JPS6193318A - Heat accumulating device - Google Patents

Abstract

PURPOSE:To provide a heat accumulating device to be applied to a heating equipment etc. which is superior in its use, safe and has a high reliability by a method wherein a heating area has a degree of freedom. CONSTITUTION:Containers 7 having heat accumulators 6 of latent heat are arranged at the upper and lower surfaces of the radiation plate 5 containing aluminum having a high thermal conductivity and a temperature sensor 8 is arranged near the containers 7. At the opposite surface of the radiation plate 5 in the container 7 are arranged heating lines 10 fixed to the core 9. A projected area of the container 7 storing the thermal accumulator 6 is made smaller than that of the thermal radiation plate 5, thereby the thermal radiation are of the radiation plate 5 applied for taking heat can be freely increased or decreased without having any relation with the area of the thermal accumulator 6, resulting in making a quite convenient device. A resiliency characteristic or flexibility is applied to the thermal radiation plate 5, the plate is bent or folded when the thermal accumulation is required, a time for completing the thermal accumulation is made fast and the plate may be expanded or opened when used.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a heat storage device used in a heating device or the like.

U/# configuration of conventional example and its problems □ Conventionally, this type of heat storage device 1'C is
As described above, a heating element 3 and a temperature sensing element 4 were placed on the outer surface of a container 2 containing a latent heat storage element 1. but,
This 11! ), the heat dissipation surface 1. when actually used for heating. It is almost the same as the heat storage area in Llt, and when this heat radiation area is increased, the heat storage area also becomes larger, and when something is locally placed on this heat storage device, the temperature of the heat storage body 1 in this insulated part will rise. Due to damage to the heat storage body 1 and further local overheating, lj &>, 2 of the heat storage body container 2
(This is extremely dangerous as it may cause discoloration of Part 1, Part 4, and Part 4A, and may lead to fire.)

In this case, the number of temperature detectors 4 may be increased to improve the local temperature detection ability, but the arrangement of the temperature detectors 4 may not only increase the feeling of a foreign body and increase the size of the small J1, but also increase the degree of freedom in shape. The problem was that it was difficult to maintain the
・Purpose of the Invention The present invention solves the problems of the conventional technology, and aims to provide a heat storage device that has a heat dissipation area of 1 degree and is easy to use, safe, and highly reliable. .・ tIIri structure of the invention ・1゜In order to achieve this object, the present invention includes a heat storage body using latent heat, a heat generating body, a heat insulating body, a heat radiating body, and a temperature detecting body, and the heat radiating body is The temperature sensor is configured to have a larger projected area than the heat storage body, and the temperature sensing body is located near the heat storage body.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.

In FIG. 2, reference numeral 5 denotes a heat dissipation plate containing Al, which has a high thermal conductivity.A container 7 containing a latent heat storage body 6 is disposed on the upper and lower surfaces of the heat dissipation plate 5, and a temperature sensor 8 is placed near the container 7. It is arranged. Further, on the opposite surface of the container 7 from the heat sink 5, a heat generating wire 10 fixed to an interlining 9 is arranged. Further, the interlining 9 is bonded to the heat sink 5 around the capacitor 7. The strands are covered with a heat insulator 11.

FIG. 3 is a perspective view showing the main parts of the configuration of FIG. 2.

Note that 12 is a lead wire.

As shown in FIGS. 2 and 3, the projected area of the container 7 containing the heat storage body 6 can be made smaller than the heat radiating plate 5 by adjusting the shape of the heat radiating plate to have any shape of the heating section. In this case, something is placed on the heat storage device, causing the ltl [
Even if the thermal state changes, since the area of the heat storage body 6 is small and the temperature detection body 8 is placed near it, there will be no risk of overheating or damage to the heat storage body 6, or even destruction of the W lri 7.
It is extremely safe and does not cause any fire hazards. 1, the heat dissipation surface used for heating) is this heat storage I4-6.
Regardless of i, it can be made larger or smaller at will, making it extremely easy to use. Further, the heat dissipation plate 5 may be made flexible so that it can be folded during heat storage, accelerate the time to complete heat storage, and unfold during use. Also,
31st? By making part of the heat sink 5 removable from the 1A section, it is also possible to remove the deep warm surface. In other words, adjust as appropriate depending on whether the user emphasizes the area used for heating or the time for heat dissipation.
In this embodiment, the heat sink 5 is made of 100 micron 1!11-Ae, polyester, polyamide,
Since the @layer film made of a polymeric material such as polyethylene was used, when the heat storage body 6 is at 60°C, the end of the heat sink 5 is
The temperature reached 8℃, which means that the thermal resistance of the heat insulator 11 is
It was possible to have almost the same surface temperature on the heat insulator 11 by adjusting the portions with and without. The heat insulator 11 may be made of soft urethane foam or the like.

The heat storage body 6 may be made of any material containing organic substances such as paraffin and naphthalene, or hydrated salts that generate large latent heat derived from hydrogen bonds of water molecules, such as acid-resistant trihydrate. In this example, an acetic acid solution, IJium trihydrate, and an acetate-containing material were used.

Further, the temperature sensing body 8 may be any type of thermostat, a negative thermistor, a positive thermistor, or the like.

Although the string-shaped heating wire 10 is used as the heating element in this embodiment, it may also be planar. By storing heat by adding heat from other directions, it is also possible to shorten the time it takes to complete heat storage. In this case, the amount of heat generated by the outer circumference Is of the heat storage body 6 can be easily set based on the size of the heat sink 5 and the heat resistance 11 of the heat generating body.

Effect of the invention (1) Warming section (heat dissipation shape of the tongue can be easily changed).

(2) Damage to the heat storage element even if the insulation state changes locally;
It is safe and does not cause damage to the heat storage container, local overheating, abnormal overheating, or ignition.

(3) Even with a heat storage body having a small projected area, a relatively large heat dissipation area can be secured.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view showing the conventional 1t1 (formation), Fig. 2 is a cross-sectional view showing the structure of an embodiment of the heat storage device of the present invention, and Fig. 3 is a cross-sectional view showing the structure of the main ν portion of the same embodiment. It is a perspective view. 1.6... Heat storage body, 2.7... Container,
3... Heating element, 4.8... Temperature sensing body, 5... Heat sink, 10... Heat generating wire, 1
1...Insulator.

Claims (2)

[Claims] (1) A heat storage body using latent heat, a heating element, a heat insulating body, a heat radiating body, and a temperature sensing body, the projected area of the heat radiating body being larger than the projected area of the heat storage body, and the temperature sensing body A heat storage device in which a body is located near the heat storage body. (2) The heat storage device according to claim 1, wherein at least a portion of the heat radiator is removable.