JPS619621A - Optical cell and its production - Google Patents

Abstract

PURPOSE:To prevent leak pass and to permit the hermetic solder sealing of an injection port by forming an underlying layer for solder sealing consisting of an org. resin layer contg. metallic particles into a continuous belt shape on the side faces of both substrates and the side face of a peripheral sealing material so as to enclose the periphery of the injection port. CONSTITUTION:The underlying layer 15 for solder sealing which can be soldered to the periphery of the injection port 4 is formed on the side faces of a cell after the empty cell is assembled by using a pair of the substrates 1, 2 and the periphery sealing material 3. The layer 15 consists of a resin contg. metallic particles and is formed into the continuous belt shape (annular shape) on the side faces 1b, 2b of both substrates 1, 2 and the side face 3a of the peripheral sealing material 3 so as to enclose fully the periphery of the port 4. A liquid crystal is then injected through the port 4 into the cell and thereafter the side face of the cell is dipped for several seconds into a molten solder bath, by which the port 4 is coated and the hermetic solder sealing part 7 is formed on the layer 15.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention is directed to forming an empty cell by arranging a pair of substrates facing each other with a peripheral sealing material in between, and applying the peripheral sealing material to the side surface of the cell. The present invention relates to an optical cell in which a liquid substance such as liquid crystal is injected into the cell through an injection port provided as a notch, and the injection port is sealed by soldering, and to an improvement in a manufacturing method thereof.

(Technical Background of the Invention) For example, in a liquid crystal cell, when a room temperature curing type or thermosetting type organic adhesive such as an epoxy resin is used as an injection port sealing material, after liquid crystal injection, the organic adhesive is applied to the injection port. Because it requires a long curing time of approximately 30 minutes or more from application to curing, the uncured adhesive and curing agent are in direct contact with the liquid crystal material for a long period of time, resulting in chemically weak liquid crystals. There is a risk of deterioration or alteration of quality.

Furthermore, when a photocurable organic adhesive containing an ultraviolet curing agent in the organic adhesive such as acrylic resin is used as the injection port sealant, the curing time (light irradiation time) is as short as several tens of seconds. Although the time during which the uncured adhesive is in direct contact with the liquid crystal is extremely short, the adhesive and sealing properties are usually poorer than the room temperature or heat curing adhesives mentioned above.

Furthermore, since both are organic resins, they have gas permeability, and gases such as water vapor and oxygen can enter the liquid crystal from the injection port sealing part and cause the liquid crystal to deteriorate or change in quality. Lifespan is short.

On the other hand, when solder is used as an inlet sealing material, since the solder is an inorganic substance, it has no gas permeability, and since soldering is done instantaneously, both during and after manufacturing the liquid crystal cell. Also, there is almost no deterioration or alteration of the liquid crystal in the liquid crystal cell, and a long-life liquid crystal cell can be obtained.

Several examples of conventional liquid crystal cells in which this type of solder is used as an injection port sealing material and a notch in a peripheral sealing portion is provided as an injection port will be described below.

In the conventional liquid crystal cell 10 shown in FIGS. 1 to 3, a glass frit or epoxy resin is disposed between a lower glass substrate 1 and an upper glass substrate 2, each having transparent electrodes 1a and 2a provided in a predetermined pattern on their inner surfaces. An inorganic or organic peripheral sealing material 3 such as an adhesive is provided to a predetermined minute thickness of about 5 to 20 microns by screen printing. The injection port 4 is provided as a notch in the peripheral sealing part 3 on one side of the re-substrates 1 and 2. By arranging a pair of substrates 1 and 2 to face each other with a peripheral sealing material 3 in between, and heating the substrates to a temperature higher than the softening temperature of glass when the sealing material 3 is glass frit, or when the sealing material 3 is an epoxy adhesive, By applying heat or other curing conditions, both substrates 1 and 2 are sealed with a peripheral sealant 3 leaving an injection port 4, thereby forming an empty cell (cell after assembly).

On each side surface of both substrates 1 and 2 before assembly, metal films 5 and 5 are applied in advance to predetermined locations near the injection port by a vapor phase plating method such as a vacuum evaporation method or a sputtering method prior to cell assembly.
A is formed in advance, and base layers 5, 5a which can be soldered to predetermined positions on the side surfaces of both substrates 1, 2 are obtained.

