JPS6197951A - 半導体チツプの冷却装置 - Google Patents

半導体チツプの冷却装置

Info

Publication number
JPS6197951A
JPS6197951A JP59218317A JP21831784A JPS6197951A JP S6197951 A JPS6197951 A JP S6197951A JP 59218317 A JP59218317 A JP 59218317A JP 21831784 A JP21831784 A JP 21831784A JP S6197951 A JPS6197951 A JP S6197951A
Authority
JP
Japan
Prior art keywords
semiconductor chip
liquid
cooling
protrusion
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59218317A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0570940B2 (enExample
Inventor
Shigeki Hirasawa
茂樹 平沢
Hisashi Nakayama
中山　恒
Tadakatsu Nakajima
忠克 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59218317A priority Critical patent/JPS6197951A/ja
Publication of JPS6197951A publication Critical patent/JPS6197951A/ja
Publication of JPH0570940B2 publication Critical patent/JPH0570940B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59218317A 1984-10-19 1984-10-19 半導体チツプの冷却装置 Granted JPS6197951A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59218317A JPS6197951A (ja) 1984-10-19 1984-10-19 半導体チツプの冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59218317A JPS6197951A (ja) 1984-10-19 1984-10-19 半導体チツプの冷却装置

Publications (2)

Publication Number Publication Date
JPS6197951A true JPS6197951A (ja) 1986-05-16
JPH0570940B2 JPH0570940B2 (enExample) 1993-10-06

Family

ID=16717952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59218317A Granted JPS6197951A (ja) 1984-10-19 1984-10-19 半導体チツプの冷却装置

Country Status (1)

Country Link
JP (1) JPS6197951A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02114597A (ja) * 1988-10-24 1990-04-26 Fujikura Ltd 電子素子の冷却方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02114597A (ja) * 1988-10-24 1990-04-26 Fujikura Ltd 電子素子の冷却方法

Also Published As

Publication number Publication date
JPH0570940B2 (enExample) 1993-10-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees