JPS6186947U - - Google Patents

Info

Publication number

JPS6186947U

JPS6186947U JP17142184U JP17142184U JPS6186947U JP S6186947 U JPS6186947 U JP S6186947U JP 17142184 U JP17142184 U JP 17142184U JP 17142184 U JP17142184 U JP 17142184U JP S6186947 U JPS6186947 U JP S6186947U

Authority

JP

Japan

Prior art keywords

integrated circuit

circuit device

package body

lead terminal

utility

Prior art date

1984-11-12

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005476 soldering Methods 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (3)