After the cell is assembled, liquid crystal 6 is injected into the cell through the injection port 4 to fill it. After filling the liquid crystal, dip the cell inlet 4 into molten solder and pull it up, and the soldering will be completed instantly.
The injection port 4 is sealed with solder to obtain the solder-sealed portion 7, and the liquid crystal cell 10 is completed.

However, before cell assembly, metal vapor deposited films 5, 5a are preliminarily formed around the injection ports on the respective sides of both substrates 1, 2.
In the liquid crystal cell 10 in which the side surfaces 1b of the substrates 1 and 2,
Base layers 5 and 5a that can be soldered are formed only on 2b,
Since a solderable base layer is not formed on the side surface 3a of the peripheral sealing material 3, the liquid crystal cell 10 is removed from the gap 8 between the side surfaces 1b and 2b of both substrates 1 and 2 and the side surface 3a of the peripheral sealing material 3.
A leak path (infiltration path, leakage path, communication path) 9 is configured that communicates the inside and outside of the tank.

If this gap 8 is large, the liquid crystal in the liquid crystal cell 10 may leak out from the leak path 9, and even if the gap 8 is small, external water vapor may leak from the leak path 9 into the liquid crystal in the liquid crystal cell 10. Gases such as oxygen that contaminate the liquid crystal 6 enter, deteriorating the liquid crystal cell 10, and even though the ideal solder sealing material 7 is used, the life of the liquid crystal cell 10 is shortened.

The deposited films 5 and 5a usually consist of at least a first and a second metal film, the first film being a metal film such as chromium or aluminum that has good adhesion to the glass substrates 1 and 2; is made of a metal film with good solder wettability (solder adhesion) such as copper or nickel. In order to form these two layers of vapor deposition films on the sides of the substrates 1 and 2, the substrates 1 and 2 are placed in a vacuum container, and two types of metals are sequentially vapor-deposited and sputtered in a vacuum using a mask. The manufacturing process is complicated, the manufacturing process is time-consuming, the workability is poor, and the cost of the liquid crystal cell 10 is high.

In order to eliminate the above-mentioned drawbacks of the conventional liquid crystal cell 10, as shown in FIGS. 4 to 6, after the cell is assembled, that is, after the empty cell is completed, both substrates 1,
2, as well as the peripheral sealing material 3, a multilayer metal vapor deposited film 11, 11a (solder sealing base layer) is formed in a continuous band pattern around the injection port 4 by vapor deposition or sputtering in a continuous band pattern. The liquid crystal cell 20 was proposed. (Refer to Japanese Unexamined Patent Publication No. 51-69649.) In this liquid crystal cell 20, the solder sealing portion 7 is
Since it is formed not only on the substrates 1 and 2 on the side surfaces of the cell but also on the peripheral sealing material 3 along with 1a, an ideal solder sealing part is formed, but the vapor deposited films 11 and 11
The thickness of a is usually minute, about 1 micron or less,
Therefore, the side surface 3a of the peripheral sealing material 3 and the side surface 1b of the substrates 1 and 2
, 2b is as small as this, but it is effective if the peripheral sealing material 3 is printed on one of the substrates 1 or 2 by a screen printing method, and then the pair of substrates 1 and 2 are overlapped. In the case of a normal cell in which the cell is assembled by sealing, this cannot be applied because the size of the gap 8 is about 100 microns or more, and a leak path exists, shortening the life of the liquid crystal cell 20.

Further, when the evaporated metal particles adhere to the cell side surfaces 1b, 2b, and 3a to form the vapor deposited film 10, the metal particles also infiltrate into the cell from the injection port 4, so that the metal particles are attached to the electrode 1a inside the cell. , 2b, or cause an unsightly spot in the display surface. It is necessary to provide a shield 12 made of a wall having the same thickness as the peripheral sealing material 3 and separated from the injection port 4 and the peripheral sealing material 3 so as to overlap both sides of the injection port 4 when looking inside. The shield 12 allows the metal particles that entered from the injection port 4 to adhere to the side surface of the shield 12 and form the vapor deposited film 1.
3 to stop metal particles from entering the effective display surface behind the shield 12.

However, the presence of this shield 12 reduces the effective display area of the liquid crystal cell 20 and slows down the speed of exhaust and liquid crystal injection. If it is brought close to the peripheral sealing material 3b, the passage 14 becomes narrower and the above-mentioned speed becomes even slower.

