JPS6188267U - - Google Patents
Info
- Publication number
- JPS6188267U JPS6188267U JP17450984U JP17450984U JPS6188267U JP S6188267 U JPS6188267 U JP S6188267U JP 17450984 U JP17450984 U JP 17450984U JP 17450984 U JP17450984 U JP 17450984U JP S6188267 U JPS6188267 U JP S6188267U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- electrodes
- hole
- wiring patterns
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17450984U JPS6188267U (fr) | 1984-11-16 | 1984-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17450984U JPS6188267U (fr) | 1984-11-16 | 1984-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6188267U true JPS6188267U (fr) | 1986-06-09 |
Family
ID=30732126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17450984U Pending JPS6188267U (fr) | 1984-11-16 | 1984-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6188267U (fr) |
-
1984
- 1984-11-16 JP JP17450984U patent/JPS6188267U/ja active Pending