JPH0479659B2 - - Google Patents
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- Publication number
- JPH0479659B2 JPH0479659B2 JP16828584A JP16828584A JPH0479659B2 JP H0479659 B2 JPH0479659 B2 JP H0479659B2 JP 16828584 A JP16828584 A JP 16828584A JP 16828584 A JP16828584 A JP 16828584A JP H0479659 B2 JPH0479659 B2 JP H0479659B2
- Authority
- JP
- Japan
- Prior art keywords
- heat storage
- temperature
- storage device
- substrate
- storage material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005338 heat storage Methods 0.000 claims description 75
- 239000000758 substrate Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000011232 storage material Substances 0.000 description 25
- 238000013021 overheating Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- BDKLKNJTMLIAFE-UHFFFAOYSA-N 2-(3-fluorophenyl)-1,3-oxazole-4-carbaldehyde Chemical compound FC1=CC=CC(C=2OC=C(C=O)N=2)=C1 BDKLKNJTMLIAFE-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 235000017281 sodium acetate Nutrition 0.000 description 2
- 229940087562 sodium acetate trihydrate Drugs 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 238000004781 supercooling Methods 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、採暖具等に用いられる蓄熱装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a heat storage device used in heating equipment and the like.
従来例の構成とその問題点
従来、この種の蓄熱装置は、例えば第１図に示
す如く、潜熱の蓄熱体１を収納した容器２の外表
面に発熱体３及び温度検知体４を取付けていた。
しかし潜熱の蓄熱体１は、加熱していくと、温度
Taで固相・液相の相変化を伴ない、またある温
度Tb以上になると、過冷却現象あるいは気化を
起こし、蓄熱機能の消滅、気化による膨張による
容器の破裂、さらには過熱による周辺部材の変
色・発火等につながり大きな危険を有している。
そこでこの安全性をもたせるためにこの蓄熱体１
の加熱温度をTaとTbの温度範囲内に温度検知体
４により制御していた。しかし、蓄熱体１及び発
熱体３の熱供給量を調節しても、前記温度Taと
温度Tb間に温度を制御させるためには、蓄熱体
１が温度Taよりも低温の所で発熱体３の制御を
開始せざるを得なくなり、このため、完全に蓄熱
を完了させるまでの時間が非常に長くかかり不便
を感じるという問題を有していた。また、この蓄
熱装置に何か局部的に物を載せられた場合、この
断熱部分の蓄熱体１の温度が上昇し蓄熱体１の損
傷、さらには局部過熱により、蓄熱体容器２の破
裂、構成部材の変色・発火につながる場合があ
り、非常に危険なものであつた。Conventional structure and problems thereof Conventionally, in this type of heat storage device, for example, as shown in FIG. Ta.
However, as the latent heat storage body 1 is heated, the temperature
Ta causes a phase change between the solid phase and liquid phase, and when the temperature exceeds a certain temperature Tb, supercooling phenomenon or vaporization occurs, the heat storage function disappears, the container ruptures due to expansion due to vaporization, and the surrounding components are damaged due to overheating. This poses a great danger as it may cause discoloration and ignition.
Therefore, in order to provide this safety, this heat storage body 1
The heating temperature was controlled within the temperature range of Ta and Tb by a temperature sensor 4. However, even if the amount of heat supplied to the heat storage element 1 and the heat generation element 3 is adjusted, in order to control the temperature between the temperature Ta and the temperature Tb, it is necessary to Therefore, there is a problem in that it takes a very long time to completely complete heat storage, which is inconvenient. In addition, if something is locally placed on this heat storage device, the temperature of the heat storage body 1 in this insulated part will rise, causing damage to the heat storage body 1. Furthermore, local overheating may cause the heat storage container 2 to rupture, This was extremely dangerous as it could lead to discoloration of parts and ignition.