OBJECTS OF THE INVENTION An object of the invention is to eliminate the drawbacks of optical cells such as liquid crystal cells mentioned above.

Another object of the present invention is to eliminate the above-mentioned drawbacks of optical cells such as liquid crystal cells whose injection ports are sealed with solder.

Another object of the present invention is to provide an optical cell in which an injection port provided on the side surface of the cell is hermetically sealed with solder, and a method for manufacturing the same.

Still another object of the present invention is to eliminate the need for a shielding body,
An object of the present invention is to provide an optical cell that does not use a metal vapor deposited film as a solder adhesion base layer and that does not cause leakage paths, and a method for manufacturing the same.

(Embodiment of the Invention) An embodiment of the present invention will be described in detail below with reference to FIGS. 7 to 10.

FIG. 7 is a plan view of the liquid crystal cell 30, and FIG. 8 is a plan view of the liquid crystal cell 30.
9 is a side view of the liquid crystal cell 30 before the injection port is sealed, and FIG. 10 is a side view of the liquid crystal cell 30 after the injection port is sealed.

30 is a liquid crystal cell, 1 is a glass upper substrate with a predetermined pattern of transparent electrodes 1a formed on its inner surface, 2 is a glass lower substrate with a predetermined pattern of transparent electrodes 2a formed on its inner surface, and 3 is the pair of substrates 1 described above. , 4 is a peripheral sealing material that is interposed between 2 and provided around the facing surface between both substrates, maintains a predetermined distance between both substrates at a predetermined distance of about 5 to 20 microns, and seals between both substrates; This is an injection port provided as a notch in the sealing material 3. Reference numeral 6 denotes a liquid crystal injected into the cell from the injection port 4 and filled inside the cell, 15 a solderable solder sealing base layer formed around the injection port 4 on the side of the cell, and 7
is an injection port sealing material formed by soldering to cover the solder sealing base layer 15 and the injection port 4 on the side surface of the cell.

The peripheral sealing material 3 is glass frit (inorganic sealing material)
Alternatively, it is made of organic adhesive (organic sealing material), usually glass frit or organic adhesive is made into a screen-printable paste, and a predetermined pattern surrounding the opposing surfaces between both substrates 1 and 2 is formed with some injection holes. The above paste is applied onto one substrate 1 using a screen printing method using a notch portion at the location where the number 4 is to be formed, and dried. Next, the other substrate 2 is aligned and superimposed on this substrate 1.

When using low melting point glass as the peripheral sealing material 3, heating it to a melting temperature of about 350°C or higher, and when using an organic adhesive, heating it (about 200°C or less) or applying other curing conditions, Both substrates 1 and 2 are bonded and sealed using a peripheral sealing material 3.

Further, on the electrode formation surfaces of the substrates 1 and 2, an alignment layer formed by forming an insulating layer and then rubbing the liquid crystal in advance, or an alignment layer formed by diagonally vapor deposited film is provided in order to orient the liquid crystal.

When a glass frit, which requires high-temperature treatment, is used as the peripheral sealing material 3, the alignment layer formed by rubbing may be made of an inorganic material such as silicon oxide, cerium oxide, magnesium fluoride, or cerium fluoride, or a heat-resistant organic material such as polyimide resin. When resin is used and an organic adhesive is used, which can be cured at a relatively low temperature of about 200°C or less, ordinary organic resin insulators such as epoxy resin, phenol resin, melamine resin, and acrylic resin can be used. .

9 and 10 show side views of the liquid crystal cell 30 before and after soldering, respectively.

As shown in Figure 9, after assembling an empty cell, a solder sealing base layer 15 that can be soldered to the side of the cell around the injection port 4
is formed.

The solder sealing base layer 15 is made of resin containing metal particles, and is continuous with the side surfaces 1b and 2b of both substrates 1 and 2 and the side surface 3a of the peripheral sealing material 3 so as to completely surround the periphery of the injection port 4. It should be formed into a band-like (ring-like) shape so as not to block the injection port 4.

As the metal particles, it is desirable to use metals with good solder wettability and solder adhesion, such as copper and silver.

