JPS6186947U - - Google Patents
Info
- Publication number
- JPS6186947U JPS6186947U JP17142184U JP17142184U JPS6186947U JP S6186947 U JPS6186947 U JP S6186947U JP 17142184 U JP17142184 U JP 17142184U JP 17142184 U JP17142184 U JP 17142184U JP S6186947 U JPS6186947 U JP S6186947U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- package body
- lead terminal
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17142184U JPS6186947U (US06168776-20010102-C00041.png) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17142184U JPS6186947U (US06168776-20010102-C00041.png) | 1984-11-12 | 1984-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6186947U true JPS6186947U (US06168776-20010102-C00041.png) | 1986-06-07 |
Family
ID=30729105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17142184U Pending JPS6186947U (US06168776-20010102-C00041.png) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6186947U (US06168776-20010102-C00041.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06132625A (ja) * | 1992-10-22 | 1994-05-13 | Mitsubishi Electric Corp | 半導体装置 |
| JP2008258009A (ja) * | 2007-04-05 | 2008-10-23 | Smk Corp | 半田付け端子を有する電子部品 |
-
1984
- 1984-11-12 JP JP17142184U patent/JPS6186947U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06132625A (ja) * | 1992-10-22 | 1994-05-13 | Mitsubishi Electric Corp | 半導体装置 |
| JP2008258009A (ja) * | 2007-04-05 | 2008-10-23 | Smk Corp | 半田付け端子を有する電子部品 |
| JP4650769B2 (ja) * | 2007-04-05 | 2011-03-16 | Ｓｍｋ株式会社 | 半田付け端子を有する電子部品 |