発明の目的
本発明はかかる従来の問題を解消するもので、
蓄熱を完了させるまでの時間を短縮化させた、安
全で信頼性の高い蓄熱装置を提供することを目的
とする。Purpose of the invention The present invention solves such conventional problems,
The purpose of the present invention is to provide a safe and highly reliable heat storage device that shortens the time required to complete heat storage.
発明の構成
この目的を達成するために、本発明は潜熱を利
用した蓄熱体と、発熱体と、温度検知体と、熱伝
導率の大きい基板とを備え、前記基板の少なくと
も一方の面に前記蓄熱体を配し、この蓄熱体の前
記基板と反対の面に前記発熱体を位置させ、前記
温度検知体は、前記基板と熱的に結合させた構成
にしている。Structure of the Invention In order to achieve this object, the present invention includes a heat storage body that utilizes latent heat, a heating element, a temperature sensing body, and a substrate having high thermal conductivity, and the substrate has at least one surface provided with the A heat storage element is disposed, the heating element is positioned on the opposite surface of the heat storage element to the substrate, and the temperature sensing element is thermally coupled to the substrate.
実施例の説明
以下、本発明の一実施例について第２図、第３
図及び第４図に基づいて説明する。DESCRIPTION OF EMBODIMENTS Hereinafter, one embodiment of the present invention will be explained as shown in FIGS. 2 and 3.
This will be explained based on the diagram and FIG.
第２図において５は熱伝導率の大きい厚み30ミ
クロンのAlを含む基板であり、この上下表面に
潜熱蓄熱材料６を収納した容器７と温度検知体８
を配している。またこの容器７の基板５の反対面
には芯地９に固定された発熱線１０を配してい
る。また芯地９は基板５に容器７の周囲で接着さ
れている。第３図は本構成の主要部分を示す斜視
図である。またこれらは断熱体１１により覆われ
ている。なお、１２はリード線である。上記構成
にすることにより、温度検知体８は潜熱蓄熱材料
６の温度を十分に検知し、効率よく、制御するこ
とができるので、潜熱蓄熱材料６の蓄熱を、完了
させる時間を短縮させることができるというすぐ
れた特長を有するものである。 In FIG. 2, 5 is a substrate containing Al with a thickness of 30 microns, which has high thermal conductivity, and a container 7 containing a latent heat storage material 6 on its upper and lower surfaces, and a temperature sensor 8.
are arranged. Further, on the opposite surface of the container 7 from the substrate 5, a heating wire 10 fixed to an interlining 9 is arranged. The interlining 9 is also bonded to the substrate 5 around the container 7. FIG. 3 is a perspective view showing the main parts of this configuration. Further, these are covered with a heat insulator 11. Note that 12 is a lead wire. With the above configuration, the temperature detection body 8 can sufficiently detect the temperature of the latent heat storage material 6 and control it efficiently, so that the time required to complete heat storage of the latent heat storage material 6 can be shortened. It has the excellent feature of being able to
ここで、熱伝導率の大きい基板５と、この実施
例では厚み30μのAl板とポリエチレン、ポリアミ
ド、ポリエステル等の高分子材料からなる積層フ
イルムを用いたが、20μ以上の厚みのAl板以上に
熱伝導性の優れたものであればどのようなもので
あつてもよい。本構成にすることにより、温度検
知体８は、潜熱蓄熱材料６の温度を十分に検知す
ることができ、蓄熱を完了させる時間も早めるこ
とができる。また、本蓄熱装置の上に何か物が置
かれ、局部的に断熱状態が変わつた場合、この物
を置かれた位置に温度検知体がない場合、この部
分の温度は上昇するが、この基板５の熱伝導によ
り温度上昇もかなり緩和され、過熱されることが
ないという優れた特長を有するものである。ま
た、本実施例では容器７は厚み9μのAl板とポリ
エチレンポリアミド、ポリエステル、ポリアミド
等の高分子材料からなる積層フイルムを用いた
が、この容器７のAl板の厚みを大きくし各容器
を連続させることによりAlの厚み20μ以上の熱伝
導を有する基板５を本容器７で兼用させてもよ
い。 Here, as the substrate 5 with high thermal conductivity, a laminated film made of an Al plate with a thickness of 30μ and a polymeric material such as polyethylene, polyamide, polyester, etc. was used in this example. Any material may be used as long as it has excellent thermal conductivity. With this configuration, the temperature sensing body 8 can sufficiently detect the temperature of the latent heat storage material 6, and the time to complete heat storage can be shortened. In addition, if something is placed on top of this heat storage device and the insulation state changes locally, and there is no temperature sensor at the location where this object is placed, the temperature of this part will rise, but this It has the excellent feature that the temperature rise is considerably reduced by the heat conduction of the substrate 5, and there is no possibility of overheating. In addition, in this example, the container 7 used a laminated film made of a 9μ thick Al plate and a polymer material such as polyethylene polyamide, polyester, polyamide, etc., but by increasing the thickness of the Al plate of the container 7, each container was connected continuously. By doing so, the container 7 may also be used as the substrate 5 having a thermal conductivity of 20 μm or more in thickness.