In addition, the above-mentioned resin has good applicability and adhesion to the glass substrates 1 and 2 and the peripheral sealing material 3, and includes low-temperature solder (melting point, about 140°C), eutectic solder (melting point, about 18
Epoxy, which can withstand short-term soldering temperatures of 0℃),
It is desirable to use resins such as phenol, polyester, polyimide, xylene, or a combination of these organic paints or adhesives that have good solder heat resistance.

The solder sealing base layer 15 is made into a paste by diluting the organic resin in which the metal particles are dispersed with a solvent such as butyl carbitol or amyl acetate to adjust the viscosity suitable for screen printing. 1b, 2b, 3
It is produced by printing in a continuous band shape as shown in Figure 9 using a screen printing method, and then curing it after printing.

A low-temperature drying paste that has good screen printability, solderability, and soldering heat resistance and is suitable for this implementation is Copper Conductive Paste ACP manufactured by Asahi Chemical Laboratory Co., Ltd.
-030 (curing conditions: 150°C, 10-30 minutes), silver conductive paste LS-500 (curing conditions: 120°C, 10 minutes)
~30 minutes), and copper conductive paste, Chemitite CT221 manufactured by Toshiba Chemical Corporation (curing conditions, 150 °C, 6
0 minutes, or 180°C for 30 minutes).

When these pastes are applied around the injection port on the side of the cell in the pattern shown in Fig. 9, as shown in Figs. The solder sealing base layer 15 is well coated on the side surfaces 3a of the peripheral sealing material 3, is firmly adhered to these side surfaces after drying (hardening), and has good solder adhesion and solder heat resistance.
becomes. Therefore, in this embodiment, unlike the conventional example, there is no leak path.

Next, the liquid crystal 6 is injected from the injection port 4 into the cell 30 shown in FIG. Then, the injection port 4 is covered and soldered. In this way, as shown in FIG. 7, FIG. 8, and FIG.
An airtight solder sealing portion 7 formed on the portion 5 is obtained.

In this embodiment, unlike the conventional example, there is no leak path (gap), so external gases such as water vapor and oxygen do not infiltrate into the liquid crystal 6 inside the cell, resulting in a highly reliable and long-life liquid crystal cell 30. .

A method for mass-producing the solder sealing base layer 15 of the liquid crystal cell 30 of the above embodiment by screen printing will be explained with reference to FIGS. 11 and 12.

As shown in FIG. 11, after the cells have been assembled according to the above embodiment, a large number of empty cells 30 are housed in a cassette 16 with the injection port 4 facing up and arranged close to each other. Pressure plates 16 are attached to both sides of the cassette 16 via spring members 16a.
b is fixed, and a number of cells 30 are fixed within the cassette 16 in close proximity to each other. The cell side surfaces 30a of all the cells 30 on the injection port 4 side face upward, and all the cell side surfaces 30a are fixed so as to be horizontal as a whole.

The screen (mask) 18 is pasted and fixed on the screen frame 17, and the screen surface 18a of the screen 18 before printing is usually about 0.0
．． They are placed 5 to 1 mm apart.

As shown in FIG. 12, the screen 18 is made of mesh (approximately 100 to 30%
50 mesh) 18a and a photosensitive emulsion layer 18b from which only the opening pattern 18c that coincides with the strip pattern of the solder base layer has been removed by photoetching.

Referring again to FIG. 11, reference numeral 19 is a squeegee having a tip at a predetermined angle and made of a highly elastic resin such as polyurethane, neoprene, silicone, fluorocarbon, etc., which is not affected by the solvent in the paste. 21 is a paste made by diluting metal particles, an organic resin, and a hardening agent with a solvent; as the squeegee 19 is moved in the direction of the arrow 22, the paste 21
is sequentially applied and printed in a predetermined continuous band shape around the injection ports 4 on a large number of cell side surfaces 30a through the opening pattern 18c of the screen 18.

Normally, the line width that can be printed using a screen of about 300 mesh or less is about 0.1 mm or more, and the line width that can be printed using a screen of about 300 mesh or less is about 0.1 mm or more, and
(the total thickness of the pair of glass substrates), that is, the short side of the cell side surface 30a, is usually 2.2 mm or more, and in the case of an ultra-thin cell, it is about 1 mm, so the injection port 4 on the cell side surface 30a is The paste can be easily printed in a continuous strip pattern around the area.

