JPS61908B2 - - Google Patents

Info

Publication number
JPS61908B2
JPS61908B2 JP7469081A JP7469081A JPS61908B2 JP S61908 B2 JPS61908 B2 JP S61908B2 JP 7469081 A JP7469081 A JP 7469081A JP 7469081 A JP7469081 A JP 7469081A JP S61908 B2 JPS61908 B2 JP S61908B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7469081A
Other versions
JPS57192252A (en
Inventor
Masahiro Oida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56074690A priority Critical patent/JPS57192252A/ja
Publication of JPS57192252A publication Critical patent/JPS57192252A/ja
Publication of JPS61908B2 publication Critical patent/JPS61908B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP56074690A 1981-05-18 1981-05-18 Method of regenerating electroless copper plating solution Granted JPS57192252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56074690A JPS57192252A (en) 1981-05-18 1981-05-18 Method of regenerating electroless copper plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56074690A JPS57192252A (en) 1981-05-18 1981-05-18 Method of regenerating electroless copper plating solution

Publications (2)

Publication Number Publication Date
JPS57192252A JPS57192252A (en) 1982-11-26
JPS61908B2 true JPS61908B2 (ja) 1986-01-11

Family

ID=13554460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56074690A Granted JPS57192252A (en) 1981-05-18 1981-05-18 Method of regenerating electroless copper plating solution

Country Status (1)

Country Link
JP (1) JPS57192252A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100272017B1 (ko) * 1991-12-03 2000-12-01 요트.게.아. 롤페즈 기판 상의 박막 구조체를 포함하는 복합구조 및 그 제조 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001107258A (ja) * 1999-10-06 2001-04-17 Hitachi Ltd 無電解銅めっき方法とめっき装置および多層配線基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100272017B1 (ko) * 1991-12-03 2000-12-01 요트.게.아. 롤페즈 기판 상의 박막 구조체를 포함하는 복합구조 및 그 제조 방법

Also Published As

Publication number Publication date
JPS57192252A (en) 1982-11-26

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