以下、上記構成における作用を説明する。 The operation of the above configuration will be explained below.
第４図は、第２図に示した本発明の一実施例の
主要部分の拡大図であるが、図中の矢視は、熱の
伝導方向を示すものである。通電とともに発熱線
１０は発熱し始め、この熱は容器７を介して潜熱
蓄熱材料６に伝導し、この潜熱蓄熱材料６は昇温
していき、熱伝導率の大きい基板５に伝達され、
この熱が温度検知体８に伝達されるよう構成され
ている。 FIG. 4 is an enlarged view of the main parts of the embodiment of the present invention shown in FIG. 2, and the arrows in the figure indicate the direction of heat conduction. As the electricity is turned on, the heating wire 10 begins to generate heat, and this heat is conducted to the latent heat storage material 6 through the container 7, and the temperature of the latent heat storage material 6 increases, and is transferred to the substrate 5, which has a high thermal conductivity.
The structure is such that this heat is transferred to the temperature sensing body 8.
第５図に潜熱蓄熱材料６、及び発熱線１０及び
温度検知体８の温度上昇を示すが、潜熱蓄熱材料
６は温度Taで固相から液相に相変化するが、時
間t1までは発熱線１０及び潜熱蓄熱材料６及び温
度検知体８は同傾向で温度上昇していくが、時間
t1〜t2の相変化時においては潜熱蓄熱材料６は潜
熱を吸収していく。このため、温度Taで一定と
なり、この潜熱蓄熱材料６と熱伝導率の大きい基
板を介して熱的に結合した温度検知体８もこの温
度Taに追従する形となるが、発熱線１０から芯
地９を介した熱伝導により、若干温度上昇してい
き、ほぼ時間t2で温度検知体８の制御温度に達
し、潜熱蓄熱材料６の過冷却現象、気化による容
器の破裂等に至る温度Ｔより低い一定温度に、基
板５の熱伝導により制御される。すなわち、基板
５の熱伝導により、温度検知体８は、潜熱蓄熱材
料６の相変化に伴なう温度変化に追従した温度検
知をするため、制御による無駄をなくし、蓄熱を
完了させる時間も短縮でき、また、長時間蓄熱加
熱し続けても常に潜熱蓄熱材料６は温度検知体８
の制御温度に誰持される。また本蓄熱装置の一部
に何か物が載せられ局所的に断熱状態が変わつて
も、基板５の熱伝導により、局部過熱等が起こる
こともなく安全である。実際、この基板５がない
従来構成の場合、蓄熱を完了させるまでの時間が
58分要したが、本実施例では21分で蓄熱完了させ
ることができ、また10時間蓄熱加熱後従来例の構
成では、潜熱蓄熱材料の温度が徐々に上昇してい
き温度Tbに近づいたが、本実施例では、約２℃
以下の温度変化に届めることができ、さらに局所
断熱状態における温度上昇も従来例の約30％に届
めることができた。 FIG. 5 shows the temperature rise of the latent heat storage material 6, the exothermic wire 10, and the temperature sensor 8. The latent heat storage material 6 changes phase from solid phase to liquid phase at temperature Ta, but does not generate heat until time t1 . The temperature of the wire 10, the latent heat storage material 6, and the temperature sensor 8 increases in the same manner, but the temperature increases over time.
During the phase change from t1 to t2 , the latent heat storage material 6 absorbs latent heat. Therefore, the temperature Ta remains constant, and the temperature sensing body 8 thermally coupled to the latent heat storage material 6 through a substrate with high thermal conductivity also follows this temperature Ta. Due to heat conduction through the ground 9, the temperature rises slightly and reaches the control temperature of the temperature sensor 8 at approximately time t2 , leading to supercooling of the latent heat storage material 6, rupture of the container due to vaporization, etc. The lower constant temperature is controlled by heat conduction of the substrate 5. That is, due to the heat conduction of the substrate 5, the temperature detection body 8 detects the temperature that follows the temperature change accompanying the phase change of the latent heat storage material 6, thereby eliminating waste due to control and shortening the time to complete heat storage. In addition, even if the latent heat storage material 6 continues to be heated for a long time, the temperature detection body 8
No one is held to the controlled temperature. Furthermore, even if something is placed on a part of the heat storage device and the heat insulation state changes locally, the thermal conduction of the substrate 5 prevents local overheating and is safe. In fact, in the case of a conventional configuration without this board 5, it takes time to complete heat storage.
It took 58 minutes, but in this example, heat storage was completed in 21 minutes, and in the conventional configuration, after 10 hours of heat storage heating, the temperature of the latent heat storage material gradually rose and approached the temperature Tb. , in this example, about 2°C
We were able to achieve the following temperature changes, and furthermore, we were able to achieve a temperature rise of about 30% of the conventional example in a locally adiabatic state.
潜熱蓄熱材料６としては、パラフイン、ナフタ
リン等の有機物あるいは酢酸ナトリウム・３水塩
等の水分子の水素結合に由来する大きな潜熱を有
する水和塩を含むどのような材料であつてもよ
く、本実施例では、酢酸ナトリウム３水塩系蓄熱
材料を用いた。 The latent heat storage material 6 may be any material including an organic substance such as paraffin or naphthalene, or a hydrated salt having a large latent heat derived from hydrogen bonding of water molecules such as sodium acetate trihydrate. In the examples, a sodium acetate trihydrate-based heat storage material was used.
また、温度検知体８としては本実施例ではサー
モスタツトを用いたが、負特性サーミスタ、正特
性サーミスタ等どのようなものであつてもよく、
温度検知体８の熱容量によつては発熱線１０を補
助的に温度検知体に熱的に結合させてもよい。ま
た温度検知体８にPTC素子を用い、発熱線１０
に電気的に直列に接続した形のものであつてもよ
い。この場合、通電初期の消費電力を大きくし、
かつ蓄熱完了後の安定状態での消費電力を小さく
することができるのでON−OFF制御による温度
変動幅をもなくすことができ、急速蓄熱が可能に
なるばかりでなく蓄熱加熱放置状態での蓄熱装置
の信頼性もさらに向上させることができる。 Furthermore, although a thermostat is used as the temperature sensor 8 in this embodiment, it may be any type of thermistor such as a negative characteristic thermistor or a positive characteristic thermistor.
Depending on the heat capacity of the temperature sensing body 8, the heating wire 10 may be auxiliary thermally coupled to the temperature sensing body. In addition, a PTC element is used as the temperature sensor 8, and the heating wire 10
It may be electrically connected in series. In this case, increase the power consumption at the initial stage of energization,
In addition, power consumption in a stable state after heat storage is completed can be reduced, eliminating the temperature fluctuation range caused by ON-OFF control, which not only makes rapid heat storage possible, but also allows the heat storage device to be heated while being left unused. The reliability can also be further improved.
また、蓄熱装置は１制御であれば、どうしても
通電時間が長いほど中央部が端部よりも温度が高
くなるが、ヒータパターンにより端部のワツト密
度を上げると逆に、通電初期に端部の温度がかな
り上がつてしまう。ここで中央部分の蓄熱材料を
除くことにより本実施例の如くこの蓄熱装置の蓄
熱加熱中の蓄熱材料の温度分布をかなり小さくす
ることができ、これは、蓄熱材料の信頼性の向上
につながる。第６図は、蓄熱体に発熱体を取付け
た蓄熱エレメント１３を８個構成した、実施例の
斜視図であるが中央部分の蓄熱エレメント１３を
除き、この部分に温度検知体８を配しているが温
度分布を４℃以下に届めることができた。 In addition, if the heat storage device is under 1 control, the longer the energization time is, the higher the temperature will be at the center than at the ends. The temperature will rise considerably. By removing the heat storage material in the central portion, as in this embodiment, the temperature distribution of the heat storage material during heat storage heating of this heat storage device can be made considerably smaller, which leads to an improvement in the reliability of the heat storage material. FIG. 6 is a perspective view of an embodiment in which eight heat storage elements 13 each having a heating element attached to the heat storage body are arranged, except for the heat storage element 13 in the center, where a temperature sensing element 8 is arranged. However, we were able to achieve a temperature distribution below 4℃.
また、本実施例でも潜熱蓄熱材料を複数個の小
袋に収納させたが、柔軟な容器での液相状態での
形状の不安定性、万一容器が破損した場合の流出
による火傷等を小袋サイズを小さくすればするほ
ど防止することができるという利点を有してい
る。 In addition, although the latent heat storage material was stored in multiple sachets in this example, the size of the sachets also prevented the instability of the shape in the liquid phase state in a flexible container and the risk of burns caused by spillage if the container were to break. This has the advantage that the smaller it is, the more it can be prevented.
また、断熱体としては、軟式発泡ウレタンがよ
く使用されるが、柔いため潜熱蓄熱材料の放熱時
すなわち、使用時に押圧され厚みが非常に小さく
なる場合があるが、本実施例の如く前記発熱線を
ひも状にし、シート状の芯地に配線されたものを
使用することにより、ヒータ厚み分の空気断熱効
果があり、いくら押圧されても、ヒータ厚み分の
空気断熱効果は保持され、暑かつたり、火傷した
りすることなどを防止することができる。 In addition, flexible urethane foam is often used as a heat insulator, but since it is soft, it may be compressed during the heat dissipation of the latent heat storage material, that is, during use, and its thickness may become very small. By using string-like wires that are wired to a sheet-like interlining, there is an air insulation effect equal to the thickness of the heater, and no matter how much pressure is applied, the air insulation effect equal to the thickness of the heater is maintained, and it can be heated and This can help prevent burns, etc.
発明の効果
以上の如く、本発明の蓄熱装置の構成によれ
ば、以下の効果を得ることができる。Effects of the Invention As described above, according to the configuration of the heat storage device of the present invention, the following effects can be obtained.
(1) 潜熱蓄熱材料の蓄熱を完了させるまでの時間
を短縮することができ、使用性が向上する。(1) The time required to complete heat storage in the latent heat storage material can be shortened, improving usability.
(2) 局所的に断熱状態が変わつても、蓄熱材料の
損傷、蓄熱容器の破裂、局部過熱、異常過熱、
発火等なく安全である。(2) Even if the insulation condition changes locally, damage to the heat storage material, rupture of the heat storage container, local overheating, abnormal overheating,
It is safe and does not catch fire.
(3) 長時間蓄熱加熱状態であつても、ほぼ一定温
度の制御を維持でき、信頼性が高い。(3) Even in a heat storage heating state for a long time, almost constant temperature control can be maintained and reliability is high.
(4) サーモスタツトの如く１点制御の簡単な構成
で機能することができる。(4) It can function with a simple one-point control configuration like a thermostat.