A large number of cells 3 are screen-printed with the paste 21 to form a strip pattern surrounding the injection ports on the side surfaces 30a of the cells.
0, each cassette 16 is placed in a drying oven and heated to below 200°C, for example 150°C, and the paste is hardened.
A large number of solder sealing base layers 15 can be obtained at once.

If the peripheral sealing material 3 or the alignment layer cannot withstand temperatures below 200° C., only the vicinity of the base layer 15 may be locally heated using local heating means such as concentrated infrared light, a hot air nozzle, or high-frequency heating. When performing high frequency heating (high frequency induction heating), only the metal powder in the paste is selectively heated, the resin in the paste is hardened, and the other peripheral sealing material 3 and alignment layer in the empty cell 30 are heated. It will not get overheated.

Next, a large number of liquid crystal cells 30 are filled with the liquid crystal 6 by injecting liquid crystal 6 into the empty cells 30 through the injection port 4 by a well-known liquid crystal injection process together with the cassette 16.

After that, the cassette 16 is turned upside down, and a large number of liquid crystal cells 30 are simultaneously immersed in a molten solder bath for several seconds, and when it is lifted and allowed to cool naturally, a large number of solderings are performed simultaneously.
A large number of injection ports 4 are also covered with solder at the same time, and a large number of liquid crystal cells 30 are completed.

If there is a risk that the liquid crystal cell 30 will fall due to gravity when the cassette 16 is turned upside down,
If the spring pressure of 6 is small, all liquid crystal cells 30
It is preferable to interpose a double-sided adhesive tape in advance on the adjacent surfaces of the two-sided adhesive tape, or to interpose a double-sided adhesive tape in advance between the pressure bonding plate 16 and the liquid crystal cell 30 adjacent to the pressure bonding plate 16. Further, instead of the above-mentioned double-sided adhesive tape, a well-known hot melt adhesive tape may be used.

As shown in FIG. 11, after printing a resin paste containing metal particles on a large number of cell side surfaces 30a and hardening the paste, another screen having a similar opening pattern is placed on a large number of cell side surfaces 30a in a cassette 16. The cells are again placed close to each other and are screen printed on the solder sealing base layer 15 on the side surfaces 30a of the cells using a screen printable solder paste, and after drying the solder paste is heated locally to a temperature higher than the melting temperature of the solder. As a result, a preliminary solder layer surrounding the injection port 4 in a band shape can be formed on the solder sealing base layer 15 without covering the injection port 4.

Thereafter, after injecting liquid crystal from a large number of injection ports 4, the cassette 16 is turned upside down and the cell 30a is immersed in a molten solder bath, thereby coating the preliminary solder layer with the injection ports 4 and soldering without using flux. can be attached. In this way, when flux is not used after the liquid crystal is injected, the solder flux is prevented from coming into contact with the liquid crystal, and there is no risk that the liquid crystal will be contaminated by the flux.

In this case, before injecting the liquid crystal, a flux-containing solder paste is applied on the solder sealing base layer 15 and heated to form a preliminary solder layer, and then, after injecting the liquid crystal from the injection port 4, the solder paste is soldered without flux. Since the solder sealing portion 7 is formed by soldering by dipping, a highly reliable and long-life liquid crystal cell 30 can be obtained.

Examples of screen-printable solder pastes suitable for forming the preliminary solder layer include those manufactured by Co., Ltd.
Solder paste AM-10 manufactured by Asahi Chemical Laboratory (melting point 180°C, alloy composition: 62 tin, 36 lead, 2 wt% silver,
flux content, 12.0 Wt%), AM-20 (melting point 190°C, alloy composition: tin 60, lead 40 Wt%, trace amount of copper, flux content 0.4 Wt%), solder for the above-mentioned copper conductive paste ACP-030 (optimal as a paste), and Sparkle Print SPT manufactured by Chisumi Metal Industries, Ltd.
-51 (melting point 183°C, eutectic solder of 62 tin, 38 wt% lead, flux content 10 wt%), SPT-57 (
Melting point 143℃, low temperature solder, flux content 12Wt
%) etc.

FIGS. 13, 14, and 15 show a liquid crystal cell 40 according to another embodiment of the present invention, in which a two-digit seven-segment type numeric display device is shown.

In the figure, 1a, 1c, 1d, and 1e represent one substrate 1
2a, 2d, and 2e are respectively a segment electrode, an external lead electrode, a first transfer electrode for electrode transfer, and another external lead electrode formed on the inner surface of the other substrate 2.
A digit electrode, a digit lead electrode, and a second transition electrode for electrode transition are formed on the inner surface of the electrode, respectively. 3 is a pair of substrates 1
, 2 is a peripheral sealing material, 4 is a liquid crystal injection port provided as a notch in the peripheral sealing material, and 15 and 7 are a solder base layer and a solder sealing part, respectively, as in the above embodiment.

15b and 7a are an electrode transfer solder base layer and an electrode transfer solder made of the same material as the solder base layer 15, respectively, and the electrode transfer portion 23 is constituted by these solder base layer 15b and the solder 7a. This electrode transition portion 23 can be formed at the same time as the solder base layer 15 for sealing the injection port and the solder sealing material 7 are formed. That is, when forming the solder base layer 15 for sealing the injection port by screen printing, the solder base layer (conductive layer) 15b for electrode transfer is formed at the same time, and the solder sealant 7 for sealing the injection port is formed at the same time. When forming the electrode by immersing it in a solder bath, a solder (conductive layer) 7a for electrode transfer is formed at the same time.

Since the conductive solder base layer 15b is interposed between the first transfer electrode 1d and the second transfer electrode 2e, the second transfer electrode 2e is transferred to the first transfer electrode 1d. Therefore, the plurality of digit electrodes 2a include the digit lead electrode 2d and the second transition electrode 2e.
, the solder base layer 15b, and the first transition electrode 1d to the external lead electrode 1e, and eventually all the external lead electrodes 1c and 1e are drawn out to the end of the exposed surface of one substrate 1.

Solder 7a improves the conductivity of solder base layer 15b,
It serves to protect the solder base layer 15b from the outside.

In this way, in this embodiment, when sealing the injection port, a large number of electrode transitions can be performed simultaneously, and therefore it can be applied to a dynamically driven liquid crystal display cell. Note that when electrode transfer is performed only at the injection port, electrode transfer can only be performed at one location, so this method can only be applied to statically driven liquid crystal display cells.

In the above embodiments, a liquid crystal cell using liquid crystal as the liquid substance has been described, but the present invention can also be applied to other optical cells in which other liquid substances are sealed, such as electrochromic cells and electrophoresis cells.

(Effects of the Invention) As is clear from the above description, the optical cell of the present invention has the following features:
An organic resin layer containing metal particles is formed in a continuous strip pattern on the side surfaces of both substrates and the side surface of the surrounding sealing material so as to completely surround the injection port on the side of the cell, and serves as a solder sealing base layer. Since the injection port is sealed by soldering onto this base layer to cover the injection port, leakage paths can be completely eliminated, and unlike conventional methods using the vapor phase plating method, the injection port is sealed. Since evaporated metal particles do not enter the screen, no shielding body is required, so the effective display area can be increased, and it can be used in normal indoor rooms (
Workability and productivity can be improved as work can be done in the atmosphere (in the atmosphere).
Therefore, a highly reliable, long-life, and inexpensive optical cell can be provided.

In addition, the method of the present invention makes it possible to uniformly form a continuous band pattern of solder sealing underlayers around the injection ports on the side surfaces of multiple cells at the same time using a screen printing method using an organic resin containing metal particles in a paste form. Easily create a large number of optical cells,
Since it can be mass-produced at low cost, it has great economic effects.

Furthermore, when a preliminary solder layer with a continuous strip pattern is provided on the solder sealing base layer by screen printing using solder paste containing flux, flux is not required when dipping into molten solder after injecting the liquid substance. Contact of the liquid substance with the flux is avoided, so
Optical cells that are more reliable and have a longer lifetime can be produced.

[Brief explanation of the drawing]

FIGS. 1, 2, and 3 are a plan view, a cross-sectional view, and a side view, respectively, showing a conventional liquid crystal cell 10. FIG. Figures 4 and 5
6 are a plan view, a sectional view, and a side view, respectively, showing another conventional liquid crystal cell 20. FIG. 7 is a plan view showing an embodiment of the optical cell of the present invention, FIG. 8 is a sectional view taken along line C-C in FIG. 7, and FIG. 9 is a sealing of the injection port of the optical cell of this embodiment. The previous side view and FIG. 10 are the side views after the injection port has been sealed. FIG. 11 shows an embodiment of the method of the present invention, and is a conceptual diagram showing the step of simultaneously forming a hang sealing base layer around the injection ports of a large number of optical cells by screen printing, and FIG. 12 shows the main parts of the screen. (FIG. 12A is an enlarged plan view, and FIG. 12B is a sectional view taken along line DD in FIG. 12A). 13 to 15 show other embodiments of the present invention,
FIG. 13 is a plan view of another embodiment, FIG. 14 is a sectional view taken along line E--E in FIG. 13, and FIG. 15 is a side view of another embodiment. In the figure, 1, 2---substrate, 3---peripheral sealing material,
1a, 2a---electrode, 3a---side surface of peripheral sealing material,
1b, 2b---side surfaces of substrates 1, 2, 4---injection port,
6---Liquid crystal (liquid substance), 7---Inlet sealing material (solder sealing material), 15---Solder sealing base layer (organic resin containing metal particles), 10, 20--- conventional liquid crystal cell,
30, 40---Liquid crystal cell (optical cell) of the present invention, 30
a---Side surface of liquid crystal cell 30, 18---screen,
18c---Continuous strip opening pattern of screen, 19
--- Squeegee, 21 --- Organic resin paste containing metal particles, 23 --- Electrode transition part. that's all

Claims (7)

[Claims] (1) An empty cell is formed by arranging a pair of substrates facing each other with a peripheral sealing material interposed therebetween, and liquid crystal is injected into the cell through an injection port provided as a notch in the peripheral sealing material on the side surface of the cell. In an optical cell formed by injecting and filling a liquid substance such as the following, and sealing the injection port with an injection port sealing material made of solder: a solderable solder sealing base layer is provided around the injection port, The solder sealing base layer is made of an organic resin containing metal particles, and the solder sealing base layer is connected to the side surfaces of both substrates and the peripheral sealing material so as to completely surround the injection port. An optical cell characterized by being formed in a continuous band shape. (2) The metal particles are made of copper or silver, and the organic resin is made of at least one resin selected from the group consisting of epoxy resin, phenol resin, polyester resin, polyimide resin, and xylene resin. The optical cell according to claim 1. (3) The optical device according to claim 1, wherein the solder sealing base layer is a paste prepared by diluting an organic resin containing metal particles with a solvent, which is printed using a screen printing method and then cured. cell. (4) An electrode transition portion is provided at at least one location other than the injection port sealing portion on the side surface of a cell in which a pair of substrates each having an electrode formed on their inner surfaces are arranged facing each other with a peripheral sealing material interposed therebetween; 2. The optical cell according to claim 1, wherein the electrode transition portion comprises a solder base layer of organic resin containing metal particles and solder. (5) Construct an empty cell by arranging the pair of substrates facing each other with a peripheral sealing material in between, and soldering around the injection port provided as a notch in the peripheral sealing material on the side surface of the cell. A method for manufacturing an optical cell, comprising: providing a base layer for solder sealing, filling a liquid substance such as liquid crystal into the cell from the injection port, and sealing the injection port with an injection port sealing material made of solder. In: a first step of arranging a plurality of empty cells close to each other before injecting a liquid substance, and a screen provided with a plurality of continuous band-shaped opening patterns;
a second cell disposed opposite to the injection port forming side surface of the plurality of cells;
a third step of screen-printing an organic resin paste containing metal particles around the plurality of injection ports through the screen, and curing the paste printed on the cells to form a continuous band around the injection ports. A fourth step of forming a solder sealing base layer of
a fifth step of filling a plurality of cells with a liquid substance such as liquid crystal from the injection port; and a sixth step of soldering the injection ports of the plurality of cells to seal the injection ports. A method for manufacturing an optical cell, comprising: (6) Between the fourth step and the fifth step, a preliminary solder forming step is performed to form preliminary solder on the solder sealing base layer, and a second screen is provided with a plurality of opening patterns similar to the screen. is placed again facing the injection port forming side surfaces of the plurality of cells, a screen-printable solder paste is printed on the base layer through the second screen, and the printed paste is heated. 6. The method of manufacturing an optical cell according to claim 5, further comprising providing a preliminary solder layer on the base layer. (7) When forming the solder sealing base layer and solder sealing material for sealing the injection port on the side surfaces of the pair of substrates with electrodes formed on their inner surfaces, it is necessary to The method for manufacturing an optical cell according to claim 5, wherein an electrode transition portion is provided at a location.