sheet. Board. 2. In the copper-clad laminate according to claim 1,
A copper-clad laminate board characterized in that both surface layers of the board are made of glass cloth woven fabric layers.