JPS6186939U - - Google Patents
Info
- Publication number
- JPS6186939U JPS6186939U JP1984170470U JP17047084U JPS6186939U JP S6186939 U JPS6186939 U JP S6186939U JP 1984170470 U JP1984170470 U JP 1984170470U JP 17047084 U JP17047084 U JP 17047084U JP S6186939 U JPS6186939 U JP S6186939U
- Authority
- JP
- Japan
- Prior art keywords
- supporting member
- semiconductor
- metal
- semiconductor substrate
- solder layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W74/15—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984170470U JPS6186939U (OSRAM) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984170470U JPS6186939U (OSRAM) | 1984-11-12 | 1984-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6186939U true JPS6186939U (OSRAM) | 1986-06-07 |
Family
ID=30728178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984170470U Pending JPS6186939U (OSRAM) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6186939U (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2020175619A1 (ja) * | 2019-02-28 | 2021-12-16 | 京セラ株式会社 | 電子部品搭載用パッケージ、電子装置及び発光装置 |
-
1984
- 1984-11-12 JP JP1984170470U patent/JPS6186939U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2020175619A1 (ja) * | 2019-02-28 | 2021-12-16 | 京セラ株式会社 | 電子部品搭載用パッケージ、電子装置及び発光装置 |