第１図は従来の構成を示す構成図、第２図は本
発明の蓄熱装置の一実施例を示す構成図、第３図
は同実施例の主要部分の構成を示す斜視図、第４
図は同実施例の主要部分の構成を示す構成図、第
５図は本発明の蓄熱装置の一実施例の各部の温度
上昇を示す図、第６図は本発明の蓄熱装置の他の
一実施例を示す斜視図である。
１，６……潜熱蓄熱材料、２，７……容器、３
……発熱体、４，８……温度検知体、５……熱伝
導率の大きい基板、９……発熱線固定芯地、１０
……発熱線、１１……断熱体、１３……蓄熱エレ
メント。
FIG. 1 is a block diagram showing a conventional structure, FIG. 2 is a block diagram showing an embodiment of the heat storage device of the present invention, FIG. 3 is a perspective view showing the structure of the main parts of the same embodiment, and FIG.
FIG. 5 is a diagram showing the temperature rise of each part of one embodiment of the heat storage device of the present invention, and FIG. 6 is a diagram showing the configuration of the main parts of the heat storage device of the present invention. It is a perspective view showing an example. 1, 6... Latent heat storage material, 2, 7... Container, 3
... Heating element, 4, 8 ... Temperature sensing element, 5 ... Substrate with high thermal conductivity, 9 ... Heat generating wire fixing interlining, 10
...Heating wire, 11...Insulator, 13...Heat storage element.
Claims (1)
知体と、熱伝導率の大きい基板とを備え、前記基
板の少なくとも一方の面に前記蓄熱体を配し、こ
の蓄熱体の前記基板と反対の面に前記発熱体を位
置させ、前記温度検知体は、前記基板と熱的に結
合させた蓄熱装置。 ２ 蓄熱体は、その中央部を除去した形状とした
特許請求の範囲第１項記載の蓄熱装置。 ３ 蓄熱体は、複数個の小袋に収納された形状と
した特許請求の範囲第１項記載の蓄熱装置。 ４ 発熱体がひも状であり、シート状の基板に配
線された特許請求の範囲第１項記載の蓄熱装置。 ５ 温度検知体は、正の抵抗温度係数を有する素
子（以下PTC素子と記す）であり、前記発熱体
と電気的に直列に接続された特許請求の範囲第１
項記載の蓄熱装置。[Scope of Claims] 1. A heat storage device that utilizes latent heat, a heating element, a temperature sensor, and a substrate with high thermal conductivity, the heat storage device being arranged on at least one surface of the substrate, A heat storage device, wherein the heating element is located on a surface of the heat storage body opposite to the substrate, and the temperature sensing body is thermally coupled to the substrate. 2. The heat storage device according to claim 1, wherein the heat storage body has a shape with its central portion removed. 3. The heat storage device according to claim 1, wherein the heat storage body is housed in a plurality of small bags. 4. The heat storage device according to claim 1, wherein the heating element is string-shaped and wired to a sheet-shaped substrate. 5. The temperature sensing element is an element having a positive temperature coefficient of resistance (hereinafter referred to as a PTC element), and is electrically connected in series with the heating element.
Thermal storage device described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16828584A JPS6145752A (en) | 1984-08-11 | 1984-08-11 | Heat accumulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16828584A JPS6145752A (en) | 1984-08-11 | 1984-08-11 | Heat accumulator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6145752A JPS6145752A (en) | 1986-03-05 |
| JPH0479659B2 true JPH0479659B2 (en) | 1992-12-16 |
Family
ID=15865182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16828584A Granted JPS6145752A (en) | 1984-08-11 | 1984-08-11 | Heat accumulator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6145752A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0740393B2 (en) * | 1985-09-13 | 1995-05-01 | キヤノン株式会社 | Cassette holder |
| JPH02217116A (en) * | 1989-02-18 | 1990-08-29 | Kyowa:Kk | Manufacture of hollow conical steel structure |
-
1984
- 1984-08-11 JP JP16828584A patent/JPS6145752A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6145752A (en) | 1986-03-05 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |